Reliability Report

AOS Semiconductor
Product Reliability Report
AOD4189,
rev C
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOD4189. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOD4189 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOD4189 uses advanced trench technology and design to provide excellent RDS(ON) with low
gate charge. With the excellent thermal resistance of the DPAK package, this device is well
suited for high current load applications.
-RoHS Compliant
-Halogen-Free
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bonding
Mold Material
Moisture Level
AOD4189
Standard sub-micron
P-Channel MOSFET
TO252
Bare Cu
Soft solder
Al & Au wire
Epoxy resin with silica filler
Up to Level 1
2
III. Result of Reliability Stress for AOD4189
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
HTGB
HTRB
Temp = 150°c ,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
168hrs
500 hrs
1000 hrs
Lot
Attribution
Total
Sample size
3003pcs
0
JESD22A113
3 lots
3 lots
5 lots
(Note A*)
924pcs
0
JESD22A108
3 lots
3 lots
5 lots
(Note A*)
847pcs
0
JESD22A108
847pcs
0
JESD22A110
0
JESD22A102
0
JESD22A104
77 pcs / lot
77 pcs / lot
130 °c , 85%RH,
33.3 psi, Vgs =
100% of Vgs max
96 hrs
12 lots
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hrs
(Note A*)
12lots
77 pcs / lot
924pcs
(Note A*)
77 pcs / lot
-65°c to 150°c ,
air to air,
250 / 500
cycles
Reference
Standard
15 lots
HAST
Temperature
Cycle
Number
of
Failures
15 lots
(Note A*)
1155pcs
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3.27
MTTF = 34926 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOD4189). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
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= 1.83 x 10 / [2x (6x77x168 +6x77x500 +10x77x1000) x259] = 3.27
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MTTF = 10 / FIT = 3.27 x 10 hrs = 34926 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
259
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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