Reliability Data Report Product Family R539 LTC3601 / LTC3604 / LTC3605 / LTC3607 / LTC3621 / LTC3622 / LTC3624 / LTC3626 / LTC3633 / LTC3643 Reliability Data Report Report Number: R539 Report generated on: Fri Dec 04 15:58:41 PST 2015 OPERATING LIFE TEST PACKAGE TYPE SOIC/MSOP QFN/DFN Totals SAMPLE SIZE 231 767 998 OLDEST DATE NEWEST DATE K DEVICE HRS 1 No. of FAILURES 2,3 CODE CODE (+125°C) 1210 0822 - 1238 1304 - 231 664 895 0 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/MSOP QFN/DFN Totals 1046 50 2789 3,885 OLDEST DATE NEWEST DATE CODE CODE 1024 1233 1021 - 1418 1233 1422 - 26 1 248 275 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1024 1233 1021 - 1418 1233 1419 - 104 5 2016 2,125 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1024 1233 1021 - 1418 1233 1419 - 99 5 1930 2,034 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 0936 - 1214 - 234 234 0 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 1217 - 1419 - 13759 13,759 0 0 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/MSOP QFN/DFN Totals 1046 50 14649 15,745 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/MSOP QFN/DFN Totals 992 50 14202 15,244 HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/MSOP Totals 234 234 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN Totals 14533 14,533 (1) Assumes Activation Energy = 0.7 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =13.24 FITS (3) Mean Time Between Failure in Years = 8622.54 Note: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL1 Preconditioning