Package Information

Package Information
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Vishay Siliconix
Thin miniQFN16 Case Outline
B
12
0.10 C
Terminal tip (4)
16 x b
D
A
11
9
9
10
10
11
0.10 M C A B
0.05 M C
12
13
8
8
13
14
7
7
14
6
6
15
5
5
E
15
16
1
2
3
4
16
4
Pin #1 identifier (5)
15 x L
0.10 C
Top view
3
2
L1
1
e
Bottom view
0.10 C
C
A
Seating
plane
0.10 C
A3
Side view
DIMENSIONS
MILLIMETERS (1)
INCHES
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.50
0.55
0.60
0.020
0.022
0.024
A1
0
-
0.05
0
-
0.002
A3
0.15 ref.
b
0.15
D
2.50
e
0.006 ref.
0.20
0.25
0.006
2.60
2.70
0.098
0.40 BSC
E
1.70
1.80
0.008
0.010
0.102
0.106
0.016 BSC
1.90
0.067
0.071
0.075
L
0.35
0.40
0.45
0.014
0.016
0.018
L1
0.45
0.50
0.55
0.018
0.020
0.022
N (3)
16
16
Nd (3)
4
4
(3)
4
4
Ne
Notes
(1) Use millimeters as the primary measurement.
(2) Dimensioning and tolerances conform to ASME Y14.5M. - 1994.
(3) N is the number of terminals. Nd and Ne is the number of terminals in each D and E site respectively.
(4) Dimensions b applies to plated terminal and is measured between 0.15 mm and 0.30 mm from terminal tip.
(5) The pin 1 identifier must be existed on the top surface of the package by using identification mark or other feature of package body.
(6) Package warpage max. 0.05 mm.
ECN: T16-0226-Rev. B, 09-May-16
DWG: 6023
Revision: 09-May-16
Document Number: 64694
1
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