HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 1. PART NO. EXPRESSION : L811HW-1R0MF(a) (b) (c) (d)(e) (f) (a) Series code (d) Tolerance code : M = ±20% (b) Type code (e) F : RoHS Compliant (c) Inductance code : 1R0 = 1.0uH (f) 11 ~ 99 : Internal controlled number 2. CONFIGURATION & DIMENSIONS : A' C' A C D L E B' B SWORLD R36 H G PCB Pattern Unit:m/m A' A B' B C' C D E G H L 11.8 Max. 10.2±0.5 10.5 Max. 10.0±0.5 4.2 Max. 4.0 Max. 2.2±0.5 2.9±0.5 5.4 Ref. 4.5 Ref. 12.4 Ref. 3. SCHEMATIC : 4. MATERIALS : a b (a) Core (b) Wire (c) Terminal c 5. FEATURES : a) Shielded Construction b) Frequency up to 5MHz NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 6. GENERAL SPECIFICATION : a) Test Freq. : 100KHz/1.0VDC; Q : 100KHz/1.0VDC b) Ambient Temp. : 20°C c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -55°C to +125°C e) Humidity Range : 50 ~ 60% RH f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss. g) Saturation Current (Isat) : Will cause L 0 to drop approximately 20% typ. h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. 7. ELECTRICAL CHARACTERISTICS : Inductance L0 ( µH ) ±20% @ 0 Adc Irms (A) Typ. Isat (A) Typ. DCR ( mȍ ) Max. Q Min. L811HW-R22MF- 0.22 32 40 1.4 18 L811HW-R36MF- 0.36 28 40 1.4 18 L811HW-R47MF- 0.47 26 38 1.6 18 L811HW-R56MF- 0.56 25 36 1.9 18 L811HW-R68MF- 0.68 23 32 2.4 18 L811HW-1R0MF- 1.00 20 28 3.5 20 L811HW-1R5MF- 1.50 12 20 7.5 20 L811HW-2R2MF- 2.20 11.5 16.5 8.56 20 L811HW-3R3MF- 3.30 10.0 14 10.0 20 L811HW-4R7MF- 4.70 8.0 13 13.5 20 L811HW-6R8MF- 6.80 6.5 11 24.0 20 L811HW-100MF- 10.00 5.0 9 35.0 20 Part No. NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 8. CHARACTERISTICS CURVES : INDUCTANCE VS. FREQUENCY Q VS. FREQUENCY INDUCTANCE VS. DC CURRENT TEMP. RISE VS. DC CURRENT NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 8. CHARACTERISTICS CURVES : L811HW-R36MF SL811HW-R36MF- MPI1004HW-R36 L811HW-R22MF- 0.8 100 100 90 90 80 0.2 60 0.15 50 40 0.1 30 80 20 0.05 INDUCT ANCE (uH) 70 TEMP RISE (°C 0.6 70 60 0.4 50 40 30 0.2 20 10 0 10 0 10 20 32 40 0 0 8 16 24 32 40 DC CURRENT(A) DC CURRENT (A) L811HW SL811HW-R47MF- MPI1 004H-R47MF W-R 47 L811HW-R56MF- L811HW-R56MF SM PI1004H W-R 56 100 1 1 100 90 0.6 60 50 0.4 40 30 0.2 80 I ND UCT ANCE (uH ) 70 T EM P. RISE( oC) INDUCTANCE (uH) 90 80 0.8 0.75 70 60 0.5 50 40 30 0.25 20 20 10 0 10 0 0 0 8 16 24 32 0 0 40 7.6 15.2 22.8 30.4 38 DC CUR RENT (A) DC CURREN T(A) L811HW-1R0MF- L811HW-1R0MF SM PI1004HW-1R 0 L811HW-R68MF- L811HW -R68MF SM PI10 04 H W-R6 8 1 00 1.6 100 0.8 90 90 80 70 60 0.4 50 40 30 0.2 I ND UCT A NCE (uH ) 0.6 T EM P. RISE( oC) INDUCT ANCE (uH) 80 1.2 70 60 50 0.8 40 30 0.4 20 20 10 10 0 0 0 6.6 13.2 19 .8 T EM P. R IS E( oC) 0 0 26.4 33 T EM P. R IS E ( oC) INDUCTANCE(uH) INDUCTANCE (u 0.25 TEMP. RISE(oC) 0.3 0 0 0 DC CU RR ENT (A) 6 12 18 24 30 DC CU RR EN T(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 8. CHARACTERISTICS CURVES : L811HW-2R2MF- L811HW -2R2M F SMPI1004HW-2R2 L811HW-1R5MF- -1R5MF SL811HW MPI 100 4H W-1 R5 4 100 100 90 90 3.2 70 1.8 60 50 1.2 40 30 0.6 INDUCTANCE (uH) 80 T EM P. RISE( oC) 80 70 2.4 60 50 1.6 40 30 0.8 20 20 10 10 0 0 0 4 .4 8.8 13.2 17.6 0 0 22 4.8 9.6 14.4 19.2 DC CURRENT(A) DC CURREN T(A ) L811HW-4R7MF- -4R7MF S L811HW MPI1004 HW -4 R7 L811HW-3R3MF- L811HW -3R3MF S M PI1004H W-3R3 6 100 100 6.4 90 90 80 3.6 60 50 2.4 40 30 1.2 80 INDUCT ANCE (uH) 70 TEM P. RISE(oC) INDUCT ANCE (uH) 4.8 4.8 70 60 3.2 50 40 30 1.6 20 20 10 0 10 0 0 4 8 24 12 0 16 0 0 2.8 D C CUR RENT (A) 5.6 8.4 11.2 14 DC CURRE NT(A) L811HW-100MF- SL811HW-100MF MP I1004H W-100 L811HW SL811HW-6R8MF- M PI1004H-6R8MF W-6R8 12 100 12 100 90 90 9.6 70 7.2 60 50 4.8 40 30 2.4 20 INDUCT ANCE (uH) 80 T EM P. RISE(oC) INDUCT ANCE (uH) 9.6 80 70 7.2 60 50 4.8 40 30 2.4 20 10 0 0 0 2.2 4.4 6 .6 DC CURRE NT(A ) T EM P. RISE(oC) 0 8.8 11 T EM P. RISE( oC) INDUCTANCE (uH) 2.4 TEMP. RISE(oC) 3 10 0 0 0 1.8 3.6 5.4 7.2 9 DC CU RR ENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 9. CORE LOSS : 100KHz and 500KHz 40000 material gauss loss K W /3m3 K W /m 30000 20000 500KHZ 10000 100KHZ 0 0 200 400 600 800 1000 gauss gauss 100KHz 500KHz 100 - 266 200 - 1,234 300 351.7 2,932 400 665.9 5,195 500 1,039 8,336 600 1,471 12,025 700 1,923 15,715 800 2,537 20,444 900 3,148 25,429 1000 3,902 31,002 100KHz 4000 material gauss loss KKW /3m3 W /m 3000 2000 1000 0 200 400 600 800 1000 gau ss gauss 100KHz 300 351.7 400 665.9 500 1,039 600 1,471 700 1,923 800 2,537 900 3,148 1000 3,902 500KHz 40000 KW W /m K /m 3 3 30000 20000 10000 0 0 200 400 600 800 1000 g au ss gauss NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 10. RELIABILITY AND TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Inductance Refer to standard electrical characteristics list HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. DCR CH16502, Agilent33420A Micro-Ohm Meter. Heat Rated Current (Irms) Irms(A) will cause the coil temperature rise approximately ǻT=40°C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Saturation Current (Isat) Isat(A) will cause Lo to drop approximately 20% typ. Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245°C 150°C Solder Heat Resistance 60 seconds Natural cooling 4±1 seconds 1. Appearance : No significant abnormality 2. Inductance change : Within ±20% Preheating 150°C Dipping Natural cooling 260°C 60 seconds Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 245±5°C Flux for lead free : rosin Dip Time : 4±1sec. Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. 10±0.5 seconds Reliability Test High Temperature Life Test Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Low Temperature Life Test 1. Appearance : No damage Thermal Shock 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : -55±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step Temperature (°C) 1 -55±3 30±3 2 Room Temperature Within 3 Times (min.) 3 +125±3 30±3 4 Room Temperature Within 3 Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Random Vibration Test Appearance : Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 11. SOLDERING AND MOUNTING : 11-1. Recommended PC Board Pattern 5.4 3.5 4.5 3.5 11-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 11-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 11-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Soldering 10s max. Natural cooling 250~260 230 180 150 60~120s 30~60s Preheating TEMPERATURE °C TEMPERATURE °C Preheating 280 Soldering Natural cooling 260 150 Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 12. PACKAGING INFORMATION : 12-1. Reel Dimension COVER TAPE ØC B D 2.0±0.5 A EMBOSSED CARRIER Type A(mm) B(mm) C(mm) D(mm) 13" x 24mm 24.0±0.5 100±2.0 13.5±0.5 330 Ø1.5+0.1 2.0±0.1 t P 0.15 MIN Bo W F 4.0±0.1 1.75±0.1 12-2 Tape Dimension Ko Ao Series Ao(mm) Bo(mm) Ko(mm) P(mm) W(mm) F(mm) t(mm) L811HW 10.5±0.1 11.8±0.1 4.5±0.1 16.0±0.1 24.0±0.3 11.5±0.1 0.35±0.05 12-3. Packaging Quantity Size L811HW Chip / Reel 900 Inner Box 1800 Carton 7200 NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9 HIGH CURRENT MOLDED POWER INDUCTORS L811HW SERIES 12-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (°C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 30.08.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 10