Product Data Sheet SPW88F0E - P8 Series White Applicable for General Lights P8 Series White SPW88F0E RoHS Product Brief Description Features and Benefits • It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame (Ag Plating). • The die is attached within the reflector cavity and the cavity is encapsulated by silicone • • • • • • The high reliability feature is crucial to automotive front, Interior lamp and General Lights Industry Standard SMT package Low thermal resistance Lead free product RoHS Compliant MSL 2a Key Applications • • • • • Architectural Industrial Outdoor area Automotive Exterior Lighting Commercial 1 Rev1.0, Dec 24, 2015 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 5 • Color Bin Structure 8 • Mechanical Dimensions 10 • Recommended Solder Pad 11 • Reflow Soldering Characteristics 12 • Emitter Tape & Reel Packaging 13 • Product Nomenclature 15 • Handling of Silicone Resin for LEDs 16 • Precaution For Use 17 • Company Information 20 Rev1.0, Dec 24, 2015 2 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Performance Characteristics Table 1. Electro Optical Characteristics, IF =300mA, Ta = 25ºC, RH30% Vaule Parameter Symbol Unit Min Typ Max - 3.4 3.75 Forward Voltage VF Luminous Flux [1] ΦV 100 lm Correlated Color Temperature [2] CCT 6000 K CRI Ra Viewing Angle [3] 2θ1/2 80 V 120 deg. Notes : [1]. Seoul Semiconductor maintains a tolerance of 7% on flux and power measurements [2]. Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : ± 0.005, CCT ± 5% tolerance [3]. 2½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. Rev1.0, Dec 24, 2015 3 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Performance Characteristics Table 2. Absolute Maximum Ratings Parameter Symbol Value Unit Power Dissipation (Ta=25℃) Pd 1.0 W Forward Current (Ta=25℃) IF Operating Temperature 100 (min) 300 (typ.) 400 (max.) mA Topr -40 ~ +80 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Junction Temperature Tj 125 ℃ Thermal Resistance Rth-JS 13 K/W Notes : (1) Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. Rev1.0, Dec 24, 2015 4 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Characteristics Graph Fig 1. Forward Voltage vs. Forward Current, T a = 25℃ 400 Forward Current [mA] 300 200 100 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage [V] Fig 2. Forward Current vs. Relative Luminous Flux, T a = 25℃ 1.4 Relative Luminous Flux 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 100 200 300 400 Forward Current [mA] Rev1.0, Dec 24, 2015 5 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Characteristics Graph Fig 3. Junction Temperature vs. Relative Forward Voltage, IF = 300mA 0.2 Relative Forward Voltage 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 25 50 75 100 125 150 Junction Temperature [Tj ] Fig 4. Junction Temperature vs. Relative Luminous Flux, IF = 300mA 1.0 Relative Luminous Flux 0.8 0.6 0.4 0.2 0.0 25 50 75 100 125 150 Junction Temperature [Tj ] Rev1.0, Dec 24, 2015 6 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Characteristics Graph Fig 5. Junction Temperature vs. Forward Current 500 Forward Current [mA] 400 1.Rja t = 35℃/W 2.Rja t = 45℃/W 3.Rja t = 55℃/W 300 200 100 0 0 20 40 60 80 100 120 140 Junction Temperature [Tj ] Fig 6. Radiation Diagram 0 30 -30 60 -60 90 -90 Rev1.0, Dec 24, 2015 7 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Color Bin Structure Table 3. Bin Code description, Tj=25℃, IF = 300mA Luminous Intensity (cd) Part Number SPW88F0E Bin Code Min. Max. U2 100.0 109.0 U3 109.0 118.5 V1 118.5 130.0 Color Chromaticity Coordinate Refer to Page.9 Typical Forward Voltage (V) Bin Code Min. Max. H 3.00 3.25 I 3.25 3.50 J 3.50 3.75 *Notes : (1) All measurements were made under the standardized environment of Seoul Semiconductor In order to ensure availability, single color rank will not be orderable. Rev1.0, Dec 24, 2015 8 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Color Bin Structure CIE Chromaticity Diagram, IF = 300mA, Ta = 25ºC D4 CIE x 0.3524 0.3512 0.3590 0.3608 D5 CIE y 0.3555 0.3465 0.3521 0.3616 CIE x 0.3608 0.3590 0.3670 0.3692 CIE y 0.3677 0.3578 0.3646 0.3751 CIE x 0.3670 0.3650 0.3758 0.3783 E4 CIE x 0.3692 0.3670 0.3783 0.3813 D6 CIE y 0.3616 0.3521 0.3578 0.3677 CIE x 0.3512 0.3497 0.3575 0.3590 D7 CIE y 0.3465 0.3385 0.3441 0.3521 CIE x 0.3590 0.3575 0.3650 0.3670 CIE y 0.3521 0.3441 0.3489 0.3578 E6 CIE y 0.3578 0.3489 0.3550 0.3646 *Notes : •Measurement Uncertainty of the Color Coordinates : ± 0.005 Rev1.0, Dec 24, 2015 9 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Mechanical Dimensions < CirCuit Diagram > (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.1mm Rev1.0, Dec 24, 2015 10 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Recommended Solder Pad Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) This drawing without tolerances are for reference only. (4) Undefined tolerance is ±0.1mm. Rev1.0, Dec 24, 2015 11 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board. Rev1.0, Dec 24, 2015 12 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White 1.75±0.1 Emitter Tape & Reel Packaging 4±0.1 0.25±0.05 5.30±0.1 8.0±0.1 4.80±0.1 12.0±0.2 (4.75) 5.5±0.05 2±0.05 1.30±0.1 Package Marking 15.4±1.0 180 13±0.3 60 2 22 13 (1) All dimensions are in millimeters. (2) Undefined tolerance is ±0.2mm (3) Quantity : 1,500pcs/Reel (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev1.0, Dec 24, 2015 13 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box Rev1.0, Dec 24, 2015 14 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Product Nomenclature Table 4. Part Numbering System : X1X2X3X4X5X6X7X8X9 Part Number Code Description Part Number Value X1 Company S SSC Code X2 Power LED series number P Power X3X4 Color Specification W8 Pure white (CRI 80) X5 PKG series 8 P8 Series X6 Lens Type F Flat X7 PCB Type 0 Emitter X8 Revision No E - Table 5. Lot Numbering System : Y1Y1Y2Y3Y3Y4Y5Y5Y5Y5 - Y6Y6Y6 - Y7Y7Y7 - Y8Y8Y8Y8Y8Y8Y8 Lot Number Code Description Y1 Year Y2 Month Y3 Day Y4 Production area Y5 Mass order Y6 Taping number Y7 Reel number Y8 Internal management number Rev1.0, Dec 24, 2015 15 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) Avoid leaving fingerprints on silicone resin parts. Rev1.0, Dec 24, 2015 16 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing P8 Series LEDs in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing / Temperature : 5 ~ 30℃ Humidity : less than RH60% b. If the package has been opened more than 4 weeks (MSL 2a) or the color of the desiccant changes, components should be dried for 10-24hr at 65±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored in a clean environment. We recommend LEDs store in nitrogen-filled container. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. Rev1.0, Dec 24, 2015 17 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Precaution for Use (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) The slug is electrically isolated. (15) Attaching LEDs, do not use adhesives that outgas organic vapor. (16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev1.0, Dec 24, 2015 18 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires - This damage usually appears due to the thermal stress produced during the EOS event c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev1.0, Dec 24, 2015 19 www.seoulsemicon.com Product Data Sheet SPW88F0E - P8 Series White Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev1.0, Dec 24, 2015 20 www.seoulsemicon.com