Datasheet

THC63LVDM83D_Rev.4.20_E
THC63LVDM83D
24bit COLOR LVDS TRANSMITTER
General Description
Features
The THC63LVDM83D transmitter is designed to support pixel
data transmission between Host and Flat Panel Display up to
1080p/WUXGAresolutions.
The THC63LVDM83D converts 28bits of LVCMOS data into
four LVDS data streams. The transmitter can be programmed
for rising edge or falling edge clock through a dedicated pin.
At a transmit clock frequency of 160MHz, 24bits of RGB data
and 4bits of timing and control data (HSYNC, VSYNC, DE,
CONT1) are transmitted at an effective rate of 1120Mbps per
LVDS channel.
・Compatible with TIA/EIA-644 LVDS Standard
・7:1 LVDS Transmitter
・Operating Temperature Range : 0 to +70C
・No Special Start-up Sequence Required
・Spread Spectrum Clocking Tolerant up to 100kHz Frequency
Modulation and +/-2.5% Deviations.
・Wide Dot Clock Range: 8 to 160MHz Suited for
TV Signal : NTSC(12.27MHz) - 1080p(148.5MHz)
PC Signal : QVGA(8MHz) - WUXGA(154MHz)
・56pin TSSOP Package
・1.2V to 3.3V LVCMOS/ inputs are supported.
・LVDS swing is reducible as 200mV by RS-pin to reduce EMI
and power consumption.
・PLL requires no external components.
・Power Down Mode.
Application
・Medium and Small Size Panel
・Tablet PC / Notebook PC
・Security Camera / Industrial Camera
・Multi Function Printer
・Industrial Equipment
・Medical Equipment Monitor
・Input clock triggering edge is selectable by R/F-pin
・EU RoHS Compliant.
Block Diagram
THC63LVDM83D
TA0-6
TB0-6
TC0-6
TD0-6
TRANSMITTER
CLKIN
(8 to 160MHz)
7
7
7
7
DATA
(LVDS)
CMOS/TTL PARALLEL
TO SERIAL
CMOS/TTL
INPUTS
TA +/TB +/TC +/TD +/(56-1120Mbit/On Each
LVDS Channel)
TCLK +/-
PLL
CLOCK
(LVDS)
8-160MHz
R/F
/PDWN
RS
Figure 1. Block Diagram
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Pin Diagram
Figure 2. Pin Diagram
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Pin Description
Pin Name
TA+, TATB+, TBTC+, TCTD+, TDTCLK+,
TCLKTA0 ~ TA6
Pin #
47, 48
45, 46
41, 42
37, 38
39, 40
/PDWN
51, 52, 54, 55, 56, 3,
4
6, 7, 11, 12, 14, 15,
19
20, 22, 23, 24, 27, 28,
30
50, 2, 8, 10, 16, 18,
25
32
RS
1
R/F
17
CLKIN
VCC
31
9, 26
GND
5, 13, 21, 29, 53
LVDS VCC
LVDS GND
PLL VCC
PLL GND
44
36, 43 49
34
33, 35
TB0 ~ TB6
TC0 ~ TC6
TD0 ~ TD6
Direction
Type
Description
LVDS Data Out
Output
LVDS
LVDS Clock Out
Pixel Data Input
Input
LVCMOS
Power
-
H : Normal Operation
L : Power Down (All outputs are Hi-Z)
LVDS Swing Mode, VREF Select See Fig.8,
9
LVDS
Small Swing
RS
Swing
Input Support
VCC
350mV
N/A
0.6 ~ 1.4V
350mV
RS=VREF
GND
200mV
N/A
VREF : is Input Reference Voltage
Input Clock Triggering Edge Select
H : Rising Edge
L : Falling Edge
Input Clock
Power Supply Pins for LVCMOS inputs and
digital circuit.
Ground Pins for LVCMOS Inputs and Digital
Circuitry.
Power Supply Pins for LVDS Outputs.
Ground Pins for LVDS Outputs.
Power Supply Pin for PLL Circuitry.
Ground Supply Pin for PLL Circuitry.
Table 1. Pin Description
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Absolute Maximum Ratings
Parameter
Supply Voltage (VCC)
LVCMOS Input Voltage
LVDS Output Pin
Output Current
Junction Temperature
Storage Temperature
Reflow Peak Temperature
Reflow Peak Temperature Time
Maximum Power Dissipation @+25C
Min
-0.3
-0.3
-0.3
-30
-55
-
Max
+4.0
VCC + 0.3
VCC + 0.3
30
+125
+150
+260
10
1.8
Unit
V
V
V
mA
C
C
C
sec
W
Table 2. Absolute Maximum Ratings
Recommended Operating Conditions
Symbol
Ta
-
Parameter
All Supply Voltage
Operating Ambient Temperature
Clock Frequency
Min
3.0
0
8
Typ
3.3
25
-
Max
3.6
+70
160
Unit
V
C
MHz
Table 3. Recommended Operating Conditions
“Absolute Maximum Ratings” are those values beyond which the safety of the device can not be guaranteed.
They are not meant to imply that the device should be operated at these limits. The tables of “Electrical
Characteristics Table4, 5, 6, 7” specify conditions for device operation.
“Absolute Maximum Rating” value also includes behavior of overshooting and undershooting.
Equivalent LVDS Output Schematic Diagram
3.5mA
IN_N
LVDS_OutN
LVDS_OutP
IN_P
Figure 3. LVDS Output Schematic Diagram
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Power Consumption
Over recommended operating supply and temperature range unless otherwise specified
Parameter
Conditions
Typ*
Max
Unit
Symbol
RL=100, CL=5pF, f=85MHz, RS=VCC
ITCCW
LVDS Transmitter
Operating Current
Worst Case Pattern
(Fig.4)
RL=100,
CL=5pF,
f=135MHz,
RS=VCC
RL=100,
CL=5pF,
f=160MHz,
RS=VCC
RL=100, CL=5pF, f=85MHz, RS=GND
RL=100,
RS=GND
RL=100,
RS=GND
CL=5pF,
f=135MHz,
CL=5pF,
f=160MHz,
LVDS Transmitter
/PDWN=L, All Inputs=L or H
Power Down Current
*Typ values are at the conditions of VCC=3.3V and Ta = +25ºC
Table 4. Power Consumption
ITCCS
61
67
mA
77
83
mA
84
92
mA
50
56
mA
65
71
mA
73
80
mA
-
10
µA
Worst Case Pattern
CLKIN
Tx0-6
x=A,B,C,D
Figure 4. Worst Case Pattern
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Electrical Characteristics
LVCMOS DC Specifications
Over recommended operating supply and temperature range unless otherwise specified
Parameter
Conditions
Min
Typ*
Max
Unit
High Level Input Voltage
RS=VCC or GND
2.0
VCC
V
Low Level Input Voltage
RS=VCC or GND
GND
0.8
V
Small Swing Voltage
1.2
2.8
V
Input Reference Voltage
Small Swing (RS=VDDQ/2)
VDDQ/2
VDDQ/2
Small Swing High Level
VREF= VDDQ/2
+100m
V
Input Voltage
V
VSL2
Small Swing Low Level
VDDQ/2
VREF= VDDQ/2
V
Input Voltage
-100mV
IINC
Input Current
GND  VIN  VCC
10
A
*Typ values are at the conditions of VCC=3.3V and Ta = +25ºC
Notes : 1 VDDQ voltage defines the max voltage of small swing inputs at RS=VREF. It is not an actual input
Symbol
VIH
VIL
VDDQ1
VREF
VSH2
voltage.
2
Small swing signals are applied to TA0-6, TB0-6, TC0-6, TD0-6 and CLKIN.
Table 5. LV-CMOS DC Specifications
LVDS Transmitter DC Specifications
Over recommended operating supply and temperature range unless otherwise specified
Parameter
Conditions
Min
Typ*
Max
Unit
Normal swing
250
350
450
mV
RS=VCC
VOD
Differential Output Voltage RL=100Ω
Reduced
swing
100
200
300
mV
RS=GND
∆VOD
Change in VOD between
complementary
output
35
mV
states
VOC
Common Mode Voltage
RL=100Ω
1.125
1.25
1.375
V
∆VOC
Change in VOC between
complementary
output
35
mV
states
IOS
Output
Short
Circuit
VOUT=GND, RL=100Ω
-24
mA
Current
Output
TRI-STATE
/PDWN=GND,
IOZ
10
A
Current
VOUT=GND to VCC
*Typ values are at the conditions of VCC=3.3V and Ta = +25ºC
Table 6. LVDS Transmitter DC Specifications
Symbol
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LVCMOS & LVDS Transmitter AC Specifications
Over recommended operating supply and temperature range unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Unit
tTCIT
CLK IN Transition Time
5.0
ns
tTCP
CLK IN Period
6.25
T
125
ns
tTCH
CLK IN High Time
0.35T
0.5T
0.65T
ns
tTCL
CLK IN Low Time
0.35T
0.5T
0.65T
ns
tTCD
CLK IN to TCLK+/- Delay
3T
ns
tTS
LVCMOS Data Setup to CLK IN
2.0
ns
tTH
LVCMOS Data Hold from CLK IN
0.0
ns
tLVT
LVDS Transition Time
0.6
1.5
ns
tTOP1
Output Data Position0 (T=6.25ns ~ 20ns)
-0.15
0.0
+0.15
ns
tTop0
Output Data Position1 (T=6.25ns ~ 20ns)
T/7-0.15
T/7
T/7+0.15
ns
tTop6
Output Data Position2 (T=6.25ns ~ 20ns)
2T/7-0.15
2T/7
2T/7+0.15
ns
tTop5
Output Data Position3 (T=6.25ns ~ 20ns)
3T/7-0.15
3T/7
3T/7+0.15
ns
tTop4
Output Data Position4 (T=6.25ns ~ 20ns)
4T/7-0.15
4T/7
4T/7+0.15
ns
tTop3
Output Data Position5 (T=6.25ns ~ 20ns)
5T/7-0.15
5T/7
5T/7+0.15
ns
tTop2
Output Data Position6 (T=6.25ns ~ 20ns)
6T/7-0.15
6T/7
6T/7+0.15
ns
tTPLL
Phase Lock Loop Set
10.0
ms
*Typ values are at the conditions of VCC=3.3V and Ta = +25ºC
Table 7. LVCMOS & LVDS Transmitter AC Specifications
LVCMOS Input
90%
CLK IN
90%
10%
10%
t TCIT
t TCIT
Figure 5. CLKIN Transmission Time
LVDS Output
LVDS Output Load
Figure 6. LVDS Output Load and Transmission Time
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AC Timing Diagrams
LVCMOS Inputs
tTCP
tTCH
V DDQ
RS
VCC
0.6 ~ 1.4V
GND
VOD
350mV
200mV
CLKIN
GND
tTCL
tTH
tTS
V DDQ
Tx0-Tx6
GND
tTCD
TCLK+
VOC
TCLK-
Note :
CLKIN : Solis line denotes the setting of R/F=GND
Dashed line denotes the setting of R/F = VCC
Figure 7. LVCOMS Inputs and LVDS Clock Output Timing 1
Small Swing Inputs
RS
VREF
VCC
--0.6 ~ 1.4V VDDQ/2
GND
---
tTCP
tTCH
V DDQ
CLKIN VDDQ /2
V DDQ /2
VDDQ /2
VREF
GND
tTCL
tTS
tTH
V DDQ
VDDQ /2
Tx0-Tx6 V DDQ /2
VREF
GND
tTCD
TCLK+
VOC
TCLK-
Note :
CLKIN : Solid line denotes the setting of R/F=GND
Dashed line denotes the setting of R/F = VCC
Figure 8. LVCMOS Inputs and LVDS Output Timing 2
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LVDS Output Data Position
TCLK+/(Differential)
Vdiff = 0V
Vdiff = 0V
TA+/-
TA6
TA5
TA4
TA3
TA2
TA1
TA0
TB+/-
TB6
TB5
TB4
TB3
TB2
TB1
TB0
TC+/-
TC6
TC5
TC4
TC3
TC2
TC1
TC0
TD+/-
TD6
TD5
TD4
TD3
TD2
TD1
TD0
Previous Cycle
Next Cycle
t T OP1
t TOP0
t TOP6
t TOP5
t TOP4
t TOP3
t TOP2
Figure 9. LVDS Output Data Position
Phase Lock Loop Set Time
/PDWN
VCC
2.0V
3.0V
t
TPLL
CLKIN
V
diff
= 0V
TCLK+/-
Figure 10. PLL Lock Loop Set Time
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Spread Spectrum Clocking Tolerant
Figure 11. Spread Spectrum Clocking Tolerant
The graph indicates the range that the IC works normally under SS clock input operation.
The results are measured with a typical sample on condition of +25Cº and 3.3V, therefore these
values are for reference and do not guarantee the performance of a product under other
circumstance.
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LVDS Data Timing Diagram
Figure 12. LVDS Data Timing Diagram
THC63LVDM83D Pixel Data Mapping for JEIDA Format (6bit, 8bit Application)
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
TD6
6bit
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
Hsync
Vsync
DE
-
8bit
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
Hsync
Vsync
DE
R0
R1
G0
G1
B0
B1
N/A
Note : Use TA to TC channels and open TD channel for 6bit application.
Table 8. Data Mapping for JEIDA Format
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THC63LVDM83D Pixel Data Mapping for VESA Format (6bit, 8bit Application)
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
TD6
6bit
R0
R1
R2
R3
R4
R5
G0
G1
G2
G3
G4
G5
B0
B1
B2
B3
B4
B5
Hsync
Vsync
DE
-
8bit
R0
R1
R2
R3
R4
R5
G0
G1
G2
G3
G4
G5
B0
B1
B2
B3
B4
B5
Hsync
Vsync
DE
R6
R7
G6
G7
B6
B7
N/A
Note : Use TA to TC channels and open TD channel for 6bit application.
Table 9. Data Mapping for VESA Format
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Normal Connection
Figure 13. Typical Connection Diagram
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Notes
1) Cable Connection and Disconnection
Do not connect and disconnect the LVDS cable, when the power is supplied to the system.
2) GND Connection
Connect each GND of the PCB which THC63LVDM83D and LVDS-Rx on it.
reduction to place GND cable as close to LVDS cable as possible.
It is better for EMI
3) Multi Drop Connection
Multi drop connection is not recommended.
TCLK+
THC63LVDM83D
LVDS-RX
TCLKLVDS-RX
Figure 14. Multi Drop Connection
4) Asynchronous use
Asynchronous using such as following systems is not recommended.
CLKOUT
CLKOUT
TCLK+
DATA THC63LVDM83D
IC CLKOUT
TCLK-
LVDS-RX
IC
TCLK+
DATA THC63LVDM83D
TCLK-
CLKOUT
DATA
LVDS-RX
DATA
TCLK+
DATA THC63LVDM83D
IC CLKOUT
TCLKTCLK+
DATA THC63LVDM83D
IC
TCLK-
Figure 15. Asynchronous Use
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8.10 NOM
0.05~0.15
0.25
1.20MAX
6.10+/-0.1
Package
Figure 16. Package Diagram
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Reference Land Pattern
CY1=
10.34
HE=
e=
8.100
0.500
E=
6.10
Package
Land Pattern
Ttyp.=
0.60
Gmin=
5.50
1.90
b=
0.200
Zmax=
Xmax=
0.470
9.30
Zmax/2
Unit mm
Figure 17. Reference of Land Pattern
The recommendation mounting method of THine device is reflow soldering.
The reference pattern is using the calculation result on condition of reflow soldering.
Notes
This land pattern design is a calculated value based on JEITA ET-7501.
Please take into consideration in an actual substrate design about enough the ease of mounting, the intensity of
connection, the density of mounting, and the solder paste used, etc… The optimal land pattern size changes
with these parameters. Please use the value shown by the land pattern as reference data.
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Notices and Requests
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always apply to
the customer's design. We are not responsible for possible errors and omissions in this material. Please note if
errors or omissions should be found in this material, we may not be able to correct them immediately.
3. This material contains our copyright, know-how or other proprietary. Copying or disclosing to third parties the
contents of this material without our prior permission is prohibited.
4. Note that if infringement of any third party's industrial ownership should occur by using this product, we will
be exempted from the responsibility unless it directly relates to the production process or functions of the
product.
5. Product Application
5.1 Application of this product is intended for and limited to the following applications: audio-video device,
office automation device, communication device, consumer electronics, smartphone, feature phone, and
amusement machine device. This product must not be used for applications that require extremely
high-reliability/safety such as aerospace device, traffic device, transportation device, nuclear power control
device, combustion chamber device, medical device related to critical care, or any kind of safety device.
5.2 This product is not intended to be used as an automotive part, unless the product is specified as a product
conforming to the demands and specifications of ISO/TS16949 ("the Specified Product") in this data sheet.
THine Electronics, Inc. (“THine”) accepts no liability whatsoever for any product other than the Specified
Product for it not conforming to the aforementioned demands and specifications.
5.3 THine accepts liability for demands and specifications of the Specified Product only to the extent that the
user and THine have been previously and explicitly agreed to each other.
6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain
small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have
sufficiently redundant or error preventive design applied to the use of the product so as not to have our
product cause any social or public damage.
7. Please note that this product is not designed to be radiation-proof.
8. Testing and other quality control techniques are used to this product to the extent THine deems necessary to
support warranty for performance of this product. Except where mandated by applicable law or deemed
necessary by THine based on the user’s request, testing of all functions and performance of the product is not
necessarily performed.
9. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic
goods under the Foreign Exchange and Foreign Trade Control Law.
10. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings or
malfunction, if pins of the product are shorted by such as foreign substance. The damages may cause a
smoking and ignition. Therefore, you are encouraged to implement safety measures by adding protection
devices, such as fuses.
THine Electronics, Inc.
sales@thine.co.jp
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