46B CY7C346B 128-Macrocell MAX® EPLD Features The 128 macrocells in the CY7C346B are divided into eight LABs, 16 per LAB. There are 256 expander product terms, 32 per LAB, to be used and shared by the macrocells within each LAB. • • • • 128 macrocells in eight logic array blocks (LABs) 20 dedicated inputs, up to 64 bidirectional I/O pins Programmable interconnect array Advanced 0.65-micron CMOS technology to increase performance • Available in 84-pin CLCC, PLCC, and 100-pin PGA, PQFP Each LAB is interconnected through the programmable interconnect array, allowing all signals to be routed throughout the chip. Functional Description The CY7C346B is an Erasable Programmable Logic Device (EPLD) in which CMOS EPROM cells are used to configure logic functions within the device. The MAX® architecture is 100% user-configurable, allowing the device to accommodate a variety of independent logic functions. The speed and density of the CY7C346B allow it to be used in a wide range of applications, from replacement of large amounts of 7400-series TTL logic, to complex controllers and multifunction chips. With greater than 25 times the functionality of 20-pin PLDs, the CY7C346B allows the replacement of over 50 TTL CY7C346B. By replacing large amounts of logic, the CY7C346B reduces board space, part count, and increases system reliability. Logic Block Diagram . 1 (C7) [16] . 78 (A10) [9] . 79 (B9) [10] 80 (A9) [11] . 83 (A8) [14] . 84 (B7) [15] . 2 (A7) [17] . 5 (C6) [20] . 6 (A5) [21] . 7 (B5) [22] INPUT [59] INPUT [60] INPUT [61] INPUT [64] INPUT [65] INPUT [66] INPUT [67] INPUT [70] INPUT [71] INPUT [72] . INPUT/CLK ..... INPUT ..... INPUT ..... INPUT ..... INPUT ..... INPUT ..... INPUT ..... INPUT ..... INPUT INPUT ..... (N4) (M5) (N5) (N6) (M7) (L7) (N7) (L8) (N9) (M9) . . . . . . . . . . 36 37 38 41 42 43 44 47 48 49 SYSTEM CLOCK 8 (B13) [1] 9 (C12) [2] 10 (A13) [3] 11 (B12) [4] 12 (A12) [5] 13 (11) [6] NC (A11) [7] NC (B10) [8] LAB A MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL LAB H MACROCELL 120 MACROCELL 119 MACROCELL 118 MACROCELL 117 MACROCELL 116 MACROCELL 115 MACROCELL 114 MACROCELL 113 1 2 3 4 5 6 7 8 MACROCELL 121–128 MACROCELL 9–16 14 (A4) 15 (B4) 16 (A3) 17 (A2) 18 (B3) 21 (A1) NC (B2) NC (B1) [23] [24] [25] [26] [27] [28] [29] [30] LAB B MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL LAB G MACROCELL 104 MACROCELL 103 MACROCELL 102 MACROCELL 101 MACROCELL 100 MACROCELL 99 MACROCELL 98 MACROCELL 97 17 18 19 20 21 22 23 24 MACROCELL 25–32 22 (C2) [31] 25 (C1) [32] 26 (D2) [33] 27 (D1) [34] 28 (E2) [35] 29 (E1) [36] NC (F1) [39] NC (G2) [40] LAB C MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL LAB F MACROCELL 88 MACROCELL 87 MACROCELL 86 MACROCELL 85 MACROCELL 84 MACROCELL 83 MACROCELL 82 MACROCELL 81 MACROCELL 86–96 33 34 35 36 37 38 39 40 LAB D (G12) NC (H13) NC (J13) 71 (J12) 70 (K13) 69 (K12) 68 (L13) 67 (L12) 64 [80] [79] [78] [77] [76] [75] [74] [73] (M13) (M12) (N13) (M11) (N12) (N11) (M10) (N10) [58] [57] [56] [55] [54] [53] [52] [51] (M4) NC (N3) NC (M3) 55 (N2) 54 (M2) 53 (N1) 52 (L2) 51 (M1) 50 NC NC 63 60 59 58 57 56 LAB E MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL 49 50 51 52 53 54 55 56 MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL [18, 19, 43, 44, 68, 69, 93, 94] VCC 16, 33, 50, 67 (B8,C8,F2,F3,H11,H12,L6,M6) [12, 13, 37, 38, 62, 63, 87, 88] GND • 72 71 70 69 68 67 66 65 MACROCELL 73– 80 MACROCELL 57– 64 3, 20, 37, 54 (A6,B6,F12,F13,H1,H2,M8,N8) Cypress Semiconductor Corporation Document #: 38-03037 Rev. *B [90] [89] [86] [85] [84] [83] [82] [81] MACROCELL 105–112 P I A MACROCELL 41–48 30 (G3) [41] 31 (G1) [42] 32 (H3) [45] 33 (J1) [46] 34 (J2) [47] 35 (K1) [48] NC (K2) [49] NC (L1) [50] [100] (C13) NC [99] (D12) NC [98] (D13) 77 [97] (E12) 76 [96] (E13) 75 [95] (F11) 74 [92] (G13) 73 [91] (G11) 72 3901 North First Street () – PERTAIN TO 100-PIN PGA PACKAGE [ ] – PERTAIN TO 100-PIN PQFP PACKAGE • San Jose • CA 95134 • 408-943-2600 Revised December 28, 2002 CY7C346B Selection Guide 7C346B-25 7C346B-35 Unit 25 35 ns Maximum Access Time Pin Configurations 11 10 9 8 7 6 I/O I/O I/O I/O INPUT INPUT INPUT GND GND PGA Bottom View INPUT INPUT INPUT/CLK INPUT INPUT V CC V CC INPUT INPUT I/O I/O I/O I/O PLCC/CLCC Top View 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 74 I/O I/O 12 13 73 I/O I/O I/O 14 15 72 I/O I/O I/O 16 I/O I/O GND 17 18 19 69 GND 20 21 66 65 22 VCC 23 VCC I/O 24 25 26 I/O I/O I/O 71 70 68 INP GND INP VCC INP I/O I/O I/O I/O L I/O I/O I/O I/O K I/O I/O I/O I/O I/O I/O I/O GND INP F GND I/O E I/O I/O I/O D I/O I/O 54 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 I/O I/O 32 I/O I/O I/O I/O 55 INPUT I/O I/O GND GND 31 INPUT I/O I/O I/O INPUT V CC V CC INPUT I/O G 56 INPUT M I/O GND 30 INPUT I/O 63 62 29 INPUT I/O VCC I/O I/O I/O INPUT GND GND I/O 64 I/O INPUT I/O I/O 58 57 I/O INP INP INP VCC INP VCC VCC 27 INPUT INP H I/O I/O I/O I/O I/O J 60 59 Document #: 38-03037 Rev. *B I/O I/O VCC 61 28 I/O I/O I/O I/O 67 7C346B I/O N I/O I/O I/O I/O I/O I/O INP GND GND 7C346B I/O I/O I/O I/O VCC VCC I/O I/O I/O I/O I/O I/O INP INP GND /CLK C I/O I/O B I/O I/O I/O I/O INP VCC INP GND INP A I/O I/O I/O I/O INP VCC INP 1 2 3 4 5 6 7 I/O I/O I/O I/O I/O INP INP INP I/O I/O I/O 9 11 12 13 8 10 Page 2 of 16 CY7C346B Pin Configurations (continued) 87 86 85 84 83 I/O I/O I/O I/O I/O I/O GND 100 99 98 97 96 95 94 93 92 91 90 89 88 GND I/O I/O I/O CC I/O V I/O VCC I/O I/O I/O I/O I/O PQFP Top View 82 81 I/O 1 2 80 79 I/O I/O I/O 3 78 I/O I/O 4 I/O I/O 5 77 76 I/O 6 75 I/O I/O 7 74 I/O I/O 8 73 I/O INPUT 9 72 INPUT 10 71 INPUT INPUT 11 70 GND 12 INPUT VCC GND 13 69 68 INPUT INPUT CY7C346B I/O I/O VCC 14 67 INPUT INPUT 15 66 INPUT INPUT/CLK 16 65 INPUT INPUT 17 64 INPUT VCC 18 63 GND VCC 19 62 INPUT 20 GND INPUT INPUT 21 61 60 INPUT 22 59 INPUT I/O 23 58 I/O I/O 24 57 I/O I/O 25 56 I/O I/O 26 55 I/O I/O 27 54 I/O I/O 28 I/O 29 I/O 30 53 INPUT I/O 52 I/O 51 I/O Document #: 38-03037 Rev. *B I/O I/O I/O I/O I/O I/O VCC VCC I/O I/O I/O I/O GND I/O GND I/O I/O I/O I/O I/O 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Page 3 of 16 CY7C346B Logic Array Blocks Externally, the CY7C346B provides 20 dedicated inputs, one of which may be used as a system clock. There are 64 I/O pins that may be individually configured for input, output, or bidirectional data flow. There are eight logic array blocks in the CY7C346B. Each LAB consists of a macrocell array containing 16 macrocells, an expander product term array containing 32 expanders, and an I/O block. The LAB is fed by the programmable interconnect array and the dedicated input bus. All macrocell feedbacks go to the macrocell array, the expander array, and the programmable interconnect array. Expanders feed themselves and the macrocell array. All I/O feedbacks go to the programmable interconnect array so that they may be accessed by macrocells in other LABs as well as the macrocells in the LAB in which they are situated. Programmable Interconnect Array The Programmable Interconnect Array (PIA) solves interconnect limitations by routing only the signals needed by each logic array block. The inputs to the PIA are the outputs of every macrocell within the device and the I/O pin feedback of every pin on the device. EXPANDER DELAY tEXP REGISTER LOGIC ARRAY CONTROL DELAY tCLR tLAC tPRE INPUT INPUT DELAY tIN LOGIC ARRAY DELAY tLAD tRSU tRH OUTPUT DELAY OUTPUT tRD tCOMB tLATCH tOD tXZ tZX SYSTEM CLOCK DELAY tICS PIA DELAY tPIA CLOCK DELAY tIC FEEDBACK DELAY tFD I/O DELAY tIO C346B–9 Figure 1. CY7C346B Internal Timing Model Design Recommendations Operation of the devices described herein with conditions above those listed in the “Maximum Ratings” section of this datasheet may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure to absolute maximum ratings conditions for extended periods of time may affect device reliability. The CY7C346B contains circuitry to protect device pins from high static voltages or electric fields, but normal precautions should be taken to avoid application of any voltage higher than the maximum rated voltages. For proper operation, input and output pins must be constrained to the range GND ≤ (VIN or VOUT) ≤ VCC. Unused inputs must always be tied to an appropriate logic level (either VCC or GND). Each set of VCC and GND pins must Document #: 38-03037 Rev. *B be connected directly at the device. Power supply decoupling capacitors of at least 0.2 µF must be connected between VCC and GND. For the most effective decoupling, each VCC pin should be separately decoupled to GND directly at the device. Decoupling capacitors should have good frequency response, such as monolithic ceramic types have. Design Security The CY7C346B contains a programmable design security feature that controls the access to the data programmed into the device. If this programmable feature is used, a proprietary design implemented in the device cannot be copied or retrieved. This enables a high level of design control to be obtained since programmed data within EPROM cells is invisible. The bit that controls this function, along with all other Page 4 of 16 CY7C346B program data, may be reset simply by erasing the entire device. Timing Considerations The CY7C346B is fully functionally tested and guaranteed through complete testing of each programmable EPROM bit and all internal logic elements thus ensuring 100% programming yield. Unless otherwise stated, propagation delays do not include expanders. When using expanders, add the maximum expander delay tEXP to the overall delay. Similarly, there is an additional tPIA delay for an input from an I/O pin when compared to a signal from straight input pin. The erasable nature of these devices allows test programs to be used and erased during early stages of the production flow. The devices also contain on-board logic test circuitry to allow verification of function and AC specification once encapsulated in non-windowed packages. Typical ICC vs. fMAX When calculating external asynchronous frequencies, use tAS1 if all inputs are on the dedicated input pins. 400 ICC ACTIVE (mA) Typ. When calculating synchronous frequencies, use tSU if all inputs are on dedicated input pins. When expander logic is used in the data path, add the appropriate maximum expander delay, tEXP to tSU. Determine which of 1/(tWH + tWL), 1/tCO1, or 1/(tEXP + tSU) is the lowest frequency. The lowest of these frequencies is the maximum data path frequency for the synchronous configuration. When expander logic is used in the data path, add the appropriate maximum expander delay, tEXP to tAS1. Determine which of 1/(tAWH + tAWL), 1/tACO1, or 1/(tEXP + tAS1) is the lowest frequency. The lowest of these frequencies is the maximum data path frequency for the asynchronous configuration. 300 VCC = 5.0V Room Temp. 200 100 0 100 Hz 1 kHz 10 kHz 100 kHz 1 MHz 10 MHz MAXIMUM FREQUENCY 50 MHz The parameter tOH indicates the system compatibility of this device when driving other synchronous logic with positive input hold times, which is controlled by the same synchronous clock. If tOH is greater than the minimum required input hold time of the subsequent synchronous logic, then the devices are guaranteed to function properly with a common synchronous clock under worst-case environmental and supply voltage conditions. C346B–10 IO OUTPUT CURRENT (mA) TYPICAL Output Drive Current 250 IOL 200 VCC = 5.0V Room Temp. 150 100 IOH 50 0 1 2 3 4 VO OUTPUT VOLTAGE (V) Document #: 38-03037 Rev. *B 5 C346B–11 Page 5 of 16 CY7C346B DC Output Current per Pin[1] .................... –25 mA to+25 mA Maximum Ratings DC Input Voltage[1] ........................................–2.0V to + 7.0V (Above which the useful life may be impaired. For user guidelines, not tested.) Operating Range[2] Storage Temperature ................................. –65°C to+135°C Range Ambient Temperature with Power Applied............................................. –65°C to+135°C Ambient Temperature 0°C to +70°C 5V ± 5% –40°C to +85°C 5V ± 10% Commercial Maximum Junction Temperature (under bias).................................................................. 150°C Industrial VCC Supply Voltage to Ground Potential[1] ............. –2.0V to+7.0V Electrical Characteristics Over the Operating Range Parameter VCC Description Test Conditions Supply Voltage Maximum VCC rise time is 10 ms [3] VOH Output HIGH Voltage IOH = –4 mA DC VOL Output LOW Voltage IOL = 8 mA DC[3] VIH Input HIGH Voltage VIL Input LOW Voltage IIX Input Current IOZ Output Leakage Current tR tF Min. Max. Unit 4.75(4.5) 5.25(5.5) V 2.4 V 0.45 V 2.0 VCC +0.3 V –0.3 0.8 V VI = VCC or ground –10 +10 µA VO = VCC or ground –40 +40 µA Recommended Input Rise Time 100 ns Recommended Input Fall Time 100 ns Capacitance Parameter Description Test Conditions Max. Unit CIN Input Capacitance VIN = 0V, f = 1.0 MHz 10 pF COUT Output Capacitance VOUT = 0V, f = 1.0 MHz 20 pF AC Test Loads and Waveforms R1 464Ω R1 464Ω 5V 5V OUTPUT ALL INPUT PULSES OUTPUT R2 250Ω 50 pF INCLUDING JIG AND SCOPE (a) 3.0V R2 250Ω 5 pF INCLUDING JIG AND SCOPE 10% GND ≤ 6 ns 90% 90% 10% ≤ 6 ns (b) Equivalent to: THÉVENIN EQUIVALENT (commercial/military) 163Ω OUTPUT 1.75V Notes: 1. Minimum DC input is –0.3V. During transactions, the inputs may undershoot to –2.0V or overshoot to 7.0V for input currents less then 100 mA and periods shorter than 20 ns. 2. The Voltage on any input or I/O pin cannot exceed the power pin during power-up. 3. The IOH parameter refers to high-level TTL output current; the IOL parameter refers to low-level TTL output current. Document #: 38-03037 Rev. *B Page 6 of 16 CY7C346B Commercial and Industrial External Synchronous Switching Characteristics Over Operating Range 7C346B-25 Parameter Description Min. Delay[4] tPD1 Dedicated Input to Combinatorial Output tPD2 I/O Input to Combinatorial Output Delay[4] tSU Global Clock Set-Up Time Max. Max. Unit 25 35 ns 40 55 ns 15 Delay[4] 7C346B-35 Min. 25 tCO1 Synchronous Clock Input to Output tH Input Hold Time from Synchronous Clock Input 0 0 ns tWH Synchronous Clock Input HIGH Time 8 12.5 ns tWL Synchronous Clock Input LOW Time 8 12.5 ns 62.5 40 MHz [5] fMAX Maximum Register Toggle Frequency tCNT Minimum Global Clock Period tODH Output Data Hold Time After Clock fCNT Maximum Internal Global Clock 14 ns 20 20 Frequency[6] ns 30 ns 2 2 ns 50 33.3 MHz Commercial and Industrial External Asynchronous Switching Characteristics Over Operating Range 7C346B-25 Parameter Description Min. Delay[4] Max. 7C346B-35 Min. 25 Max. Unit 35 ns tACO1 Asynchronous Clock Input to Output tAS1 Dedicated Input or Feedback Set-Up Time to Asynchronous Clock Input 5 10 ns tAH Input Hold Time from Asynchronous Clock Input 6 10 ns Asynchronous Clock Input HIGH Time[7] 11 16 ns tAWL Asynchronous Clock Input LOW Time[7] 9 14 ns tACNT Minimum Internal Array Clock Frequency tAWH fACNT Maximum Internal Array Clock Frequency 20 [6] 50 30 33.3 ns MHz Notes: 4. C1 = 35 pF. 5. The fMAX values represent the highest frequency for pipeline data. 6. This parameter is measured with a 16-bit counter programmed into each LAB. 7. This parameter is measured with a positive-edge-triggered clock at the register. For negative-edge clocking, the tACH and tACL parameter must be swapped. Document #: 38-03037 Rev. *B Page 7 of 16 CY7C346B Commercial and Industrial Internal Switching Characteristics Over Operating Range 7C346B-25 Parameter Description Min. Max. 7C346B-35 Min. Max. Unit tIN Dedicated Input Pad and Buffer Delay 5 11 ns tIO I/O Input Pad and Buffer Delay 6 11 ns tEXP Expander Array Delay 12 20 ns tLAD Logic Array Data Delay 12 14 ns tLAC Logic Array Control Delay 10 13 ns tOD Output Buffer and Pad Delay[4] 5 6 ns tZX [4] Output Buffer Enable Delay 10 13 ns tXZ Output Buffer Disable Delay[8] 10 13 ns tRSU Register Set-Up Time Relative to Clock Signal at Register 6 12 ns tRH Register Hold Time Relative to Clock Signal at Register 4 8 ns tLATCH Flow Through Latch Delay 3 4 ns tRD Register Delay 1 2 ns tCOMB Transparent Mode Delay 3 4 ns tIC Asynchronous Clock Logic Delay 14 16 ns tICS Synchronous Clock Delay 3 1 ns tFD Feedback Delay 1 2 ns tPRE Asynchronous Register Preset Time 5 7 ns tCLR Asynchronous Register Clear Time 5 7 ns tPIA Programmable Interconnect Array Delay Time 14 20 ns Note: 8. C1 = 5 pF. Switching Waveforms External Combinatorial DEDICATED INPUT/ I/O INPUT tPD1/tPD2 COMBINATORIAL OUTPUT Document #: 38-03037 Rev. *B Page 8 of 16 CY7C346B Switching Waveforms (continued) tWH External Synchronous tWL SYNCHRONOUS CLOCK PIN SYNCHRONOUS CLOCK AT REGISTER tH tSU DATA FROM LOGIC ARRAY tCO1 REGISTERED OUTPUTS External Asynchronous DEDICATED INPUTS OR REGISTERED FEEDBACK tAH tAS1 tAWH tAWL ASYNCHRONOUS CLOCK INPUT Internal Combinatorial tIN INPUT PIN t IO I/O PIN tEXP EXPANDER ARRAY DELAY tLAC, tLAD LOGIC ARRAY INPUT LOGIC ARRAY OUTPUT tCOMB tOD OUTPUT PIN Document #: 38-03037 Rev. *B Page 9 of 16 CY7C346B Switching Waveforms (continued) Internal Asynchronous tAWH tIOtR tAWL tF CLOCK PIN tIN CLOCK INTO LOGIC ARRAY tIC CLOCK FROM LOGIC ARRAY tRSU tRH DATA FROM LOGIC ARRAY tRD,tLATCH tFD tCLR,tPRE tFD REGISTER OUTPUT TO LOCAL LAB LOGIC ARRAY tPIA REGISTER OUTPUT TO ANOTHER LAB C346B-16 Internal Synchronous SYSTEM CLOCK PIN SYSTEM CLOCK AT REGISTER tIN tICS tRSU tRH DATA FROM LOGIC ARRAY Internal Synchronous CLOCK FROM LOGIC ARRAY tRD tOD DATA FROM LOGIC ARRAY tXZ OUTPUT PIN Document #: 38-03037 Rev. *B tZX HIGH IMPEDANCE STATE Page 10 of 16 CY7C346B Ordering Information Speed (ns) 25 35 Ordering Code Package Name Package Type CY7C346B-25HC/HI H84 84-pin Windowed Leaded Chip Carrier CY7C346B-25JC/JI J83 84-lead Plastic Leaded Chip Carrier CY7C346B-25NC/NI N100 100-lead Plastic Quad Flatpack CY7C346B-25RC/RI R100 100-pin Windowed Ceramic Pin Grid Array CY7C346B-35HC/HI H84 84-pin Windowed Leaded Chip Carrier CY7C346B-35JC/JI J83 84-lead Plastic Leaded Chip Carrier CY7C346B-35NC/NI N100 100-lead Plastic Quad Flatpack CY7C346B-35RC/RI R100 100-pin Windowed Ceramic Pin Grid Array Document #: 38-03037 Rev. *B Operating Range Commercial/Industrial Commercial/Industrial Page 11 of 16 CY7C346B Package Diagrams 84-leaded Windowed Leaded Chip Carrier H84 51-80081 Document #: 38-03037 Rev. *B Page 12 of 16 CY7C346B Package Diagrams (continued) 84-lead Plastic Leaded Chip Carrier J83 51-85006-A Document #: 38-03037 Rev. *B Page 13 of 16 CY7C346B Package Diagrams (continued) 100-Lead Plastic Quad Flatpack N100 51-85052-A Document #: 38-03037 Rev. *B Page 14 of 16 CY7C346B Package Diagrams (continued) 100-pin 100-pin Windowed Ceramic Pin Grid Array R100 51-80010-*C MAX is a registered trademark of Cypress Semiconductor Corporation. All products and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-03037 Rev. *B Page 15 of 16 © Cypress Semiconductor Corporation, 2002. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. CY7C346B ,m Document Title: CY7C346B 128-Macrocell Max® EPLD Document Number: 38-03037 REV. ECN NO. Issue Date Orig. of Change ** 106460 07/11/01 SZV Change from Spec Number: 38-00861 to 38-03037 PGA diagram dimensions were updated *A 113615 04/11/02 OOR *B 122236 12/28/02 RBI Document #: 38-03037 Rev. *B Description of Change Power up requirements added to Operating Range Information Page 16 of 16