Application Notes

THAN0201_Rev.2.00_E
Application Note
THAN0201_Rev.2.00_E
THC63LVDM83D/THC63LVDF(R)84C
Application Note
System Diagram and PCB Design Guideline
Date
2015/08/04
2015/10/21
2015/11/04
Copyright© 2015, THine Electronics, Inc.
Revision
Rev.1.00_E
Rev.1.10_E
Rev.2.00_E
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Contents
Contents ..................................................................................................................................................................... 2
1. TTL Data Timing Diagram ................................................................................................................................ 3
2. LVDS Data Timing Diagram ............................................................................................................................. 4
3. Examples of System Diagrams .......................................................................................................................... 5
4. Note ................................................................................................................................................................... 8
5. PCB Design Guideline....................................................................................................................................... 9
Notices and Requests ............................................................................................................................................... 10
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1. TTL Data Timing Diagram
Figure 1 and Table 1 shows the THC63LVDM83D TTL data input example for XGA(1024x768).
Figure 1. THC63LVDM83D TTL data timing diagram example (XGA, 1024x768)
Table 1. RGB ordering
MSB
6bit LSB
8bit LSB
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Red
R7
R6
R5
R4
R3
R2
R1
R0
Green
G7
G6
G5
G4
G3
G2
G1
G0
3/10
Blue
B7
B6
B5
B4
B3
B2
B1
B0
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2. LVDS Data Timing Diagram
Figure 2. THC63LVDF(R)84C LVDS data input timing diagram
Table 2. THC63LVDM83D/THC63LVDF(R)84C Pixel Data Assignment (6bit, 8bit Application)
TA0
TA1
TA2
TA3
TA4
TA5
TA6
TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2
TC3
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
TD6
6bit
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
Hsync
Vsync
DE
-
8bit
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
Hsync
Vsync
DE
R0
R1
G0
G1
B0
B1
N/A
Note: For 6bit application, use TA-TC channel and open TD+/- pin.
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3. Examples of System Diagrams
1) 8bit TTL/CMOS Input(8 to 112MHz)
Example:
THC63LVDM83D: Falling edge/Normal Swing
THC63LVDF84C: Falling edge
THC63LVDM83D
THC63LVDF84C
*1: If RS pin is tied to VCC, LVDS swing is 350mV.
If RS pin is tied to GND, LVDS swing is 200mV.
*2: Connect each PCB GND
Figure 3. System Diagram Example (8bit TTL/CMOS Input)
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2) 8bit Small Swing Input(8 to 112MHz)
Example:
THC63LVDM83D: Small Swing input/Falling edge
THC63LVDF84C: Falling edge
THC63LVDM83D
THC63LVDF84C
*1: RS pin acts as VREF input pin when input voltage is set to half of high level signal input.
*2: Connect each PCB GND
Figure 4. System Diagram Example (8bit Small Swing Input)
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3) 6bit TTL/CMOS Input(8 to 112MHz)
Example:
THC63LVDM83D: Falling edge/Normal Swing
THC63LVDF84C: Falling edge
THC63LVDM83D
THC63LVDF84C
*1: If RS pin is tied to VCC, LVDS swing is 350mV.
If RS pin is tied to GND, LVDS swing is 200mV.
*2: Connect each PCB GND
Figure 5. System Diagram Example (6bit TTL/CMOS Input)
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4. Note
1) Power On Sequence
Power on THC63LVDM83D after THC63LVDF(R)84C is powered on.
2) Cable Connection and Disconnection
Don’t connect and disconnect the LVDS cable, when the power is supplied to the system.
3) GND Connection
Connect the each GND of the PCB which THC63LVDM83D and THC63LVDF(R)84C on it. It is
better for EMI reduction to place GND cable as close to LVDS cable as possible.
4) Multi Drop Connection
Multi drop connection is not recommended.
Figure 6. Multi Drop Connection Example (not recommended)
5) Asynchronous Use
Asynchronous use such as following systems is not recommended.
CLKOUT
TCLK+
THC63LVDM83D
DATA
TCLK-
CLKOUT
TCLK+
CLKOUT
LVDS-Rx
DATA
IC
IC
DATA
TCLK-
THC63LVDM83D
CLKOUT
RCLK+
LVDS-Tx
DATA
LVDS-Rx
DATA
CLKOUT
THC63LVDF84C
DATA
RCLK-
IC
IC
RCLK+
CLKOUT
LVDS-Tx
DATA
CLKOUT
RCLK-
DATA
THC63LVDF84C
TCLK+
THC63LVDM83D
DATA
TCLK-
CLKOUT
TCLK+
IC
IC
DATA
TCLK-
THC63LVDM83D
RCLK+
THC63LVDF84C
CLKOUT
DATA
RCLK-
IC
IC
RCLK+
RCLK-
THC63LVDF84C
DATA
Figure 7. Asynchronous Use Examples (not recommended)
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5. PCB Design Guideline
General Guideline
• Use 4 layer PCB (minimum).
• Locate by-pass capacitors adjacent to the device pins as close as possible.
• Make the loop minimum which is consist of Power line and Gnd line.
LVDS Traces
• Interconnecting media between Transmitter and Receiver (i.e. PCB trace, connector, and cable) should be well
balanced.(Keep all these differential impedance and the length of media as same as possible.).
• Minimize the distance between traces of a pair (S1) to maximize common mode rejection. See following figure.
• Place adjacent LVDS trace pair at least twice (>2 x S1) as far away as much as possible.
• Avoid 90 degree bends.
• Minimize the number of VIA on LVDS traces.
• Match impedance of PCB trace, connector, media (cable) and termination to minimize reflections (emissions) for
cabled applications (typically 100ohm differential mode characteristic impedance).
• Place Terminal Resister adjacent to the Receiver.
Figure 8. PCB Design Guideline
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Notices and Requests
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always apply to
the customer's design. We are not responsible for possible errors and omissions in this material. Please note if
errors or omissions should be found in this material, we may not be able to correct them immediately.
3. This material contains our copyright, know-how or other proprietary. Copying or disclosing to third parties the
contents of this material without our prior permission is prohibited.
4. Note that if infringement of any third party's industrial ownership should occur by using this product, we will
be exempted from the responsibility unless it directly relates to the production process or functions of the
product.
5. Product Application 5.1 Application of this product is intended for and limited to the following applications:
audio-video device, office automation device, communication device, consumer electronics, smartphone,
feature phone, and amusement machine device. This product must not be used for applications that require
extremely high-reliability/safety such as aerospace device, traffic device, transportation device, nuclear power
control device, combustion chamber device, medical device related to critical care, or any kind of safety device.
5.2 This product is not intended to be used as an automotive part, unless the product is specified as a product
conforming to the demands and specifications of ISO/TS16949 ("the Specified Product") in this data sheet.
THine Electronics, Inc. (“THine”) accepts no liability whatsoever for any product other than the Specified
Product for it not conforming to the aforementioned demands and specifications. 5.3 THine accepts liability for
demands and specifications of the Specified Product only to the extent that the user and THine have been
previously and explicitly agreed to each other.
6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain
small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have
sufficiently redundant or error preventive design applied to the use of the product so as not to have our product
cause any social or public damage.
7. Please note that this product is not designed to be radiation-proof.
8. Testing and other quality control techniques are used to this product to the extent THine deems necessary to
support warranty for performance of this product. Except where mandated by applicable law or deemed
necessary by THine based on the user’s request, testing of all functions and performance of the product is not
necessarily performed.
9. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic
goods under the Foreign Exchange and Foreign Trade Control Law.
10. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings or
malfunction, if pins of the product are shorted by such as foreign substance. The damages may cause a
smoking and ignition. Therefore, you are encouraged to implement safety measures by adding protection
devices, such as fuses.
THine Electronics, Inc.
sales@thine.co.jp
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