AOS Semiconductor Product Reliability Report AOZ8831DI-05, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOZ8831DI-05. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOZ8831DI-05 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be routine monitored for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Reliability Stress Test Summary and Results Reliability Evaluation I. Product Description: The AOZ8831 is an ultra low capacitance one-line bi-directional transient voltage suppressor diode designed to protect high speed data lines and voltage sensitive electronics from high transient conditions and ESD. This device incorporates one TVS diode in an ultra-small DFN 1.0 x 0.6 package. The AOZ8831 comes in an RoHS compliant DFN package. The ultra-small 1.0 x 0.6 x 0.5mm DFN package makes it ideal for applications where PCB space is a premium. The small size and high ESD protection makes it ideal for protecting voltage sensitive electronics from high transient conditions and ESD. Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bonding Mold Material Moisture Level AOZ8831DI-05 Standard sub-micron One-line Bi-directional TVS Diode DFN1.0x0.6 Bare Cu Ag Epoxy Au wire Epoxy resin with silica filler Up to Level 1 2 III. Reliability Stress Test Summary and Results Test Item Test Condition Time Point Total Sample size Number of Failures Reference Standard HTRB Temp = 150°C , Vdd=80% of Vbrmax 168 / 500 / 1000 hours 924 pcs 0 JESD22-A108 MSL Precondition 168hr 85°C/85%RH + 3 cycle reflow@260°C (MSL 1) - 2772 pcs 0 JESD22-A113 HAST 130°C , 85%RH, 33.3 psi, Vdd = 80% of Vbrmax 96 hours 924 pcs 0 JESD22-A110 Autoclave 121°C , 29.7psi, RH=100% 96 hours 924 pcs 0 JESD22-A102 Temperature Cycle -65°C to 150°C , air to air, 250 / 500 cycles 924 pcs 0 JESD22-A104 Note: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 7.04 MTTF = 16216 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 7.04 9 MTTF = 10 / FIT = 16216 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from burn-in tests H = Duration of burn-in testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 259 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3