Reliability Report

AOS Semiconductor
Product Reliability Report
AOD4185,
rev C
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOD4185. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOD4185 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOD4185 uses advanced trench technology to provide excellent RDS(ON) and low gate
charge. With the excellent thermal resistance of the DPAK package, this device is well suited for high
current applications.
-RoHS Compliant
-Halogen Free
Details refer to the datasheet.
II. Die / Package Information:
AOD4185
Standard sub-micron
Low voltage P channel process
Package Type
TO252
Lead Frame
Bare Cu
Die Attach
Soft solder
Bonding
Al & Au wire
Mold Material
Epoxy resin with silica filler
Moisture Level
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
Process
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III. Result of Reliability Stress for AOD4185
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°
c
/85%RH +3 cycle
[email protected]°
c
Temp = 150°
c,
Vgs=100% of
Vgsmax
-
9 lots
1210pcs
0
JESD22A113
168hrs
500 hrs
1000 hrs
2 lots
3 lots
385pcs
0
JESD22A108
0
JESD22A108
495pcs
0
JESD22A110
0
JESD22A102
0
JESD22A104
HTGB
Lot
Attribution
Total
Sample size
Number
of
Failures
Reference
Standard
77 pcs / lot
HTRB
Temp = 150°
c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
2 lots
1 lot
231pcs
77 pcs / lot
HAST
Pressure Pot
Temperature
Cycle
130 +/- 2°
c,
85%RH, 33.3 psi,
Vgs = 100% of
Vgs max
121°
c , 29.7psi,
RH=100%
100 hrs
9 lots
96 hrs
(Note A*)
5 lots
55 pcs / lot
275pcs
(Note A*)
55 pcs / lot
-65°
c to 150°
c,
air to air,
250 / 500
cycles
8 lots
(Note A*)
440pcs
55 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 17
MTTF = 6622 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOD4185). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
2
9
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
7
MTTF = 10 / FIT = 5.80 x 10 hrs = 6622 years
/ [2x (4x77x168+4x77x500) x258] = 17
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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