Reliability Report-IX2113 Qualification No: 2012-014 Reliability Report Reliability Data for IX2113 and P32 Process Report Title: IX2113 and P32 Process Qualification Report Report Number: 2012-014 Date: 6/26/13 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax:1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 1 of 5 Reliability Report-IX2113 Qualification No: 2012-014 Introduction: This report summarizes the Reliability data of IXYS Integrated Circuits Division IX2113. The Reliability data presented here were collected during IXYS IC Division product qualification. The purpose of this qualification was to verify IXYS IC Division Quality and Reliability requirements as outlined in IXYS IC Division internal specifications. The IX2113 is manufactured at IXYS Integrated Circuits Division and assembled at ATEC in the Philippines. The process is IXYS IC Division P32 and IX2113 is available in a 16L SOIC and 14 Pin DIP package type. Reliability Tests: Table 1 below provides the qualification tests that were performed. The stress tests and sample size are chosen based on IXYS IC Division internal specification and with the approval of the product development team and quality assurance. Table 1: IX2113 Reliability Tests Plan Product/ Package IX2113/ 16L SOIC Stress Test HTRB IX2113/ 16L SOIC IX2113G/ 14 Pin DIP IX2113/ 16L SOIC IX2113G/ 14 Pin DIP IX2113/ 16L SOIC HAST IX2113G/ 14 Pin DIP IX2113/ 16L SOIC IX2113G/ 14 Pin DIP IX2113/ 16L SOIC IX2113G/ 14 Pin DIP IX2113/ 16L SOIC MSL Applicable Specs Mil-Std-883 M1005 JESD22-A-108 JESD22A110-C JESD22A110-C J-STD-020D.1 MSL J-STD-020D.1 Thermal Shock (T/S) Thermal Shock (T/S) Temp Cycle (T/C) Temp Cycle (T/C) Hot Storage Hot Storage ESD Mil-Std-883, M1011 130°C, 85% 18.8PSI, 96hrs 130°C, 85% 18.8PSI, 96hrs IR Reflow, Level 1 IR Reflow, Level 1 0 to 100°C, 10/10 dwells, 15 cycles Mil-Std-883, M1011 0 to 100°C, 10/10 dwells, 15 cycles 1 55 55 Mil-Std-883, N1010, “B” -55 to 125°C, 10/10 dwells, 300 cycles 1 55 55 Mil-Std-883, N1010, “B” -55 to 125°C, 10/10 dwells, 300 cycles 1 55 55 JESD22A103-C JESD22A103-C JESD22A114-E 125C, 1000 hrs 1 50 50 125C, 1000 hrs 1 50 50 All Pins, 1.5kΩ, 100pF 1 15 15 HAST Conditions 125°C, 80% WVDC, 1000 hrs # of Sample Total Lots Size (SS) SS 3 110 330 3 78 234 1 100 100 1 50 50 1 50 50 1 55 55 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax:1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 2 of 5 Reliability Report-IX2113 Qualification No: 2012-014 Reliability Test Results: The stress tests and associated results for IX2113 qualification are summarized in Table 2. The devices chosen for the qualification were from standard material manufactured through normal production test flow and electrically tested to datasheet limits prior to stressing. Then reliability stresses were conducted and electrically tested to datasheet limit at each interval and final readpoints. Table 2: IX2113 Reliability Tests Results Product/ Package Stress/ Kits IX2113/ 16L SOIC IX2113/ 16L SOIC IX2113/ 16L SOIC IX2113/ 16L SOIC IX2113/ 16L SOIC IX2113/ 16L SOIC IX2113G/ 14 Pin DIP IX2113/ 16L SOIC HTRB/ TE3237 HTRB/ TE3256 HTRB/ TE3275 HAST/ TE3199 HAST/ TE3237 HAST/ TE3242 HAST/ GGE0028 MSL/ TE3275 IX2113G/ 14 Pin DIP MSL/ GGE0028 IX2113/ 16L SOIC IX2113G/ 14 Pin DIP IX2113/ 16L SOIC IX2113G/ 14 Pin DIP IX2113/ 16L SOIC IX2113G/ 14 Pin DIP TS/ TE3275 TS/ GGE0028 TC/ TE3275 TC/ GGE0028 Hot Storage/ TE3275 Hot Storage/ GGE0028 Readpoint Final / Reject/ SS 1000 hrs. 0/110 1000 hrs. 0/110 1000 hrs. 0/110 96hrs. 0/78 96hrs. 0/78 96hrs. 0/78 96hrs 0/100 IR Reflow Level 1 0/50 IR Reflow Level 1 0/50 15 Cycles 0/55 15 Cycles 0/55 300 Cycles 0/55 300 Cycles 0/55 1000 hrs 0/50 1000 hrs 0/50 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax:1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 3 of 5 Reliability Report-IX2113 Qualification No: 2012-014 ESD Testing Results: As part of this qualification, IX2113 was subjected to Human Body Model (HBM) ESD Sensitivity Classification testing using the KeyTek Zapmaster test system. The results are summarized in Table 3. All samples were electrically tested to data sheet limits before and after ESD stressing and they passed up to +/-350V of HBM. ESD Model HBM Product/ Kit IX2113/ TE3312 Table 3: IX2113 ESD Results Package ESD Test RC Highest Spec Network Passed 16L SOIC JESD22, 1.5kΩ, 100pF +/- 350 V A114-E Class 1A FIT (Failure in Time) Rate of IX2113: Table 4 provides sample size with testing summary for HTRB stress from this qualification. For HTRB, FIT rates were calculated based on the Acceleration Factor (AF) and equivalent device hours at 0.7eV of activation energy at 125°C test temperature and 40°C ambient use temperatures. Using the HAST data, FITs were calculated based on the Acceleration Factor (AF) and equivalent device hours at 0.7eV of activation energy for 130°C test temperature and 40°C use temperatures. The FIT rates came out to be 10.92 and 20.04 FITs for HTRB and HAST, respectively. Table 4: IX2113 FIT Rate Summary Qual Stress Product/ # of # of Hours Equivalent FIT Rate Lot # Test Kits # Devices Fail Tested Dev. Hours @ 60% CL 1 HTRB 1 HAST IX2113/ TE3237 TE3256 TE3275 IX2113/ TE3199 TE3237 TE3242 GGE0028 330 0 1000 84,283,969 10.92 334 0 96 45,908,773 20.04 Conclusion: The qualification of the mask set IX2113 and P32 has completed and has met the FITs rate requirement for release. IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax:1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 4 of 5 Reliability Report-IX2113 Qualification No: 2012-014 Approval: Prepared by: _Martha W. Brandt*_____________________________6/26/13_ Martha W. Brandt Date Quality Engineer Approved by:__Ajit Patel*___________________________________6/27/13_ Ajit Patel Date Product Engineer Approved by: __Ronald P. Clark*____________________________ 6/27/13__ Ronald P Clark Date Director of Quality Approved by: _James Archibald*____________________________ 6/27/13__ James Archibald Date Director, Development Engineering *Signature on File IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax:1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 5 of 5