Outline Dimensions www.vishay.com Vishay Semiconductors D-PAK (TO-252AA) DIMENSIONS in millimeters and inches SYMBOL MILLIMETERS MIN. INCHES MAX. MIN. MAX. NOTES SYMBOL MILLIMETERS MIN. MAX. INCHES MIN. MAX. A 2.21 2.38 0.087 0.094 A1 0.89 1.14 0.035 0.045 A2 0.03 0.127 0.001 0.005 H 9.65 10.41 0.380 0.410 1.40 1.78 0.055 0.070 b 0.71 0.88 0.028 0.035 L b1 0.76 1.14 0.030 0.045 e b2 5.23 5.44 0.206 0.214 e1 C 0.46 0.58 0.018 0.023 L1 2.28 BSC 4.57 BSC 0.64 1.02 NOTES 0.09 BSC 0.18 BSC 0.025 0.040 C1 0.46 0.58 0.018 0.023 L2 0.89 1.27 0.035 0.050 D 5.97 6.22 0.235 0.2455 L3 1.15 1.52 0.040 0.060 D1 4.32 4.45 0.170 0.175 E 6.48 6.73 0.255 0.2655 E1 4.49 5.50 0.177 0.217 Notes (1) Dimensioning and tolerancing as per ASME Y14.5M-1994 (2) Lead dimension uncontrolled in L3 only for reference (3) Dimension D1, E1, L2 and b2 establish a minimum mounting surface for thermal pad (4) Dimensions D and E do not include mold flash. (5) Outline conforms to JEDEC outline TO-252AA Revision: 18-Jun-12 Document Number: 95519 1 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000