Design recommendations HDI - W rth Elektronik HDI Design Guide (PDF)

Webinar: Design recommendations HDI – HDI Design Guide
Würth Elektronik Circuit Board Technology
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Seite 1
02.07.2013
Agenda
Nomenclature and definition
Why Microvia technology?
Possibilities
Costs
Route out a BGA
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Seite 2
02.07.2013
Nomenclature and definition
HDI
• High Density Interconnection
Microvia
• Smallest, laser drilled holes
Buried Via
• Buried drills on the inner layers
Pitch
• Middle of a pad to the middle of a pad
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Seite 3
02.07.2013
Nomenclature and definition
Number of microvia layers
Number of inner layers
between the microvias
Number of microvia layers
Number of microvia layers
Number of inner layers with
buried vias
Number of microvia layers
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Seite 4
02.07.2013
Nomenclature and definition
Number of microvia layers
Number of microvia layers
Number of inner layers with buried vias
Number of inner layers
between the microvias
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Seite 5
02.07.2013
Why Microvia technology?
Route out the
smallest BGA
pitch www.we-online.de
High reliability
Seite 6
02.07.2013
Why Microvia technology?
TCT
i.d.R -45° / + 125° C
Solder process
Aspect Ratio
AR= h / 
IPC-2221/2122
Copper thickness t
t

CTEz
h
Expand!
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h

Standard-FR4 Z-Achse
Expand Z-axis
[µm]
Basic material
70
60
50
40
30
20
10
0
25
Seite 7
50
75
Cu
100 125 150 175 200 225 250
T [°C]
02.07.2013
Why Microvia technology?
Route out the
smallest BGA
pitch www.we-online.de
High reliability
Miniaturisation
with ‘Via in Pad’
technology Seite 8
Cost-effective
generation of
high wiring
density Future-proof
technology –
components are
getting smaller all
the time 02.07.2013
We will have a…
What's the reason that plated through holes / vias can not be
reduced to any small size?
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Page 9
02.07.2013
Possibilities – Standard Microvias
Standard - Microvia
FinalØ 100µm
Pad Ø 300µm
With 60-70µm
dielectric
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Seite 10
02.07.2013
Possibilities –Microvias with impedance
Standard - Microvia
FinalØ 125µm
Pad Ø 325µm
With 85-110µm
dielectric
- 1 x pressed
- 1 x electroplated
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Seite 11
02.07.2013
Possibilities – Staggered Microvias
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Seite 12
02.07.2013
Possibilities – Staggered Microvias
- 2 x pressed
- 2 x electroplated
- Filling of the microvias and buried vias with epoxy
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Seite 13
02.07.2013
Via Filling Process
Copper
FR4
Hardening
Copper
Drilling
Polish
Metallization
Vacuum filling
process
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Seite 14
02.07.2013
Possibilities – Staggered Microvias
Staggered Microvias
Pitch ≥ 300µm
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Seite 15
02.07.2013
Possibilities – Staggered Microvias
- 3 x pressed
- 3 x electroplated
- Filling of the Micro- and buriedvias with epoxy
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Seite 16
02.07.2013
Possibilities – Staggered Microvias and Buried Vias
Pitch ≥ 400µm
PadØ 550µm
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Seite 17
02.07.2013
Possibilities – Staggered Microvias und Buried Vias
- 3 x pressed
- 3 x electroplated
- Filling of the buried vias with epoxy
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Seite 18
02.07.2013
Possibilities – Stacked Microvias
Stacked microvia
Copper filled
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Seite 19
02.07.2013
Possibilities – Stacked Microvias
- 3 x pressed
- Filling of Buried Vias with epoxy
- Filling of Microvias with epoxy
- 4 x electroplated, metallization of µVias have to be done seperated to the buried vias
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Seite 20
02.07.2013
Possibilities – Stacked Microvias on Buried Vias
Stacked Microvia on
Buried Via
Buried Via filled and
capped
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Seite 21
02.07.2013
We will have a…
With respect to the manufacturing costs, why is it preferable to use
staggered microvias in comparision with the stacked option?
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Page 22
02.07.2013
Via Filling Process
Copper
FR4
Hardening
Copper
Drilling
Polish
Metallization
Metallization
Vacuum filling
process
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Seite 23
02.07.2013
Possibilities – Stacked Microvias on Buried Vias
- 3 x pressed
- Filling of Buried Vias with epoxy and capping
- Filling of Microvias with epoxy
- 4 x electroplated
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Seite 24
02.07.2013
Costs
175 %
1 x pressed
3 x pressed
2 x pressed
150 %
extra
buried
Microvias
142 %
buried Vias
120 %
115 %
Costs
Laser drilling
1 to 3
1.
2+4+2
Microvias
Microvias
1.
2.
1.
1+6+1
ML08
ohne
µ-Vías
1.
Microvias 1 to 2
8 to 7
PTH
1 to 8
1 x pressed
1 x electroplated
1 x laserdrilled
1 x mech. drilled
2.
Microvias 1 to 2
+ 1 to 3
8 to 6
8 to 7
PTH
1 to 8
2 x pressed
1 x electroplated
1 x laserdrilled
1 x mech. drilled
Microvia Filling?
Microvias 1 to 2
2 to 3
7 to 6
8 to 7
PTH
1 to 8
2 x pressed
2 x electroplated
2 x laserdrilled
1 x mech. drilled
1 to 2
8 to 7
1 to 8
2 to 7
PTH
Buried Via
2 x pressed
2 x electroplated
1 x laserdrilled
2 x mech. drilled
Microvias
2.
1.
2.
2+4+2
100 %
90 %
Microvias
1. 2.
2 + 4(6b) + 2
1 + 6b + 1
Staggered
2 + 4b + 2
1 to 2
2 to 3
7 to 6
8 to 7
1 to 8
2 to 7
PTH
Buried Via
2 x pressed
2 x electroplated
2 x laserdrilled
2 x mech. drilled
1 to 2
2 to 3
7 to 6
8 to 7
1 to 8
3 to 6
PTH
Buried Via
3 x pressed
3 x electroplated
2 x laserdrilled
2 x mech. drilled
Complexity
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Seite 25
11.06.2013
3.
Route out
BGA Pitch 0,8mm
Route out with mech. vias
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Seite 26
02.07.2013
Route out
BGA Pitch 0,8mm
Route out with Microvias, Dog bone
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Seite 27
02.07.2013
Route out
BGA Pitch 0,8mm
Route out with Via in Pad
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Seite 28
02.07.2013
Route out
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Page 29
02.07.2013
Thank you for your attention!
Dominic Büch
WÜRTH ELEKTRONIK GmbH & Co. KG
Product Management
Lasercavity
Circuit Board Technology
P.: +49 7622 397 223
M.:+49 151 7270 9888
E. [email protected]
W. www.we-online.de
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Page 30
02.07.2013
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