05-08-1732

DE Package
16-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1732 Rev Ø)
0.70 ± 0.05
3.30 ± 0.05
3.60 ± 0.05
2.20 ± 0.05
1.70 ± 0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.45 BSC
3.15 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ± 0.10
(2 SIDES)
R = 0.05
TYP
9
R = 0.115
TYP
0.40 ± 0.10
16
3.30 ± 0.10
3.00 ± 0.10
(2 SIDES)
1.70 ± 0.10
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.75 ± 0.05
(DE16) DFN 0806 REV Ø
8
1
0.23 ± 0.05
0.45 BSC
3.15 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
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