Reliability Report

AOS Semiconductor
Product Reliability Report
AOI4185,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOI4185. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOI4185 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOI4185 uses advanced trench technology to provide excellent RDS(ON) and low gate charge. With
the excellent thermal resistance of the IPAK (TO251A) package, this device is well suited for high
current applications.
-RoHS Compliant
-Halogen Free
Detailed refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Moisture Level
AOI4185
Standard sub-micron
Low voltage P channel process
3 leads TO251A
Bare Cu
Soft solder
Al & Au wire
Epoxy resin with silica filler
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
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III. Result of Reliability Stress for AOI4185
Test Item
Test Condition
Time
Point
Lot
Attribution
Total
Sample
size
Number
of
Failures
Solder
Reflow
Precondition
HTGB
168hr 85°°c
/85%RH +3 cycle
[email protected]°°c
Temp = 150°°c ,
Vgs=100% of
Vgsmax
-
3 lots
495pcs
0
JESD22A113
168hrs
500 hrs
1000 hrs
77pcs
0
1 lot
JESD22A108
0
JESD22A108
0
JESD22A110
0
JESD22A102
0
JESD22A104
(Note A*)
HTRB
Temp = 150°°c ,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
130 +/- 2°°c ,
85%RH, 33.3 psi,
Vgs = 80% of Vgs
max
121°°c , 29.7psi,
RH=100%
100 hrs
Pressure Pot
-65°°c to 150°°c ,
air to air
250 /
500
cycles
77pcs
3 lots
(Note A*)
96 hrs
3 lots
(Note A*)
Temperature
Cycle
77 pcs / lot
1 lot
(Note A*)
HAST
Standard
3 lots
(Note A*)
77 pcs / lot
165pcs
55 pcs / lot
165pcs
55 pcs / lot
165pcs
55 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 46
MTTF = 2478 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOI4185). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
2
9
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
7
MTTF = 10 / FIT = 2.17 x 10 hrs = 2478 years
/ [2x2x77x500x258] = 46
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s )]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10 -5eV / K
3