Design Guide for High Current Solutions with Wirelaid ® Design Rules SMD and high current layer Dimensions (minimum) 2 F 14 350 x 1400 µm Pad size 3.5 x 3.0 mm² LB Track width above wire 1.9 mm A1 Distance of pitch between wires of separate potentials (considering the positioning of the pad) 1.9 mm + insulating distance* A2 Distance pitch of wires for same potential 1.8 mm Smax Maximum length of wire between welding points 100 mm Smin Minimum length of wire between welding points 7.5 mm High current and signal processing electronics on a single layer L1 x B1 *Dependent on the thickness of the copper layer according to the current Basic Design Guide of Würth Elektronik at www.we-online.com Different potentials Same potentials L1 LB A2 A1 B1 Smax Smin Isolation distance to the inner layer Derived from the customer-specific layer structure, which we are pleased to create for you. Structure with angled wire path Nomenclature 135,0° 67,5° Outer layer Inner layer ML6 Wire@1@6 ML6 Wire@2@5 135,0° m ,5 m R: 2 67,5° m ,5 m R: 2 The example shows a multilayer with 6 layers and wires under layer 2 and layer 5. For typical complex logic circuits. ! Distance from wire to drill holes maximum wire projection: process-dependent 0.5 mm Drill holes with pad ≥ 0.2 mm circumferential 1.4 mm The example shows a multilayer with 6 layers and wires under layer 1 and layer 6. For simple logic circuits. Flat wire - product view Diameter of welding point: 1.0 mm Ampacity Wires welded under the internal layer copper foil 35 µm + galvanic structure copper foil 35 µm 100 20 15 90 center welding point Flat wire - design view Wires welded under the external layer 100 In the layout, please take into consideration: the Wirelaid wires may not be drilled through. R: 0.7 mm A3 15 90 10 80 5 70 0 wire with round aperture to be drawn in A3 = 1.2 mm + half end-diameter of drill hole 10 0 5 10 15 20 60 50 40 30 2xF14 Cu 35 µm under TOP 10 15 20 Wide solder pad and covering conductor in the case of wires with the same potential 50 40 1xF14 Cu 35 µm under L2 2xF14 Cu 35 µm under L2 20 3xF14 Cu 35 µm under TOP 10 0 5 30 1xF14 Cu 35 µm under TOP 20 0 60 0 10 20 30 40 50 60 70 80 90 100 0 current [A] copper foil 70 µm + galvanic structure 100 4xF14 Cu 35 µm under L2 0 10 20 30 40 50 60 70 80 90 100 current [A] copper foil 70 µm 100 15 90 3xF14 Cu 35 µm under L2 10 4xF14 Cu 35 µm under TOP 20 Wire F14: D = 1.4 mm 15 90 10 10 5 0 70 80 0 10 20 heat dissipation [K] heat dissipation [K] 80 30 60 50 40 30 2xF14 Cu 70 µm under TOP 10 20 30 40 50 60 70 80 90 100 current [A] 2xF14 Cu 70 µm under L2 4xF14 Cu 70 µm under L2 0 10 20 30 40 50 60 70 80 90 100 Delta 10.2 1.8 ≥ 1.9 ≥ 3.7 ≥ 5.5 7.3 9.1 1.8 Labelling fixed welding points As a rule, all welding points are defined by the manufacturer. Should fixed welds be required at certain points, these must be defined on a separate layer by the customer! current [A] 20 fixed welding point on its own Gerber format layer! Symbol Ø 1 mm 15 80 0 20 10 heat dissipation [K] heat dissipation [K] 5 8.4 10 30 50 40 30 1xF14 Cu 105 µm under TOP 2xF14 Cu 105 µm under TOP 20 3xF14 Cu 105 µm under TOP 10 4xF14 Cu 105 µm under TOP 0 4 6.6 Covering conductor LB [mm] 1xF14 Cu 70 µm under L2 90 60 0 3 4.8 40 100 5 0 2 3.0 50 10 70 20 1 Solder pad B [mm] copper foil 105 µm 15 80 15 Number of wires n 60 0 20 90 10 10 copper foil 105 µm + galvanic structure 100 5 0 3xF14 Cu 70 µm under L2 4xF14 Cu 70 µm under TOP 0 0 70 20 3xF14 Cu 70 µm under TOP 10 5 30 1xF14 Cu 70 µm under TOP 20 0 B 0 LB 70 D 5 heat dissipation [K] heat dissipation [K] 80 10 20 30 40 50 www.we-online.com 60 70 80 90 100 current [A] 5 70 0 10 0 20 30 60 50 40 30 1xF14 Cu 105 µm under L2 20 2xF14 Cu 105 µm under L2 3xF14 Cu 105 µm under L2 10 4xF14 Cu 105 µm under L2 0 0 10 20 30 40 50 60 70 80 90 100 Available with UL listing type WE51 (UL 94 V-O). More information about high-current applications in combination with logic can be found here: www.we-online.com/power current [A] Version 1.5