LTC3643 - 2A Bidirectional Power Backup Supply

LTC3643
2A Bidirectional
Power Backup Supply
FEATURES
DESCRIPTION
Bidirectional Synchronous Boost Capacitor
Charger/Buck Regulator for System Backup
nn Wide Input Voltage Range: 3V to 17V
nn Up to 40V Capacitor Voltage Storage for High Energy Backup
nn 2A Maximum CAP Charge Current
nn Integrated Power N-Channel MOSFETs
(150mΩ Top and 75mΩ Bottom)
nn Integrated Power N-Channel MOSFET for Output/CAP
Disconnect (50mΩ)
nn Input Current Limit During Charging
nn Fast 1MHz Switching Frequency
nn ±1% Reference Accuracy for System Voltage Regulation
nn Indicator Outputs for Charge Status and Input Power Fail
nn Low Profile 24-lead 3mm × 5mm QFN Package
The LTC®3643 is a bidirectional synchronous step-up
charger and step-down converter which efficiently charges
a capacitor array up to 40V from an input supply between
3V to 17V. When the input supply falls below the programmable power-fail threshold, the step-up charger operates
in reverse as a synchronous step-down regulator to power
the system rail from the backup capacitor during this power
interuption/failure condition.
nn
When charging the backup capacitor, an external low-value
sense resistor may be used to maintain an accurate current limit from the input supply or implement PowerPath™
functionality.
The step-down converter operates at a 1MHz switching
frequency, allowing small external components to be used.
Low quiescent current during regulation maximizes the
energy usage from the backup capacitor.
APPLICATIONS
L, LT, LTC, LTM, Burst Mode, Linear Technology and the Linear logo are registered trademarks
and PowerPath is trademarks of Linear Technology Corporation. All other trademarks are the
property of their respective owners. Protected by U.S. Patents. Including 5481178, 6580258,
6498466, 6611131, 5705919.
Backup Capacitor Systems
nn Power Failure Backup Systems
nn Solid-State Drives
nn
TYPICAL APPLICATION
Approximate Charge/Backup Time Per
1mF of Storage Cap (40V Backup)
40V Backup System Regulating System Supply to 5V
500
4.7µH
CLP VIN INDIS
GATE
35.7k
0.1µF
47µF
SW BOOST
40V BACKUP
CAP
INTVCC
RUN
22µF
4.7µF
PFI
LTC3643
44.2k
392k
FBCAP
FBSYS
12.1k
6.04k
6.04k
+
1mF
ENERGY
STORAGE
ITH
CAPGD
PFO
SYSTEM LOAD
22pF
470pF
CHARGE TIME
BACKUP TIME WITH 2A LOAD
BACKUP TIME WITH 1A LOAD
BACKUP TIME WITH 0.5A LOAD
400
300
200
100
0
400k
GND
CHARGE/BACKUP TIME (ms)
0.01Ω
POWER
SUPPLY
3
6
9
12
SYSTEM LOAD VOLTAGE (V)
15
3643 TA01b
3643 TA01a
3643fb
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1
LTC3643
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Note 1)
ILIM
NC
NC
CLP
TOP VIEW
24 23 22 21
PGND 1
20 SW
PGND 2
19 SW
CAP 3
18 SW
VIN 4
17 INDIS
25
SGND
VIN 5
16 INDIS
GATE 6
15 BOOST
RUN 7
14 INTVCC
13 PFI
FBSYS 8
PFO
CAPGD
ITH
9 10 11 12
FBCAP
VIN.............................................................. –0.3V to 17V
RUN................................................... –0.3V to VIN+0.3V
CLP............................................................. –0.3V to 17V
CAP............................................................. –0.3V to 42V
BOOST-SW.................................................... –0.3V to 4V
INTVCC, FBSYS, FBCAP................................. –0.3V to 4V
PFI................................................................ –0.3V to 4V
ILIM..............................................–0.3V to VINTVCC+0.3V
PFO, CAPGD................................................. –0.3V to 6V
Operating Junction Temperature Range
(Note 2).............................................. –40°C to 125°C
Storage Temperature Range................... –65°C to 150°C
Lead Temperature (Soldering, 10sec).................... 260°C
UDD PACKAGE
24-LEAD (3mm × 5mm) PLASTIC QFN
TJMAX = 125°C, θJA = 46°C/W, θJC = 5.0°C/W
EXPOSED PAD (PIN 25) IS SGND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
(http://www.linear.com/product/LTC3643#orderinfo)
LEAD FREE FINISH
TAPE AND REEL
LTC3643EUDD#PBF
LTC3643EUDD#TRPBF
LTC3643IUDD#PBF
LTC3643IUDD#TRPBF
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LGSX
24-Lead (3mm × 5mm) Plastic QFN
–40°C to 125°C
LGSX
24-Lead (3mm × 5mm) Plastic QFN
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through
designated sales channels with #TRMPBF suffix.
2
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LTC3643
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TJ = 25°C. VIN = 5V, VRUN = 2V unless otherwise noted. (Note 2)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
VIN
Operating Voltage
VIN
CAP
3.0
IQ-IN
Input Quiescent Current
Active Mode
Burst Mode®
Shutdown Mode; RUN = 0V
800
400
10
RDS(ON)
Switch A On Resistance
Switch B On Resistance
Switch C On Resistance
VCAP >= VIN
VINTVCC = 3.3V
VBOOST = 8.3V
50
75
150
ISW
Top Switch Leakage
Bottom Switch Leakage
VCAP = 40V, VSW = 0
VCAP = VSW = 40V
0.1
0.1
MAX
UNITS
17
40
V
V
800
20
µA
µA
µA
mΩ
mΩ
mΩ
1
1
µA
µA
40
V
Boost Charger Regulation
VCAP
Cap Voltage
VFBCAP
Regulated Output Feedback Voltage
IFBCAP
FBCAP Input Current
gm(EA)
Error Amplifier Transconductance
ILIM-BOOST
Peak Inductor Current Limit
(Bottom Switch Peak Limit)
tOFF(MIN)-BOOST
Minimum Off-Time
fSW
Switching Frequency
l
ITH = 1.2V
l
0.594
0.6
0.606
V
±10
nA
210
270
330
µS
3.0
2.8
3.2
3.4
A
A
70
ns
1
Input Current Limit Amplifier Regulated Voltage
VCLP-VIN
MHz
l
48.5
46
50
50
51.5
54
mV
mV
l
0.594
0.6
0.606
V
±10
nA
2.6
3.2
3.7
4.5
4.7
5.6
A
A
A
A
A
A
Buck Regulator Voltage Regulation
VFBSYS
Regulated System Feedback Voltage
IFBSYS
FBSYS Input Current
ILIM-BUCK
Valley Inductor Current Limit
(Bottom Switch Valley Limit)
ILIM = FLOAT
l
2.0
l
2.9
l
3.8
ILIM = 0V
ILIM = VINTVCC
tON(MIN)-BUCK
Minimum On-Time
30
ns
INTVCC Regulator
INTVCC Regulated Voltage
INTVCC UVLO
INTVCC Rising
3.0
3.2
3.4
V
2.6
2.75
2.9
V
1.12
1.2
100
1.28
V
mV
0
±10
nA
1.0
1.1
1.05
1.15
V
V
3
20
6
40
µs
µs
I/O Pins
VRUN
VPFI
RUN High Rising
RUN Hysteresis
l
RUN Input Current
VRUN = 12V, VIN = 12V
PFI Input Threshold
Falling
Rising (100mV hysteresis)
PFI Delay Time
Falling
Rising
l
l
0.95
1.05
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3
LTC3643
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TJ = 25°C. VIN = 5V, VRUN = 2V unless otherwise noted. (Note 2)
SYMBOL
PARAMETER
CONDITIONS
GATE Turn-on Time
GATE Turn-off Time
TYP
MAX
To CLP-GATE > 2.5V, CGATE = 1nF
70
100
µs
To CLP-GATE < 1V, CGATE = 1nF
3
6
µs
GATE Pull-Down Current
UNITS
45
70
95
µA
550
570
15
590
mV
mV
CAPGD Resistance
170
250
Ω
/PFO Resistance
170
250
Ω
CAPGD Threshold
l
FBCAP Rising
Hysteresis
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2. The LTC3643 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3643E is guaranteed to meet specified performance from
0°C to 85°C. Specifications over the –40°C to 125°C operating junction
4
MIN
temperature range are assured by design, characterization and correlation
with statistical process controls. The LTC3643I is guaranteed over the
full –40°C to 125°C operating junction temperature range. Note that the
maximum ambient temperature consistent with these specifications is
determined by specific operating conditions in conjunction with board layout,
the rated package thermal impedance and other environmental factors.
TJ is calculated from the ambient TA and power dissipation PD according
to the following formula: TJ = TA + (PD • θJA)
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LTC3643
TYPICAL PERFORMANCE CHARACTERISTICS
Step-Up Charging Waveform
PFO
5V/DIV
IL
1A/DIV
VCAP
20V/DIV
CAPGD
2V/DIV
IL
2A/DIV
VCAP
10V/DIV
VCAP
10V/DIV
VLOAD
10V/DIV
VIN
10V/DIV
IL
1A/DIV
VLOAD
10V/DIV
VIN
10V/DIV
3643 G01
100ms/DIV
3643 G02
400ms/DIV
Shutdown Current vs VIN
VIN = 5V
VCAP = 40V
VLOAD = 5V, (SYSTEM LOAD)
ILOAD = 100mA
RDS(ON) vs Temperature
16
Frequency vs Temperature
300
14
2
250
12
RDSON (mΩ)
8
6
FREQUENCY (MHz)
1.5
10
200
TOP FET
150
BOTTOM FET
100
50
2
3
5
7
11
9
VIN (V)
13
15
17
0
–50
–25
50
25
0
75
TEMPERATURE (°C)
100
125
1000
900
800
700
VCAP
RIPPLE
2V/DIV
VOUT
RIPPLE
200mV/DIV
IL
1A/DIV
IL
2A/DIV
7
11
9
VIN (V)
13
15
17
3643 G07
100
125
ILOAD (LOAD)
2A/DIV
400µs/DIV
5
50
25
0
75
TEMPERATURE (°C)
Step-Down Regulator Transient
Response
ICAP
200mA/DIV
600
–25
3643 G06
Step-Up Regulator Transient
Response
Frequency vs VIN
3
0
–50
3643 G05
3643 G04
500
1
0.5
4
0
3643 G03
400ms/DIV
VIN = 12V
VCAP = 40V
VLOAD = 5V
ILOAD = 100mA
VIN = 5V
VCAP = 40V
NO LOAD
START-UP FROM RUN
FREQUENCY (KHz)
Step-Up to Step-Down Handoff
Waveform
Step-Down Discharge Waveform
RUN
5V/DIV
SHUTDOWN CURRENT (µA)
TA = 25°C, unless otherwise noted.
3643 G08
VIN = 5V
VCAP = 40V
ICAP = 14mA TO 200mA
L = 7.2µH
COUT = 47µF
100µs/DIV
3643 G09
VCAP = 40V
VLOAD = 5V
L = 2.2µH
ILOAD = 400mA TO 2.4A (SYSTEM LOAD)
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5
LTC3643
TYPICAL PERFORMANCE CHARACTERISTICS
Run Rising Threshold
vs Temperature
TA = 25°C, unless otherwise noted.
Step-Up Regulator Light Load
Switching Waveform
Step-Down Regulator Light Load
Switching Waveform
1.6
RUN RISING THRESHOLD (V)
1.5
1.4
1.3
1.2
1.1
1
SW
20V/DIV
SW
20V/DIV
IL
1A/DIV
IL
2A/DIV
VCAP
RIPPLE
200mV/DIV
VLOAD
RIPPLE
100mV/DIV
3643 G11
10µs/DIV
0.9
0.8
–50
–25
25
75
50
0
TEMPERATURE (°C)
100 125
3643 G10
Quiescent Current vs Temperature
2µs/DIV
VIN = 5V
VCAP = 40V
ILOAD (CAP) = 14mA
CCAP = 40µF
L = 7.2µH
VCAP = 40V
VLOAD = 5V
VIN = 4.5V
ILOAD (LOAD) = 110mA
L = 2.2µH
Charging Waveform with
Programmed Current Limit
Switch Leakage Current
vs Temperature
1000
500
400
ACTIVE MODE
IL
1A/DIV
600
300
SWITCH LEAKAGE (nA)
IQ (µA)
800
ILOAD
2A/DIV
SLEEP MODE
400
200
100
BOTTOM SWITCH
0
–100
TOP SWITCH
–200
200
0
–50
–300
3643 G14
2ms/DIV
–400
RSENSE = 10mΩ
–25
50
25
0
75
TEMPERATURE (°C)
100
–500
–50
125
–25
50
25
0
75
TEMPERATURE (°C)
3643 G13
100
90
VIN = 5V
60
VIN = 12V
50
40
VCAP = 40V
30
60
50
40
30
20
10
10
0.1
0.01
CAP CURRENT (A)
1
VCAP = 24V
70
20
0
0.001
VCAP = 12V
80
EFFICIENCY (%)
EFFICIENCY (%)
80
70
125
Step-Down Regulator Efficiency
vs Load
100
90
100
3643 G15
Step-Up Regulator Efficiency
vs Cap Current
0
0.001
3643 G16
6
3643 G12
VCAP = 40V
VLOAD = 5V
0.1
1
0.01
LOAD CURRENT (A)
10
3643 G17
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LTC3643
PIN FUNCTIONS
PGND (Pins 1-2): Ground Pins for the Power Switch.
CAP (Pin 3): Storage Capacitor Connection. This pin is
the power input to the step-down regulator’s main switch
(boost regulator’s synchronous switch) and connects
directly to the backup energy storage capacitor.
VIN (Pins 4-5): Input Supply of Boost Charger and Regulated
Output Voltage of Step-Down Regulator. This input also
powers the INTVCC LDO and input to the current regulation amplifier.
GATE (Pin 6): Gate Driver for PowerPath Switch. This pin
drives the gate of an external PMOS switch that connects
the main power supply to the system load. This output
swings from VIN to GND.
RUN (Pin 7): Logic Controlled RUN Input. Do not leave
this pin floating. Place a resistor divider from VIN to GND
for an accurate VIN Undervoltage threshold.
FBSYS (Pin 8): Feedback Input to Step-Down Regulator
Control Loop. Connect a resistor divider tap to this pin. The
VIN voltage can be adjusted such that VIN = 0.6V (1+R2/R1)
(See Figure 4).
FBCAP (Pin 9): Feedback Input to the Error Amplifier of the
Cap Voltage Regulation Loop. Connect a resistor divider
tap to this pin. The CAP voltage can be adjusted such that
VCAP = 0.6V (1+R4/R3) (See Figure 5).
ITH (Pin 10): Error Amplifier Output and Switching
Regulator Compensation Point for the Boost Regulator.
The current comparator’s trip threshold is linearly
proportional to this voltage. The Buck Regulator’s
compensation is set internally by the part.
CAPGD (Pin 11): Capacitor Good Open Drain Status Output.
This output is pulled down when the LTC3643 is charging
the storage capacitor. It becomes high impedance when
the output cap reaches 95% of the programmed charge
voltage.
PFO (Pin 12): Power Fail Open Drain Status Output. This
pin pulls down when the main supply voltage is above the
threshold set by the PFI pin.
PFI (Pin 13): Power Fail Input. This pin sets the threshold
at which the converter switches from boost charger mode
to buck regulator mode. Connect with a resistor divider
from the main power supply in order to switch to buck
regulator mode when the supply voltage drops below a
set threshold.
INTVCC (Pin 14): Low Dropout Regulator. Bypass with a
low ESR capacitor of at least 1µF to ground.
BOOST (Pin 15): Boost Rail. Connect a 0.1µF capacitor
between this pin and SW node to power the gate driver
of the synchronous boost switch.
INDIS (Pins 16-17): Input Disconnect Pin. The Internal
power switch that allows for Output Disconnect feature
is placed between the VIN and INDIS pins.
SW (Pins 18-20): Switch Node Connection to the Power
Regulator.
ILIM (Pin 21): Buck Mode Peak Current Program Pin.
Leave this pin floating for 3A current limit, ground it for
2A current limit, and tie it to INTVCC for 4A current limit
during buck mode.
CLP (Pin 24): Input to Current Regulation Amplifier. This
pin is the inverting input to a current regulation amplifier
that reduces the charging current when CLP rises more
than 50mV above VIN.
SGND (Exposed Pad Pin 25): Signal Ground Pin of the
Regulator. Tie to PGND at a single point. Connect to PCB
ground plane for rated thermal performance.
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7
LTC3643
BLOCK DIAGRAM
INDIS
VIN
TOP SWITCH
(SWITCH C)
SW
BOOST
CAP
INPUT DISCONNECT
SWITCH
(SWITCH A)
VIN
RUN
ON/OFF
BOTTOM
COMPARATOR
CHARGE
PUMP
LDO
+
–
PGND
INTVCC
INTVCC
GATE
(VIN – 6V)
BOTTOM
SWITCH
(SWITCH B)
CHARGE/BUCK
ILIM
GATE DRIVE
PGND
PGND
PFI
FBSYS
1.1V
+
–
0.6V
+
BUCK
LOGIC
BOOST
LOGIC
+
ERROR
AMPLIFIER
ERROR
AMPLIFIER
–
–
0.6V
FBCAP
ITH
CAPGD
50mV
PFO
VIN
STATUS
ON-TIME/
OFF-TIME
CALCULATOR
CAP
+
–
SENSE
AMPLIFIER
+
–
VIN
CLP
SGND
8
3643fb
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LTC3643
OPERATION
The LTC3643 is a bidirectional regulator capable of delivering power from VIN to CAP (storage capacitor) as well
as from CAP back to VIN, depending on the state of the
PFI voltage.
The duration for which power can be held up at VIN
depends on the amount of system load, the size of the
energy storage CAP, and the voltage at which the CAP
node was charged to.
When the PFI voltage is high, signifying that the power
supply is good, power is delivered from VIN to CAP as
illustrated in Figure 1. In this mode, LTC3643 operates
as a peak current mode constant off-time boost regulator
with input disconnect. In this mode, power can be directly
delivered from the power supply to the system load, and
be used to charge the energy storage element on CAP.
The LTC3643 operates with pseudo-constant frequency,
which is set solely by the on-time/off-time, which is
internally calculated based on the VIN and CAP voltages
and set to be 1MHz. Under light output load conditions,
the LTC3643 operates in Burst Mode and skips pulses to
minimize system power loss. As the output load current
increases, the LTC3643 seamlessly transitions to continuous PWM switching to deliver output power. Though the
LTC3643 can be configured to operate as a standalone boost
regulator with input disconnect, it is primarily targeted at
applications where a high voltage energy storage capacitor
needs to be charged for the purposes of delivering power
back to VIN to maintain system regulation in “dying gasp”
situations when the system supply is removed.
When the PFI Voltage is low, signifying that the power
supply is below the necessary threshold, power delivery
is reversed, it operates as a valley current mode constant
on-time buck regulator, and delivers power from CAP to
power VIN for as long as possible. The power path is illustrated in Figure 2.
POWER SUPPLY
CLP
VIN
INDIS
SW
SYSTEM
LOAD
BOOST
CAP
ENERGY
STORAGE
ON/OFF
CHARGE
PUMP
INTVCC
GATE
GATEDRIVE
1.1V
PFI
+
–
CHARGE/BUCK
BUCK
LOGIC
BOOST
LOGIC
3643 F01
Figure 1. Power Path Block – Power Available from Power Source
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9
LTC3643
OPERATION
POWER SUPPLY
CLP
VIN
INDIS
SW
SYSTEM
LOAD
BOOST
CAP
ENERGY
STORAGE
ON/OFF
CHARGE
PUMP
INTVCC
GATE
GATEDRIVE
1.1V
PFI
+
CHARGE/BUCK
–
BUCK
LOGIC
BOOST
LOGIC
3643 F01
Figure 2. Power Path Block – Power Available from Energy Storage Element
Boost Mode Control Loop
When the PFI voltage is above 1.1V, the input power
source is deemed to be good, and power will be delivered
from VIN to CAP. If there is sufficient load on CAP or if the
CAP voltage has yet to reach its final programmed value,
the step-up regulator will switch continuously to deliver
the necessary power. Under these circumstances, the
bottom switch will turn on, thus ramping up the current
in the inductor. Once that current reaches a certain level,
which is set by the ITH voltage, the switch will turn off and
allow the top (synchronous) switch to turn on. The top
switch will remain on for a fixed duration (off-time) before
shutting off to allow for the cycle to repeat.
The off-time is calculated such that in steady state, the
regulator will operate at a frequency around 1MHz. Thus,
the off-time is equal to:
V
tOFF−BOOST = 1µs • IN
VCAP
10
The boost mode control loop is compensated through
the external ITH pin, and the method of compensating the
loop will be discussed in more detail in the applications
information section.
Boost Mode Low Current Operation
Once the CAP voltage has reached its programmed voltage,
and the load is minimal, the LTC3643 will automatically
transition from continuous mode operation to Burst Mode
operation. In this mode, the ITH voltage will transition above
and below the sleep threshold depending on the CAP voltage.
If the CAP voltage decreases slightly below its regulation
point, the regulator will wake up from sleep, and the bottom
switch will turn on until the inductor current reaches the burst
current clamp of 800mA. Once that value is reached, the bottom switch turns off and the top switch turns on for a fixed
duration, tOFF-BOOST. This switching cycle will repeat until the
CAP has replenished enough to force the ITH voltage below
the sleep threshold. Once that happens, both switches are
turned off and the quiescent current is decreased to 400µA.
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LTC3643
OPERATION
Boost Mode Startup
The LTC3643 will begin to operate if the RUN voltage is
raised above 1.2V and VIN is greater than 3V. In order
to prevent conduction from the VIN to CAP through the
body diode of the top switch, an input disconnect switch
is placed between VIN and INDIS. The body diode of the
disconnect switch and that of the top switch are opposite
in polarity in order to prevent conduction of current when
CAP is less than VIN. The gate of the disconnect switch
remains grounded until the regulator begins to operate.
Once started, an internal charge pump will slowly charge
up the gate of the disconnect switch and regulate that
gate voltage such that only 100mA of current is flowing
through the switch. That 100mA will thus conduct through
the inductor between INDIS and SW, and the body diode
of the top switch to charge up the capacitor at the CAP
node. The 100mA limit is set as a way to limit the power
dissipation through the disconnect switch and the top
switch, and protect those switches from overheating.
During this period, the voltage at INDIS and SW will be
clamped at a diode above CAP.
Once the INDIS voltage approaches VIN, and it is sensed
that the internal disconnect switch is fully enhanced,
an internal signal is issued to allow the top and bottom
switches to operate as needed to charge the CAP voltage
up to its programmed value.
Boost Output Over-Current/Short Operation
The current through the disconnect switch is constantly
being monitored to resolve overcurrent situations. Once
the switch is fully enhanced, if the current through the
disconnect switch ever exceeds 4.8A, a signal is sent to
the control circuitry to keep the top switch on indefinitely
until that current level subsides.
During an output short situation, if the CAP voltage were
to ever collapse below the VIN voltage, then simply leaving
the top switch on to discharge the inductor current would
not work. In these situations, if the current through the
disconnect switch ever exceeds 8A, the gate of the disconnect switch is immediately pulled down, thus effectively
shutting off the disconnect switch. At the same time, both
the top and bottom switches are shut off. The current in
the inductor will then conduct through the body diode of
the top switch and decrease down to 0A. From there, the
internal charge pump will slowly charge back up the gate
of the disconnect switch and regulate the current through
the switch to 100mA, much like the case in startup.
Buck Mode Control Loop
If the PFI voltage falls below 1.15V, power will be delivered
from CAP to VIN. If the system load at VIN is high enough,
the regulator will switch continuously. In a typical cycle,
the top switch is turned on for a fixed duration (on-time).
Once that duration expires, the top switch turns off and
the bottom switch is turned on; inductor current is allowed
to discharge until a valley current level is reached, at a
threshold set by an internally compensated ITH voltage.
Once that current level is reached, the bottom switch
turns off and the top switch turns back on again and the
cycle repeats.
The on-time is once again calculated such that in steady
state, the regulator will operate at a frequency around
1MHz. Thus, the on-time is equal to:
V
tON−BUCK = 1µs • IN
VCAP
The buck mode control loop is compensated by an internal
RC network and the external ITH pin is grounded through
an internal switch.
Buck Mode Low Current Operation
When VIN reaches the programmed regulation voltage and
a minimal load is present, the regulator will automatically
transition into Burst Mode operation. In this mode, the ITH
voltage will transition above and below the sleep threshold
depending on the VIN voltage. If the VIN voltage decreases
slightly below its regulation point, the regulator will wake
up from sleep, and the top switch will turn on for a fixed
duration, tON-BUCK. Then, the top switch will turn off and the
bottom switch will turn on until the inductor current reaches
0A. This switching cycle will repeat until the VIN voltage
has replenished enough to force the ITH voltage below the
sleep threshold. Once that happens, both switches are
turned off and the quiescent current is decreased to 400µA.
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11
LTC3643
OPERATION
Buck Mode End of Charge Operation
The energy reservoir on CAP will continue to supply
energy to keep VIN at the regulation point for as long as
possible. However, at some point, if the system load at
VIN continues to be present, the CAP voltage will drop low
enough such that the VIN regulation voltage can no longer
be maintained due to minimum off-time restrictions. The
minimum off-time restriction is present because during
every cycle, the bottom switch needs to turn on. Once
such a condition is reached, the VIN voltage will regulate to
roughly 93% of the CAP voltage. The switching regulator
will continue to operate in such a manner until either the
RUN voltage falls below 1.1V or the VIN voltage falls below
what is necessary for the regulator to operate (typically
2.8V). When either of those situations is reached, both
the top and bottom switches are turned off, and the gate
of the disconnect switch is pulled low.
Boost/Buck Switchover Operation
The LTC3643 transitions between boost and buck modes
of operation depending on the PFI voltage. If the PFI
voltage goes above 1.2V, it is deemed that power at the
input supply is good and the boost phase is engaged.
If the PFI voltage falls below 1.15V, it is deemed that
the input supply is no longer high enough to supply the
system load, and buck phase is engaged. The PFO pin is
an indicator pin that will display if there is an input power
fail. Connect a pull-up resistor from that pin to a known
rail (<6V). A high on that pin indicates the input supply
is insufficient.
The transition from boost to buck mode is relatively fast
(~2µs) in order to prevent the voltage on VIN to deplete
too much before the buck regulator engages, whereas the
transition from buck to boost is somewhat slower (~20µs).
This time delay, combined with the 50mV hysteresis on the
PFI threshold voltage, helps eliminate momentary glitches
on the PFI pin, and prevents unnecessary mode transitions.
current into the depleted power supply. Placing a Schottky
between the power supply and CLP will achieve that result,
but would result in significant power dissipation through
the diode when the power supply is present at high load.
To mitigate this power loss, an external power PMOS device with low RDSON can be used in place of the Schottky
with its gate connected to the GATE pin of the LTC3643.
When the application transitions from boost mode to buck
mode, the GATE voltage will instantaneously get pulled
up to VIN, thus shutting off the external PMOS. When the
power supply becomes ready again, the GATE voltage will
get pulled low slowly with a 70µA current source, and that
voltage will be internally clamped to go no lower than 6V
below VIN.
Boost Mode Current Limiting
If the power supply is current limited, the LTC3643 has
the capability of limiting the input current of the boost
regulator to ensure that the cumulative current of the
boost regulator and the system load does not exceed a
programmed amount. That current limit is programmed
by the sense resistor between the CLP and VIN pins.
In the application example of figure 3, a 10mΩ resistor is
placed between CLP and VIN. The voltages across those
pins are designed to not exceed 50mV. Thus, a cumulative
5A is allowed to flow through the boost regulator (I1) and
the system load (I2). If I2 in the application is 4A, then
a maximum of 1A of current can flow through the boost
regulator. If I2 is minimal, then I1 will be limited by the
maximum current of the boost regulator. Furthermore, if
I2 exceeds the 5A limit, the ITH voltage of the regulator
will get pulled low and the part will enter its sleep mode.
POWER SUPPLY
CLP
GATE
Gate Control for External PMOS Switch
Often times, when the VIN voltage falls below the PFI
threshold and buck mode is engaged, it is required to have
a blocking element present to prevent back conduction of
12
I2
10mΩ
VIN
I1
INDIS
SW
BOOST
SYSTEM
LOAD
CAP
LTC3643
3643 F03
Figure 3. PowerPath of Boost Regulator with CLP Programmability
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LTC3643
OPERATION
INTVCC Regulator
Output Voltage Programming
The LTC3643 has an onboard Low Dropout Regulator
powered from VIN, and the INTVCC voltage is regulated to
3.3V. The power dissipated across this LDO would thus be
equal to (VIN – 3.3V) • IINTVCC. For a typical application, if
the regulator is running in continuous mode, the current
draw from the INTVCC by the chip is roughly 10mA.
The step down converter output VIN and the step-up
charger output VCAP are set by an external resistive divider
according to the following equations:
VIN Undervoltage Programming
⎛ R4 ⎞
VCAP = 0.6V ⎜ 1+ ⎟
⎝ R3 ⎠
The LTC3643 offers an accurate RUN threshold to start
the regulator. As a result, a resistor divider from VIN to
GND can be placed with the intermediate node fed back
to RUN to set an accurate VIN Undervoltage threshold.
As the input voltage rises, the RUN voltage will increase
above the VRUN rising threshold (1.2V), and the regulator will turn on. Similarly, once on, if the input voltage
decreases below the VRUN falling threshold (1.1V), the
regulator will turn off.
⎛ R2 ⎞
VIN = 0.6V ⎜ 1+ ⎟
⎝ R1⎠
To improve the frequency response, a feedforward capacitor CFF may also be used. Great care should be taken to
route the FBSYS or FBCAP line away from noise sources,
such as the inductor or the SW trace.
VIN
R2
VCAP
CFF
R4
FBSYS
LTC3643
CFF
FBCAP
LTC3643
R1
SGND
R3
SGND
3643 F04
3643 F05
Figure 4. Setting The VIN Voltage In Step-Down Mode
Figure 5. Setting The VCAP Voltage In Step-Up Mode
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LTC3643
APPLICATIONS INFORMATION
Input Capacitor (CIN) Selection
If the LTC3643 is only used in the boost direction, then
the input filter capacitor is only required to reduce peak
currents drawn from the input source and reduce input
switching noise. A low ESR bypass capacitor with a value
of at least 4.7µF should be located as close to the VIN pin
as possible.
However, in applications where buck mode is engaged,
more bypass capacitance is required. The selection of
CIN is determined by the effective series resistance (ESR)
that is required to minimize voltage ripple and load step
transients as well as the amount of bulk capacitance that
is necessary to ensure that the control loop is stable. Loop
stability can be checked by viewing the load transient
response. The Input ripple, ΔVIN, is determined by:
⎛
⎞
1
ΔVIN < ΔIL ⎜
+ESR⎟
⎝ 8 • f •CIN
⎠
The output ripple is highest at maximum input voltage
since ΔI L increases with input voltage. Multiple
capacitors placed in parallel may be needed to meet the
ESR and RMS current handling requirements. Dry tantalum, special polymer, aluminum electrolytic, and ceramic
capacitors are all available in surface mount packages.
Special polymer capacitors are very low ESR but have
lower capacitance density than other types. Tantalum
capacitors have the highest capacitance density but it is
important to only use types that have been surge tested
for use in switching power supplies. Aluminum electrolytic
capacitors have significantly higher ESR, but can be used
in cost sensitive applications provided that consideration
is given to ripple current ratings and long-term reliability.
Ceramic capacitors have excellent low ESR characteristics
and small footprints.
Using Ceramic VIN and CAP Capacitors
Higher value, lower cost ceramic capacitors are now becoming available in smaller case sizes. Their high ripple
current, high voltage rating and low ESR make them ideal
for switching regulator applications. However, care must
be taken when these capacitors are used at the input and
output. When a ceramic capacitor is used at the input and
14
the power is supplied by a wall adapter through long wires,
a load step at the output can induce ringing at the VCAP
input. At best, this ringing can couple to the output and
be mistaken as loop instability. At worst, a sudden inrush
of current through the long wires can potentially cause a
voltage spike at VCAP large enough to damage the part.
When choosing the input and output ceramic capacitors,
choose the X5R and X7R dielectric formulations. These
dielectrics have the best temperature and voltage characteristics of all the ceramics for a given value and size.
Since the ESR of a ceramic capacitor is so low, the input
and output capacitor must instead fulfill a charge storage
requirement. In both the buck mode and boost mode cases,
during a load step, the VIN and CAP capacitor respectively
must instantaneously supply the current to support the
load until the feedback loop raises the switch current
enough to support the load.
Typically in buck mode, ~5 cycles are required to respond
to a load step but only in the first cycle does the VIN voltage
drop linearly. The VIN voltage droop, VDROOP, is usually
about 3 times the linear drop of the first cycle. Thus, a good
place to start with the VIN capacitor value is approximately:
ΔIIN
CIN = 3
f 0 • VDROOP
The boost mode response is typically much slower than
that of the buck and has a dependency on the duty cycle
of the application. Typically, the loop response will be at
least 3 times slower than that of the buck. Thus, more
ceramic capacitance at CAP may be required. However,
in most applications, the LTC3643 will be used to charge
a bulk capacitor in which case placing the 22µF ceramic
capacitor in parallel to the bulk capacitor just to filter out
the square wave current is sufficient.
Inductor Selection
Given the desired input and output voltages, the inductor value and operating frequency (1MHz) determine the
ripple current:
ΔIL =
VIN ⎛
VIN ⎞
1–
⎜
⎟
VCAP(MAX) ⎠
106 • L ⎝
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Lower ripple current reduces core losses in the inductor
and reduces VIN voltage ripple. However, at extremes,
low ripple causes inductor current sensing issues. Highest efficiency operation is obtained at low frequency with
reasonably small ripple current. However, achieving this
requires a large inductor. There is a trade-off between
component size, efficiency and operating frequency.
A reasonable starting point is to choose a ripple current
that is about 50% of IOUT(MAX). To guarantee that ripple
current does not exceed specified inductor saturation current ratings, the inductance should be chosen according to:
Different core materials and shapes will change the size/
current and price/current relationship of an inductor. Toroid
or shielded pot cores in ferrite or permalloy materials are
small and don’t radiate much energy, but generally cost
more than powdered iron core inductors with similar
characteristics. The choice of which style inductor to use
mainly depends on the price versus size requirements
and any radiated field/EMI requirements. New designs for
surface mount inductors are available from Toko, Vishay,
NEC/Tokin, Cooper, TDK and Würth Electronik. Refer to
Table 1 for more details.
Boost Mode Transient Response
⎛
⎞
VIN
⎜1–
⎟
L= 6
10 • ΔIL(MAX) ⎜⎝ VCAP(MAX) ⎟⎠
VIN
Once the value for L is known, the type of inductor must
be selected. Core loss is very dependent on the material,
frequency and inductance selected. Higher inductance
reduces ripple. Unfortunately, increased inductance
requires more turns of wire and therefore copper losses
will increase.
Ferrite materials have very low core losses and are
preferred at high switching frequencies, so design goals
can concentrate on copper loss and preventing saturation.
Ferrite core material saturates “hard”, which means that
inductance collapses abruptly when the peak design current
is exceeded. This results in an abrupt increase in inductor
ripple current and consequent output voltage ripple. Do
not allow the core to saturate!
The LTC3643 in boost mode uses peak current mode
control compensated with an RC network on the external
ITH pin. The ITH external component network shown in
Figure 6 will provide an adequate starting point for most
applications. The RC filter sets the dominant pole-zero
loop compensation. The values can be modified to
optimize transient response once the PC layout is done and
the particular output capacitor type and value have been
determined. The output capacitors need to be selected
because their various types and values determine the
loop feedback factor gain and phase. An output current
pulse of 20% to 100% of full load current having a rise
time of 1µs to 10µs will produce output voltage and ITH
pin waveforms that will give a sense of the overall loop
stability without breaking the feedback loop.
Table 1. Inductor Selection Table
Vendor
P/N
L
(µH)
I
(A)
L
(mm)
W
(mm)
H
(mm)
Coilcraft
XAL5030(50)-XXX
0.16-22
31-3.6
5.28
5.48
3.1-5.1
Coilcraft
XAL6030(60)-XXX
0.18-22
39-5.6
6.36
6.56
3.1-6.1
SUMIDA
CDEP1Ø5NP-XXX
0.15-8.8
55-4
10
10
5.6
SUMIDA
CEP125NP-XXX
0.8-10
35-5
12.9
12.9
5.6
Wurth Elekt.
744393580XX
1-10
17-5.8
8.3
8.8
7.8
Wurth Elekt.
7440280000XX
0.056-6.8
6-0.55
2.8
2.8
1.1
Coiltronics
DR73-XXX-R
0.33-1000
14.4-0.25
6.0
7.6
3.55
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LTC3643
APPLICATIONS INFORMATION
POWER SUPPLY (5V)
C2
0.1µF
L1
4.7µH
CLP
VIN
INDIS
SW
47µF
BOOST
GATE
CAP
LTC3643
ITH
CITH2
2.2pF
SYSTEM LOAD
FBCAP
RITH
402k
CITH1
470pF
SGND
PGND
3643 F06
40V
RFB1
392k
COUT
47µF
ROUT
RFB2
6.04k
Figure 6. 5V to 40V Boost Application
Figure 7 shows a simplified block diagram for the application in Figure 6, and can be used to analyze the stability
of the application with the given compensation components.
0.6V
+
–
AEA
ERROR
AMPLIFIER
VITH
GMP
IOUT
POWER STAGE
TRANSCONDUCTANCE
AMPLIFIER
ZOUT
VOUT
OUTPUT
IMPEDANCE
AFB
A = η• VIN A / A
MP
VCAP
Where η is the efficiency of the regulator. Assuming a 90%
efficiency and a 5V in to 40V out application:
3643 F07
FEEDBACK
GAIN
Figure 7. Block Diagram of the Boost Regulator
AEA signifies the voltage gain of the internal error amplifier. It translates a difference of FB input error to the
output ITH voltage. The gm of the error amplifier, gm(EA),
is fixed to the regulator and is typically 210µmho. With the
compensation network on ITH, for frequencies above the
error amplifier zero, Z1, the gain is roughly AEA(FLATBAND).
1
Z1 =
= 0.85kHz
2π
•R
•C
ITH
ITH1
AEA(FLATBAND) = gm(EA)•RITH1 = 82.8V / V
CITH2 is used purely to filter out high frequency signals
and as long as it is sized significantly smaller than CITH1,
it should not affect the loop stability of the regulator.
16
GMP is the transconductance gain from VITH to IOUT.
Because of the architecture of the regulator, the gain from
VITH to IL (inductor current) is fixed internally to be 3mmho.
Furthermore, the DC gain from IL to IOUT is equal to AMP:
AMP = 0.1125 A/A
The AC component of the Gmp can be mainly attributed
to the RHP zero of the boost regulator, Z2:
Z2 =
VIN2
2π •POUT(MAX) •L1
Hz
Since POUT(MAX) = VIN • IL(MAX) • η,
Z2 =
VIN
= 94kHz
2π • η•IL(MAX) •L1
The total loop must be compensated such that the crossover
frequency is at least 10× slower than that of Z2.
ZOUT is the output impedance of the application. It has a
DC gain of ROUT and a pole at P1:
1
P1 =
Hz
2π •ROUT •COUT
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As a result, the load pole has a unity gain impedance at:
1
= 6.8kHz
2π •COUT
The last component of the loop is AFB, which is the gain
from VOUT to VFB, and in this application, it is simply
0.015 V/V.
For a rough estimation of the crossover frequency of the
entire loop, analysis can be done at frequency Z1. At that
frequency:
AEA ≈ AEA(FLATBAND) = 82.8V / V
GMP ≈ 3 • AMP = 0.33Ω
ZOUT ≈
equal to the ∆ILOAD • ESR, where ESR is the effective
series resistance of CIN. ∆ILOAD also begins to charge or
discharge CIN generating a feedback error signal used
by the regulator to return VIN to its steady-state value.
During this recovery time, VIN can be monitored for overshoot or ringing that would indicate a stability problem.
The compensation for the buck mode of the LTC3643 is
implemented internal to the IC.
The initial output voltage step may not be within the
bandwidth of the feedback loop, so the standard second
order overshoot/DC ratio cannot be used to determine
phase margin.
The output voltage settling behavior is related to the stability
of the closed-loop system and will demonstrate the actual
overall supply performance. For a detailed explanation of
optimizing the compensation components, including a
review of control loop theory, refer to Application Note 76.
PZ
= 8Ω
Z1
AFB = 0.015V / V
The total loop gain at Z1 is thus equal to the product of
all the components which is 3.27V/V. In addition, at that
frequency, since the zero frequency of the error amplifier
has already been reached, the system looks like a single
pole system, thus making the crossover frequency roughly:
3.27 • Z1 = 2.8kHz.
For applications where a large energy reservoir capacitor
is placed in parallel to the COUT, the ZOUT component of
the block diagram needs to be remodeled, but often times,
the zero frequency of the ESR of the large capacitor and
its capacitance is well below the crossover frequency of
the loop, and can be ignored in analyzing the stability of
the loop.
Buck Mode Transient Response
The buck mode transient response can be checked by
looking at the load response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, VIN immediately shifts by an amount
In some applications, a more severe transient can be caused
by switching in loads with large (>1µF) input capacitors.
The discharged input capacitors are effectively put in
parallel with CIN, causing a rapid drop in VIN. No regulator can deliver enough current to prevent this problem if
the switch connecting the load has low resistance and is
driven quickly. The solution is to limit the turn-on speed of
the load switch driver. A Hot Swap controller is designed
specifically for this purpose and usually incorporates
current limiting, short-circuit protection and soft-starting.
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can
be expressed as:
% Efficiency = 100% – (L1 + L2 + L3 +…)
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LTC3643
APPLICATIONS INFORMATION
where L1, L2, etc. are the individual losses as a percentage
of input power. Although all dissipative elements in the
circuit produce losses, three main sources usually account
for most of the losses in LTC3643 circuits: 1) I2R losses,
2) switching and biasing losses, and 3) other losses.
1.I2R losses are calculated from the DC resistances of
the internal switches, RSW, and external inductor, RL.
In continuous mode, the average input current flows
through inductor L and front end disconnect switch
but is “chopped” between the internal top and bottom
power MOSFETs. Thus, the series resistance looking
into the SW pin is a function of both top and bottom
MOSFET RDS(ON) and the duty cycle (DC) as follows:
RSW = (RDS(ON)TOP)(1-DC) + (RDS(ON)BOT) (DC) +
RDS(ON)BLKFET
The RDS(ON) for both the top and bottom MOSFETs can be
obtained from the Typical Performance Characteristics
curves. Thus to obtain I2R losses:
I2R losses = IL2(RSW + RL)
2.The switching current is the sum of the MOSFET driver
and control currents. The power MOSFET driver current
results from switching the gate capacitance of the power
MOSFETs. Each time a power MOSFET gate is switched
from low to high to low again, a packet of charge dQ
moves from VIN to ground. The resulting dQ/dt is a
current out of VIN that is typically much larger than the
DC control bias current. In continuous mode, IGATECHG
= f(QT + QB), where QT and QB are the gate charges of
the internal top and bottom power MOSFETs and f is
the switching frequency. The power loss is thus:
switch quickly enough that these losses are not significant compared to other sources. Other losses including
diode conduction losses during dead-time and inductor
core losses which generally account for less than 2%
total additional loss.
Thermal Conditions
In a majority of applications, the LTC3643 does not dissipate much heat due to its high efficiency and low thermal
resistance of its exposed-back QFN package. However, in
applications where the LTC3643 is running at high ambient
temperature, high VIN, and maximum output load current,
the heat dissipated may exceed the maximum junction
temperature of the part. If the junction temperature reaches
approximately 160°C, both power switches will be turned
off until the temperature drops about 15°C cooler.
To avoid the LTC3643 from exceeding the maximum
junction temperature, some thermal analysis must be done.
The goal of the thermal analysis is to determine whether
the power dissipated exceeds the maximum junction
temperature of the part. The temperature rise is given by:
tRISE = PD • θJA
As an example, consider the case when the LTC3643 is
used in applications where VIN = 5V, IL = 2A, and VCAP =
40V. The equivalent power MOSFET resistance RSW is:
RSW = RDS(ON)TOP •
+R
DS(ON)BLKFET
= 150mΩ •
Switching Loss = IGATECHG • VIN
3.Other “hidden” losses such as transition loss and copper trace and internal load resistances can account for
additional efficiency degradations in the overall power
system. It is very important to include these “system”
level losses in the design of a system. Transition loss
arises from the brief amount of time the top power
MOSFET spends in the saturated region during switch
node transitions. The LTC3643 internal power devices
18
⎛
VIN
V ⎞
+RDS(ON)BOT • ⎜ 1– IN ⎟
VCAP
⎝ VCAP ⎠
5V
5V ⎞
⎛
+ 75mΩ • ⎜ 1–
+ 50mΩ
⎝ 40V ⎟⎠
40V
= 134mΩ
Typically, the current drawn from INTVCC will be 10mA.
Therefore, the total power dissipated by the part is:
PD =IOUT 2 •RSW + VIN •IINTVCC
= 4A 2 •134mΩ + 5V •10mA
= 587.5mW
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The QFN package junction-to-ambient thermal resistance,
θJA, is around 46°C/W. Therefore, the junction temperature
of the regulator operating in a 25°C ambient temperature
is approximately:
TJ = 0.587W • 46°C/W + 25°C = 52°C
Remembering that the above junction temperature is
obtained from an RDS(ON) at 25°C, we might recalculate
the junction temperature based on a higher RDS(ON) since
it increases with temperature. Redoing the calculation
assuming that RSW increased 10% at 52°C yields a new
junction temperature of 54.4°C. If the application calls
for a higher ambient temperature and/or higher switching
frequency, care should be taken to reduce the temperature
rise of the part by using a heat sink or air flow.
Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3643. Check the following in your layout:
1.Do the capacitors CCAP connect to the CAP and GND
terminals as close as possible?
2.Are CIN and L closely connected? The (–) plate of CIN
returns current to GND and the (–) plate of CCAP.
3.Solder the Exposed Pad (Pin 25) on the bottom of the
package to the GND plane. Connect this GND plane to
other layers with thermal vias to help dissipate heat
from the LTC3643.
4.Keep sensitive components away from the SW pin. The
compensation components CITH and RITH, all resistor
dividers, and the INTVCC bypass caps should be routed
away from the SW trace and the inductor.
5.A ground plane is required.
6.Flood all unused areas on all layers with copper, which
reduces the temperature rise of power components.
These copper areas should be connected to GND.
Holdup Time Calculation
The amount of energy available in the energy reservoir
capacitor before the voltage droops below the desired
backup voltage is equal to:
(
1
ECAP = CCAP VCAP 2 – VIN2
2
)
The amount of energy necessary to complete the backup
is equal to:
ELOAD = ISYS • VIN • tHT
Where tHT is the amount of backup time needed.
Assuming an efficiency of η (this number will vary depending on the application), the total amount of backup
time will be equal to:
2
2
ECAP • η CCAP VCAP – VIN • η
tHT =
=
ISYS • VIN
2 •ISYS • VIN
(
)
Where ISYS is the system load during backup.
Design Example
As a design example, consider the LTC3643 in an application with the following specifications:
VIN = 4V to 8V
VCAP = 40V
ICAP (Input) = 2A
Given the internally programmed switching frequency of
1MHz, we can calculate the inductor value for about 40%
ripple current (800mA based on an average of 2A output
current) at maximum VIN:
8V
8V ⎞
⎛
⎞⎛
L=⎜
1−
= 8µH
⎝ 1MHz • 0.8A ⎟⎠ ⎜⎝ 40V ⎟⎠
Given this, an 8.2µH inductor would suffice.
CCAP and CIN will be selected based on what is required to
satisfy the output voltage ripple requirement for the boost
and buck modes respectively. A 22µF or 47µF capacitor
on both nodes is adequate for most applications.
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LTC3643
APPLICATIONS INFORMATION
CCAP Size Selection for System Backup Power
Applications
This section of the data sheet will discuss how large to
size the CAP capacitor, CCAP, to insure that there is sufficient energy to hold up the Input supply when power is
removed. Consider the design example where:
VIN = 5V
VCAP = 40V
Holdup Time (tHT) = 10msec
System Current Load (ISYS) = 2A
The total Energy required during holdup time is equal to:
EDISS = VIN • ISYS • tHT = 100mW-sec
(
CAP Capacitor (CCAP) Selection
When selecting CAP capacitors, the magnitude of the
peak inductor current, together with the ripple voltage
specifications, determine the choice of the capacitor. Both
the ESR (equivalent series resistance) of the capacitor and
the charge stored in the capacitor each cycle contribute
to the output voltage ripple.
The ripple due to the charge is approximately:
Total energy available is equal to:
E AVAL =
is recommended to be at least 30% larger than required.
In this particular case, four 47µF capacitors (188µF total)
would be recommended.
VRIPPLE(CHARGE) ≅
IP • VIN
CCAP • VCAP • f
where IP is the peak inductor current.
)
CCAP
VCAP 2 – VIN2 = 787.5 •CCAP (W-sec)
2
Since the regulator is not lossless, the efficiency needs to
be taken into consideration, such that:
The ESR of the CCAP is usually the most dominant factor
for ripple in most power converters. The ripple due to the
capacitor ESR is:
VRIPPLE(ESR) =ILOAD •RESR •
VOUT
VIN
EAVAL • eff > EDISS
EDISS
CCAP = eff •E
where RESR is equal to the capacitor ESR.
AVAL
Assuming an efficiency of 90%, with 100mW-sec required
by the system, CCAP needs to be at least 141µF.
In applications where a large energy storage capacitor is
used, a smaller ceramic bypass capacitor is still required
close to the regulator due to its low ESR. Typically, a 22µF
ceramic capacitor is sufficient for most applications.
To be conservative, and to account for some voltage
coefficient and tolerance of the capacitors, the capacitor
20
3643fb
For more information www.linear.com/LTC3643
VIN 5V-60V
0.1µF
37.4k
22µF
2.2µF
4.7nF
15k
+
For more information www.linear.com/LTC3643
INTVCC
VFB
BG
SW
TG
BOOST
ILIM
SENSE+
SENSE–
MODE/PLL
PGND
SGND
SGND
ITH
RUN
TK/SS
PGOOD
FREQ
LTC3891
EXTVCC
VIN
SIR826ADP
SIR826ADP
0.1µF
2.2µF
6.8µH
XAL7070-682
220µF
VOUT = 5V
137k
511k
5.11k
1M
37.4k
511k
511k
0.01Ω
5V Backup System with VIN From 5V to 60V
+
61.9k
324k
3mΩ
20pF
4.7µF
SI4491
SGND
PGND
RUN
PFO
CAPGD
PFI
GATE
FBSYS
ILIM
INTVCC
ITH
FBCAP
CAP
BOOST
SW
SW
INDIS
IN
CLP
INDIS
IN
LTC3643
4.7µF
3643 TA02
0.1µF
7.2µH
+
SYSTEM
LOAD
5.11k
322k
2×
4.7µF
40V BACKUP
22pF
47µF
*PANASONIC EEEFK1H102AM
470pF
402k
10µF
1000µF*
+2×
LTC3643
TYPICAL APPLICATIONS
3643fb
21
22
VIN 5V-36V
+
47µF
2.2µF
7.15k
0.1µF
5.1V
100k
PGND
VFB
SS
FCB
RUN
VIN
SGND
SENSE–
RSENSE
SENSE+
SW2
SW1
VOUT
LTM4607
180µF 2.2µF
511k
SI4491
For more information www.linear.com/LTC3643
1M
5.11k
97.6k
511k
511k
0.01Ω
SGND
PGND
RUN
PFO
CAPGD
PFI
GATE
FBSYS
ILIM
INTVCC
ITH
FBCAP
CAP
BOOST
SW
SW
INDIS
IN
CLP
INDIS
IN
LTC3643
12V Backup System for Automotive Applications
**TOKO FDA1254-4R7
56.2k
0.008Ω
10µH**
+
VOUT 12V
4.7µF
3643 TA03
0.1µF
+
470pF
402k
15µH
XAL5050-153M
22µF
SYSTEM
LOAD
2×
4.7µF
1000µF*
+ 2×
*PANASONIC EEEFK1H102AM
5.11k
322k
40V BACKUP
22pF
180µF
LTC3643
TYPICAL APPLICATIONS
3643fb
LTC3643
TYPICAL APPLICATIONS
Temporary Supply Booster
5V SOURCE
0.1Ω
100mΩ
CABLE/TRACE RESISTANCE
22µF
CLP
VIN
INDIS
RUN
BOOST
BACKUP SUPPLY
40V
ILIM
CAPGD
PFO
SW
SYSTEM LOAD
4A
0A
CAP
GATE
44.2k
47µF
x2
0.1µF
7.2µH
22µF
1mF
INTV CC
4.7µF
LTC3643
FBSYS
392k
FBCAP
6.04k
6.04k
ITH
402k
PFI
GND
22pF
470pF
NOTE: DRIVE PFI PIN HIGH WHEN HIGH LOAD IS PRESENT TO MAINTAIN
DESIRED VOLTAGE AT THE SYSTEM LOAD
3643fb
For more information www.linear.com/LTC3643
23
LTC3643
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/product/LTC3643#packaging for the most recent package drawings.
UDD Package
24-Lead Plastic QFN (3mm × 5mm)
(Reference LTC DWG # 05-08-1833 Rev Ø)
0.70 ±0.05
3.50 ±0.05
2.10 ±0.05
3.65 ±0.05
1.50 REF
1.65 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
3.50 REF
4.10 ±0.05
5.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 ±0.10
0.75 ±0.05
1.50 REF
23
R = 0.05 TYP
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
24
0.40 ±0.10
PIN 1
TOP MARK
(NOTE 6)
5.00 ±0.10
1
2
3.65 ±0.10
3.50 REF
1.65 ±0.10
(UDD24) QFN 0808 REV Ø
0.200 REF
0.00 – 0.05
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
24
3643fb
For more information www.linear.com/LTC3643
LTC3643
REVISION HISTORY
REV
DATE
DESCRIPTION
A
12/15
Changed Typical Application graph
PAGE NUMBER
1
B
02/16
Updated ILIM pin description wording
7
Updated voltage from 1.2V to 1.1V on PFI comparator of Figure 1
9
Updated voltage from 1.2V to 1.1V on PFI comparator of Figure 2
10
3643fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection
of its information
circuits as described
herein will not infringe on existing patent rights.
For more
www.linear.com/LTC3643
25
LTC3643
TYPICAL APPLICATION
40V Synchronous Boost Regulator with Input Disconnect
VIN
3V TO 17V
7.2µH
22µF
CLP VIN INDIS
GATE
0.1µF
SW BOOST
INTVCC
RUN
VOUT
40V
CAP
PFI
LTC3643
392k
FBCAP
FBSYS
6.04k
ITH
CAPGD
PFO
47µF
4.7µF
108k
GND
47pF
3.3nF
3643 TA04
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC3110
2A Bi-Directional Buck-Boost DC/DC Regulator and
Charger/Balancer
VCAP Range: 0.1V to 5.5V VSYS Range 1.71V to 5.25V, Automatic Switchover
from Charge to Backup Mode. 24-Lead TSSOP and 4mm × 4mm QFN
Packages.
LTC3128
3A Monolithic Buck-Boost Supercapacitor Charger
and Balancer with Accurate Input Current Limit
±2% Accurate Average Input Current Limit Programmable to 3A, Active Charge
Balancing, Charges 1 or 2 Capacitors, VIN Range: 1.73V to 5.5V, VOUT Range:
1.8V to 5.5V, 20-Lead 4mm × 5mm QFN and 24-Lead TSSOP Packages
LTC3226
2-Cell Supercapacitor Charger with Backup
PowerPath Controller
1x/2x Multimode Charge Pump Supercapacitor Charger, Automatic Cell
Balancing, PowerPath, 2A LDO Backup Supply, Automatic Main/Backup
Switchover, 2.5V to 5.5V, 16-Lead 3mm × 3mm QFN Package
LTC3350
High Current Supercapacitor Backup Controller and
System Monitor
High Efficiency Charging of 1 to 4 Series Supercapacitors. Step-Up Mode in
Backup, System Health Monitoring. 38-Lead 5mm × 7mm QFN Package.
LTC3355
20V, 1A Buck DC/DC with Integrated SCAP Charger
and Backup Regulator
VIN: 3V to 20V, VOUT: 2.7V to 5V, 1A Main Buck Regulator, 5A Boost Backup
Regulator Powered from Single Supercapacitor, Overvoltage Protection.
20-Lead 4mm × 4mm QFN Package
LTC3625
1A High Efficiency 2-Cell Supercapacitor Charger
with Automatic Cell Balancing
High Efficiency Step-Up/Step-Down Charging of Two Series Supercapacitors.
Automatic Cell Balancing. Programmable Charging Current to 500mA (Single
Inductor), 1A (Dual Inductor). 12-Lead 3mm × 4mm DFN Package
LTC4425
Linear SuperCap Charger with Current-Limited Ideal
Diode and V/I Monitor
Constant-Current/Constant-Voltage Linear Charger for 2-Cell Series
Supercapacitor Stack. VIN: Li-Ion/Polymer Battery, a USB Port, or a 2.7V to
5.5V Current-Limited Supply. 2A Charge Current, Automatic Cell Balancing,
Shutdown Current <2μA. 12-Pin 3mm × 3mm DFN or 12-Lead MSOP Package
LTC4040
2.5A Battery Backup Power Manager
VIN: 3.5V to 55V Contains a High Current Step-Up DC/DC Regulator to Back-Up
the Supply from A Single Cell Li-Ion LiFePO4 Battery, 24-Lead 4mm × 5mm
QFN Package
26 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/LTC3643
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/LTC3643
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LT 0216 REV B • PRINTED IN USA
 LINEAR TECHNOLOGY CORPORATION 2015