RENESAS PH5502B2NA1-E4

Preliminary Data Sheet
PH5502B2NA1-E4
Ambient Illuminance Sensor
R08DS0038EJ0100
Rev.1.00
Oct 05, 2011
DESCRIPTION
The PH5502B2NA1-E4 is an ambient illuminance sensor with a photo diode and current amplifier. This product has
spectral characteristics close to human eye sensitivity and outputs light current proportional to the ambient brightness.
The PH5502B2NA1-E4 can be used to improve the performance and reduce the power consumption of digital
equipment such as FPD-TV sets and mobile phones, by enabling automatic brightness control and automatic switching
on and off of lighting systems.
FEATURES
• Small and thin SON package
2.55 x 1.56 x 0.55 mm
• Spectral characteristics close to human eye sensitivity
Peak sensitivity wavelength
555 nm TYP.
• Output characteristics proportional to illuminance
• Large output light current
230 μA TYP.@100 lx (Fluorescent light)
• Low voltage operation
VCC = 1.8 to 5.5 V
• Pb-free
APPLICATIONS
•
•
•
•
•
•
FPD TV sets, displays
Mobile phones, smartphones
Notebook PCs, tablet PCs
DSCs, DVCs
FA equipment
Lighting systems, etc.
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 1 of 10
PH5502B2NA1-E4
Chapter Title
PACKAGE DIMENSIONS (UNIT: mm)
TOP VIEW
2.55±0.2
0.2
2.25
6
2
5
3
4
0.2
0.22
1.56±0.15
0.5
1
Remark Pin 1 is distinguishable by the shape of the lead frame.
0.55
SIDE VIEW
(0.25)
BOTTOM VIEW
Remark ( ) indicates nominal dimensions.
Pin No.
1
2
3
4
5
6
Terminal
OUT
GND
VCC
NC
NC
NC
Remark 1. Connect all the NC terminals to GND or VCC.
2. The bypass capacitor between VCC and GND is to be mounted within 20 mm of the package body.
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 2 of 10
PH5502B2NA1-E4
Chapter Title
BLOCK DIAGRAM
VCC
Light
Source
OUT
GND
MARKING EXAMPLE
(Bottom View)
Assembly code
1 pin
A2
Product code
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 3 of 10
PH5502B2NA1-E4
Chapter Title
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Supply Voltage
Light Current
Power Dissipation *1
Operating Temperature
Storage Temperature
Note:
Symbol
VCC
IO
PD
Topt
Tstg
Ratings
6
5
135
−30 to +85
−40 to +100
Unit
V
mA
mW
°C
°C
*1. Mounted on glass epoxy board (18 mm × 13 mm × t0.8 mm)
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Symbol
VCC
MIN.
1.8
TYP.
3.0
MAX.
5.5
Unit
V
ELECTRO-OPTICAL CHARACTERISTICS
(TA = 25°C, VCC = 3.0 V, unless otherwise specified)
Parameter
Supply Current *1
Peak Sensitivity Wavelength
Light Current *1
Saturation Output Voltage *4
Switching
Rise Time
Time *5
Fall Time
Delay Time
Storage Time
Note:
*1
*2
*3
*4
Symbol
ICC
λp
IO0
IO1
IO2
IO3
VO
Conditions
EV = 100 lx *2
-
MIN.
−
−
TYP.
260
555
MAX.
−
−
Unit
μA
nm
EV = 0 lx
EV = 10 lx *2
EV = 100 lx *3
EV = 100 lx *2
−
−
−
195
-
23
330
230
0.1
−
−
265
−
-
-
-
-
μA
μA
μA
μA
V
μs
μs
μs
μs
EV = 100 lx, RL = 150 kΩ
RL = 5 kΩ *6
*2
2.6
2.9
−
200
tr
−
250
tf
−
400
td
−
10
ts
Measured under load resistance conditions of an output current unsaturated
Fluorescent light
Incandescent light
Saturation output voltage measurement method:
VCC
VCC
Light
Source
PH5502B
OUT
RL
GND
VCC
VO
Illuminance (lx)
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 4 of 10
PH5502B2NA1-E4
Chapter Title
*5 Switching Time
Pulse input
VCC
VCC
OUT
PH5502B
RL
GND
Input
90%
Output
10%
td
ts
tr
tf
*6 White LED
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 5 of 10
PH5502B2NA1-E4
Chapter Title
TYPICAL CHARACTERISTICS (TA = 25°C, VCC = 3.0 V, unless otherwise specified)
SPECTRAL SENSITIVITY
CHARACTERISTICS
LIGHT SOURCE SENSITIVITY
VARIATION
1.1
1
Fluorescent light
0.9
0.8
Incandescent light
Ratio
0.7
0.6
Halogen light
0.5
0.4
Krypton light
0.3
0.2
White LED
0
0.5
1
1.5
2
Wavelength (nm)
Ratio
DIRECTIONAL CHARACTERISTICS 1
DIRECTIONAL CHARACTERISTICS 2
1.2
1.2
1
1
0.8
0.8
Ratio
Ratio
0.1
0
300 400 500 600 700 800 900 1 000 1 100 1 200
0.6
1 pin
0.4
1 pin
0.4
-
+
-
+
0.2
0.2
0
−90
0.6
−60
−30
0
30
60
90
Angle (deg.)
0
−90
−60
−30
0
30
60
90
Angle (deg.)
Remark The graphs indicate nominal characteristics.
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 6 of 10
PH5502B2NA1-E4
Chapter Title
TEMPERATURE DEPENDENCY
OF LIGHT CURRENT AT 0 lx
LIGHT CURRENT VS. ILLUMINANCE
10 000
1
a
b
1 000
0.1
IO (μA)
IO (μA)
c
100
10
0.01
Load between Out-GND
a: No load
b: 1 kΩ
c: 10 kΩ
1
0.1
0.1
1
10
100
1 000
10 000
0.001
−40
−20
0
Illuminance (lx)
1.2
1.2
1
1
0.8
0.8
Ratio
Ratio
1.4
0.6
0.4
0.2
0.2
20
40
80
100
0.6
0.4
0
60
VCC DEPENDENCY OF LIGHT CURRENT
AT 100 lx (NORMALIZED AT VCC = 3 V)
1.4
−20
40
Temperature (°C)
TEMPERATURE DEPENDENCY OF LIGHT
CURRENT AT 100 lx (NORMALIZED AT 25°C)
0
−40
20
60
80
100
Temperature (°C)
0
2
2.5
3
3.5
4
4.5
5
5.5
6
VCC (V)
Remark The graphs indicate nominal characteristics.
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 7 of 10
PH5502B2NA1-E4
Chapter Title
TAPING SPECIFICATIONS (UNIT: mm)
1.75±0.1
Outline and Dimensions (Tape)
0.2±0.05
2.9
3.5±0.05
2.0±0.1
8.0±0.2
4.0±0.1
φ 1.5 +0.1
–0
φ 1.05±0.05
4.0±0.1
1.95
0.78±0.05
0.78±0.05
Tape Direction
Direction of feed
Carrier tape
Perforation
Product
Product
Cover tape
Pin 1
Outline and Dimensions (Reel)
θ1
θ2
D
C
B
A
E
W
Symbol
Dimensions (mm)
Symbol
Dimensions (mm)
A
φ 180 +0
–1.5
C
φ 13±0.2
B
φ 60
+1
–0
D
2.0±0.5
9.0 +1
–0
E
21.0±0.8
θ1
90°
θ2
120°
W
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 8 of 10
PH5502B2NA1-E4
Chapter Title
0.22
0.5
0.5
0.24
1.85
0.55
0.22
0.22
0.5
0.5
0.24
0.22
RECOMMENDED MOUNT PAD DIMENSIONS (Unit: mm)
Remark All dimensions in this figure must be evaluated before use.
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 9 of 10
PH5502B2NA1-E4
Chapter Title
NOTES ON HANDLING
1. Recommended reflow soldering conditions
(including infrared reflow, convection reflow, and infrared + convection reflow)
(1) This product is dry-packed with desiccant in order to avoid moisture absorption.
(2) After breaking the seal, reflow soldering must be done within 168 hours under the recommended temperature
profile shown below.
(3) If more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and
reel.
Baking conditions: Once, with tape and reel, 60±5°C, 10 to 24 hours
After the baking process, this product must be stored under conditions of 30°C or below, 70% RH or below, and
reflow soldering must be done within 168 hours.
<Storage conditions after breaking seal>
• Storage conditions
• Maximum storage period after breaking seal
: 30°C or below, 70% RH or below
: 168 hours (Second reflow soldering must be completed
within 168 hours.)
<Reflow soldering conditions>
• Peak reflow temperature
: 260°C or below (Package surface temperature)
• Maximum number of reflows
:2
• No repair by hand soldering
• Maximum chlorine content of rosin flux (percentage mass) : 0.2% or less
Recommended Temperature Profile of Reflow
Peak Temperature
260°C MAX.
255°C
Ramp-up rate 3°C/s MAX.
Ramp-down rate 6°C/s MAX.
Package Surface Temperature
220°C
200°C
30 s or less
150°C
60 to 120 s
60 s or less
Time
8 min. MAX.
R08DS0038EJ0100 Rev.1.00
Oct 05, 2011
Page 10 of 10
Revision History
PH5502B2NA1-E4 Data Sheet
Rev.
Date
Page
1.00
Oct 05, 2011
−
Description
Summary
First edition issued
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