Z-Power LED X10490 Technical Data Sheet Specification C9WT821 SSC Drawn CUSTOMER Approval Approval Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Optical characteristics 5. Reliability Test 6. Color & Binning 7. Bin Code Description 8. Outline Dimension 9. Reel Structure 10. Packing 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet C9WT821 1. Description TOP VIEW LED is designed for high current operation and high flux output applications. Furthermore, its thermal management characteristic is better than other LED solutions by package SMD design and C9WT821 Features • White & Warm colored SMT package. • High CRI PKG • Pb-free Reflow Soldering Application • Suitable for all SMT assembly methods ; Suitable for all soldering methods • RoHS Compliant • MSL LEVEL 2a good thermal emission material. According to these advantages, it enables to apply various lighting applications and design solution, automotive lighting etc. Applications • Interior lighting • General lighting • Indoor and out door displays • Architectural / Decorative lighting Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings [1] Parameter Symbol Value Unit Power Dissipation Pd 324 mW Forward Current IF 90 mA Peak Forward Current (per die) IFM[2] 100 mA Reverse Voltage (per die) VR 5 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Junction Temperature Tj 125 ℃ [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. [2] IFM was measured at Tw≤1 msec of pulse width and D≤1/10 of duty ratio. 3. Electric & Optical Characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage (per die) * VF IF=20mA 3.0 3.3 3.8 V Reverse Current (per die) IR VF=5V - - 10 μA Luminous Intensity *[1] IV IF=60mA 4.0 4.5 - cd Color Temperature CCT IF=60mA 2,600 - 7,000 K Optical Temperature Ŋelc IF=60mA - 71 - lm/W Viewing Angle [2] 2Θ1/2 IF=60mA - 120 - deg. Color Rendering Index * Ra IF=60mA - 92 - - 1.5kΩ;100pF 1 - - KV ESD (HBM) [1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. * Tolerance : VF :±0.05V, IV :±10%, ΦV:±10%, Ra :±3, x,y :±0.01 [Note] All measurements were made under the standardized environment of SSC. Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Spectrum Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Reliability Test Item Reference Test Conditions Duration/ Cycle Failures Thermal Shock EIAJ ED-4701 Ta= -40ºC (30min) ~ 100º(30min) 100 Cycle 0/22 High Temperature Storage EIAJ ED-4701 Ta= 100ºC 1000hrs 0/22 High Temp. High Humidity Storage EIAJ ED-4701 Ta= 60ºC, RH=90% 1000hrs 0/22 Low Temperature Storage EIAJ ED-4701 Ta= -40ºC 1000hrs 0/22 Operating Endurance Test Internal Reference Ta= 25ºC, IF=60mA 1000hrs 0/22 High Temperature High Humidity Test Internal Reference Ta= 60ºC, RH=90%, IF=60mA 500hrs 0/22 High Temperature Life Test Internal Reference Ta= 85ºC, IF=60mA 500hrs 0/22 Low Temperature Life Test Internal Reference Ta= -40ºC, IF=60mA 1000hrs 0/22 ESD(HBM) MIL-STD883D 1KV at 1.5kΩ; 100pF 3 Time 0/22 CRITERIA FOR JUDGING THE DAMAGE Item Symbol Condition Forward Voltage VF Luminous Intensity IR Criteria for Judgment MIN MAX IF=60mA (20mA per die) - USL[1]X 1.2 IF=60mA (20mA per die) LSL[2] X 0.5 - Notes : [1] USL : Upper Standard Level [2] LSL : Lower Standard Level Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● D~H -> CCT 2600 ~ 4700 K Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. Bin Code Description Bin Code Luminous Intensity Color Rank Forward Voltage M0 A1 Z1 4,700K~7,000K Luminous Intensity (mcd) @ IF =60mA Rank Min. Max. M0 4,000 4,500 M5 4,500 5,000 N0 5,000 5,500 N5 5,500 6,000 Color Rank @ IF =60mA A1 A3 A2 A4 B1 B3 B2 B4 C1 C3 C2 C4 2,600K~4,700K Average for Total Forward Voltage (V) @ IF =60mA Rank Min. Max. Z1 3.0 3.1 Z2 3.1 3.2 Z3 3.2 3.3 A1 3.3 3.45 A2 3.45 3.6 Color Rank @ IF =60mA D1 D3 D2 D4 E1 E3 E2 E4 F1 F3 F2 F4 G1 G3 G2 G4 Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. Outline Dimension 9. Reel Structure (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Packing Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Soldering (1) Lead Solder (2) Lead-Free Solder (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. [Note] In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Precaution for use 1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH 2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% 3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. 4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. 5) Quick cooling shall be avoided. 6) Components shall not be mounted on warped direction of PCB. 7) Anti radioactive ray design is not considered for the products. 8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. 9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. 10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. 11) The LEDs must be soldered within seven days after opening the moisture-proof packing. 12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Handling of Silicone Resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. Rev. 02 March 2010 www.acriche.com 서식번호 : SSC-QP-7-07-24 (Rev.00)