Reliability Report

AOS Semiconductor
Product Reliability Report
AOD403 / AOI403,
rev C
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOD403 /AOI403.
Accelerated environmental tests are performed on a specific sample size, and then followed by
electrical test at end point. Review of final electrical test result confirms that AOD403 /AOI403
passes AOS quality and reliability requirements. The released product will be categorized by the
process family and be monitored on a quarterly basis for continuously improving the product
quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOD403/AOI403 uses advanced trench technology to provide excellent RDS(ON), low gate
charge and low gate resistance. With the excellent thermal resistance of the DPAK/IPAK package,
this device is well suited for high current load applications.
-RoHS Compliant
-Halogen-Free
Details refer to the datasheet.
II. Die / Package Information:
AOD403 / AOI403
Standard sub-micron
30V P-Channel MOSFET
Package Type
TO252 / TO251A
Lead Frame
Bare Cu
Die Attach
Soft solder
Bonding
Al & Au wire
Mold Material
Epoxy resin with silica filler
Moisture Level
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
Process
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III. Result of Reliability Stress for AOD403 / AOI403
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
HTGB
HTRB
Temp = 150°c ,
Vds=80% of
Vdsmax
Lot
Attribution
15 lots
168hrs
500 hrs
1000 hrs
168hrs
500 hrs
1000 hrs
6 lot
5 lot
(Note A*)
Total
Sample size
0
JESD22A113
462pcs
0
JESD22A108
0
JESD22A108
660pcs
0
JESD22A110
0
JESD22A102
0
JESD22A104
77 pcs / lot
462pcs
6 lot
5 lot
(Note A*)
77 pcs / lot
130 °c , 85%RH,
33.3 psi, Vgs =
100% of Vgs max
100 hrs
12 lots
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hrs
(Note A*)
12lots
55 pcs / lot
924pcs
(Note A*)
77 pcs / lot
-65°c to 150°c ,
air to air,
250 / 500
cycles
15 lots
(Note A*)
Reference
Standard
2739pcs
HAST
Temperature
Cycle
Number
of
Failures
1155pcs
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3
MTTF = 39656 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOD403/AOI403). Failure Rate Determination is based on
JEDEC Standard JESD 85. FIT means one failure per billion hours.
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9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
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= 1.83 x 10 / [2x (12x77x500+10x77x1000) x258] = 3
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MTTF = 10 / FIT = 3.47 x 10 hrs = 39656 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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