Silicon Technology Reliability Vishay Siliconix VIS BCD PROCESS TECHNOLOGY 200901 to 201103 Sample Size Equivalent Device Hours Failure Rate in FIT 492 32 101 167 28.348 Failure Rate in FIT is calculated according to JEDEC standard JESD85, Methods for Calculating Failure Rates in Units of FITs, based on accelerated high temperature operating life test results by using an apparent activation energy of 0.7 eV. The junction temperature of the device at use is assumed to be 55 °C. A constant failure rate distribution is assumed. The upper confidence bound of the failure rate is 60 %. Document Number: 67870 Revision: 31-Mar-11 www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000