VJ 3505 www.vishay.com Vishay Vitramon VJ 3505 UHF Chip Antenna for Mobile Devices FEATURES • • • • • The company’s products are covered by one or more of the following: WO2008250262 (A1), US2008303720 (A1), US2008305750 (A1), WO2008154173 (A1). Other patents pending. DESCRIPTION The VJ 3505 multi-layer ceramic chip antenna is a small form-factor, high-performance, chip-antenna designed for TV reception in mobile devices in the UHF band. It allows mobile TV device manufacturers to design high quality products that do not bear the penalty of a large external antenna. Utilizing Vishay's unique materials and manufacturing technologies, this product complies with the MBRAI standard while maintaining a small outline. Focusing on consumer applications, the antenna is designed to be assembled onto a PC board in the standard reflow process. Target customers of the VJ 3505 are mobile phone makers, portable multimedia device makers, notebook OEMs and ODMs, and accessory card OEMs and ODMs. • APPLICATIONS • Mobile UHF TV receivers including DVB-T, DVB-H, ISDB-T, CMMB, ATSC, and MediaFLO devices ANTENNA PERFORMANCE Peak Gain and Efficiency The antenna radiation characteristics are influenced by several factors including ground plane dimensions and impedance matching network. The antenna parameters presented hereafter were simulated according to the ground plane configuration suggested by the VJ 3505 evaluation board. Fig 1. shows simulated peak gain and radiation efficiency over frequency throughout the UHF band, compared with the MBRAI requirements. VJ 3505 Simulated Antenna Parameters 2 0 Radiation Efficiency (dB) • • • • Small outline (35 mm x 5 mm x 1.2 mm) Omni-directional, linear polarization Complies with MBRAI standard Complete UHF band coverage (470 MHz to 860 MHz) up to 1.1 GHz Requires a tuning circuit and ground plane for optimal performance Standard SMT assembly 50 unbalanced interface Operating temperature range (-40 °C to +85 °C) Reference design and evaluation boards available upon request Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Peak Gain -2 Radiation Efficiency -4 -6 MBRAI -8 -10 -12 470 520 570 620 670 720 Frequency (MHz) 770 820 870 Fig. 1 - Peak Gain and Efficiency vs. Frequency QUICK REFERENCE DATA SERIES VJ3505M011SXMSRA0 Revision: 03-Mar-15 FREQUENCY (MHz) 470 to 860 MAX. GAIN (dBi) -0.5 AVERAGE GAIN (dBi) -1 Document Number: 45158 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VJ 3505 www.vishay.com Vishay Vitramon RADIATION PATTERN The 3D planes of VJ 3505 are defined in Fig 2. Z Y X Fig. 2 - VJ 3505 3D Plane Definition Fig 3. displays the simulated 3D radiation pattern at 550 MHz. The general pattern shape does not change with frequency. Fig. 3 - Simulated Radiation Pattern at 550 MHz Revision: 03-Mar-15 Document Number: 45158 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VJ 3505 www.vishay.com Vishay Vitramon Fig. 4 displays the measured radiation patterns of VJ 3505 evaluation board in the YZ plane as defined in Fig. 2. Zero degrees is defined at the Z axis, stepping clockwise. 500 MHz - Gain (dBi) vs. Angle (°) 0 330 30 -10 -20 300 600 MHz - Gain (dBi) vs. Angle (°) 0 330 30 -10 60 -20 300 -40 -40 -50 270 -50 270 90 90 120 240 120 240 150 210 60 -30 -30 150 210 180 180 700 MHz - Gain (dBi) vs. Angle (°) 0 330 30 -10 862 MHz - Gain (dBi) vs. Angle (°) 0 330 30 -10 -20 300 60 -20 300 -30 -40 -40 -50 270 -50 270 90 120 240 90 120 240 150 210 60 -30 150 210 180 180 Fig. 4 - Measured Radiation Pattern FOOTPRINT AND MECHANICAL DIMENSIONS The antenna footprint and mechanical dimensions are presented in Fig 5. For mechanical support, it is recommended to add one or two drops of heat curing epoxy glue. The glue dot should not overlap with any of the soldering pads. It is recommended to apply the glue dot at the center of the antenna, as shown by the diagonal pattern. For more details see “VJ 3505 Assembly Guidelines” section below. 0.25 0.25 4.5 1 1 1 9 9 9 1 0.25 5 Apply glue in this area 0.25 1 35 All dimensions in mm Figure not in scale RF feed connects here Fig. 5 - VJ 3505 Footprint DIMENSIONS Length Width Height Revision: 03-Mar-15 (mm) 35 + 0.5 / - 0 5 + 0.5 / - 0 1.2 ± 0.1 Document Number: 45158 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VJ 3505 www.vishay.com Vishay Vitramon VJ 3505 ASSEMBLY GUIDELINES 1. Mounting of antennas on a printed circuit board should be done by reflow soldering. The reflow soldering profiles are shown below. 2. In order to provide the adequate strength between the antenna and the PCB the application of a dot of heat cured epoxy glue in the center of the footprint of the antenna prior to the antenna’s soldering to the board should be done. An example for such glue could be Heraeus PD 860002 SA. The weight of the dot should be 5 mg to 10 mg. 300 T (°C) Max. temperature 250 > 215 °C: 20 s to 40 s 200 150 Min. temperature 100 Sn-Pb eutectic solder paste 50 0 30 s to 60 s 30 s to 60 s 30 s to 60 s Time Fig. 6 - Soldering IR Reflow with SnPb Solder 300 T (°C) 250 10 s 260 °C ˜ 245 °C 215 °C 200 180 °C 150 10 s 40 s 130 °C 100 2 K/s 50 0 50 100 150 200 t (s) 250 Fig. 7 - Soldering Reflow with Sn Solder Revision: 03-Mar-15 Document Number: 45158 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VJ 3505 www.vishay.com Vishay Vitramon 300 T (°C) 250 200 Max. temperature Sn-Ag-Cu solder paste 150 Min. temperature 100 50 0 30 s to 60 s 60 s to 120 s 60 s to 120 s Time 60 s to 120 s Fig. 8 - Soldering IR Reflow with SnAgCu Solder ORDERING INFORMATION VISHAY MATERIAL PACKAGING QUANTITY VJ 3505 VJ3505M011SXMSRA0 1000 pieces Revision: 03-Mar-15 Document Number: 45158 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000