August 1, 2011 Revision History PCN# Issue Date 07A-11 May 2, 2011 07B-11 May 2, 2011 07C-11 August 1, 2011 Subject: Description Initial release. Exhibit B “Affected Device List” has been updated to include the LFX125EB products. Withdrawal of all previous versions of this PCN Withdrawal of PCN# 07B-11 Dear Lattice Customers: Lattice is withdrawing this Notification effective immediately. The original intent of this Notice was to establish alternate Bills of Materials to expand our manufacturing capacity in light of the material shortages that were feared as a result of the Japan earthquake of March 2011. Material shortages have been resolved and steps have been taken to assure supply going forward. As a result, Lattice is no longer planning to go forward with the Alternate Qualified Material Sets identified in this Notice. Sincerely, Lattice Semiconductor PCN Administration PCN#07B-11, #06B-11 and ACN#03C-11 also issued on May 2, 2011 will supersede ACN#03B-11, issued on April 5, 2011. May 2, 2011 Revision History 07A-11 May 2, 2011 07B-11 May 2, 2011 Subject: Description N Issue Date Initial release. Exhibit B “Affected Device List” has been updated to include the LFX125EB products. D R AW PCN# PCN# 07B-11, Notification of Intent to Utilize an Alternate Qualified Material Set for Select Chip Scale BGA, Ultra Chip Scale BGA, Chip Array BGA, Fine Pitch Thin BGA, Fine Pitch BGA and Plastic BGA Packages Dear Lattice Customers: Lattice is providing this Notification of our intent to utilize an alternate qualified material set for select devices in Chip Scale Ball Grid Array (csBGA), Ultra Chip Scale Ball Grid Array (ucBGA), Chip Array Ball Grid Array (caBGA), Fine Pitch Thin Ball Grid Array (ftBGA), Fine Pitch Ball Grid Array (fpBGA) and Plastic Ball Grid Array (BGA) packages. H In an effort to diversify our source of supply, and reduce risk of supply interruption, Lattice will now maintain alternate qualified Bills of Material (BOMs) for select csBGA / usBGA / caBGA / ftBGA / fpBGA / BGA packages. Both ASE Malaysia and UTAC Singapore utilize industry standard raw materials, W IT Singapore*. Alternate BOMs will be qualified at ASE Malaysia* and at UTAC assembly and test processes. These material sets meet all external package dimensions and package footprints remain the same and are published on the Lattice web site (www.latticesemi.com). Lattice is taking this action in response to the major Japan earthquake of March 11, 2011. This urgent response to the risk of supply interruption creates a need for immediate qualification of these alternate BOMs. Lattice will provide a limited set of package samples using the alternate BOMs for select die / package combinations to assist customer conversions. Sample availability plans are shown in Exhibit A. *Note: At this time, no changes are planned to BGA Package BOMs used at Amkor Philippines, Amkor Korea, ASE Taiwan, or Unisem Indonesia. Lattice Semiconductor Home Page: http://www.latticesemi.com Applications & Literature Hotline: 1-800-LATTICE Copyright 2011 Lattice Semiconductor Corporation. Lattice Semiconductor, L(stylized) Lattice Semiconductor Corporation, Lattice (design), ispLSI, LatticeEC, LatticeECP, LatticeECP2, ispGDX, ispPAC, Platform Manager, ispMACH, MachXO, MachXO2, LatticeXP, LatticeXP2, ispXPLD and ORCA are either registered trademarks or trademarks of Lattice Semiconductor Corporation in the United States and/or other countries. Other product names used in this publications are for identification purposes only and may be the trademarks of their respective companies. Page 2 AFFECTED DEVICES AND APPLICABLE CHANGES The affected devices and applicable changes are summarized in Exhibit B. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape & reel, etc.), which are derived from any of the devices listed. ALTERNATE QUALIFIED MATERIAL SET DEVICE MARKING AND IDENTIFICATION N The complete material set used for each package type is described in Exhibit C. D R AW Lattice does not plan to change the device marking or identification for the alternate materials. Our assembly subcontractors will use the existing and alternate BOMs as required to meet production demand. The current topside Date Code Mark provides complete traceability to the assembly vendor and BOM used for all material. Due to the critical nature of this situation, Lattice is not able to accommodate specific BOM requests. The existing and alternate BOMs will be qualified and available for use interchangeably. QUALIFICATION AND CHARACTERIZATION DATA Reliability testing for the qualification of these ASE Malaysia and UTAC Singapore manufactured csBGA / usBGA / caBGA / ftBGA / fpBGA / BGA packages is in progress. The Qualification Plan and Timing are shown in Exhibit D. An updated PCN will be posted to the Lattice web site when H qualification milestones are completed. In accordance with Lattice PCN Policy, changes to BGA laminate substrate core material are not typically reported. Qualification of these materials is completed by the assembly subcontractor, and W IT reported to Lattice prior to use. To support recent customer requests for additional information, a qualification summary for the qualified BGA laminate core materials is shown in Exhibit F. Shipment of products with qualified BGA laminate cores will not be restricted to the timing for this PCN. Product Performance Characterization of the qualification vehicle devices for these ASE Malaysia and UTAC Singapore manufactured BGA packages is in progress. The characterization plan is shown in Exhibit E. Characterization data will be reported with the qualification milestone updates. DATA SHEET SPECIFICATIONS This PCN has no impact on any data sheet specifications. Page 3 CONVERSION TIMING Use of the Alternate BOMs will begin no sooner than October 3, 2011 (Note: this schedule may change in the event of further supply chain interruption). Any significant changes to the Qualification and Characterization schedule, or changes in material availability, will be reported in an updated PCN. Lattice recommends expedited approval of this PCN to ensure continued supply of product. N CONVERSION TIMING – Summary ACN Issue Date: April 5, 2011 PCN Issue Date: May 2, 2011 Early Qualification and Characterization Date: Late June, 2011 Final Qualification and Characterization Date: Late July, 2011 PCN Expiration Date: October 3, 2011 RESPONSE D R AW In accordance with JESD46-C, this change is deemed accepted by the customer if no acknowledgement is received within 30 days from this Notice. Lattice PCNs are available on the Lattice website. Please sign up to receive e-mail PCN alerts by registering here. If you already have a Lattice web account and wish to receive PCN alerts, you can CONTACT H do so by logging into your account and making edits to your subscription options. If you have any questions or require additional information, please contact [email protected]. W IT Sincerely, Lattice Semiconductor PCN Administration Page 4 EXHIBIT “A” – PCN Evaluation Sample Availability1 Vendor Die Attach Mold Compound Pb-Free 256-ftBGA FTN256 ASE Malaysia No Yes LCMXO1200C Pb-Free 256-ftBGA FTN256 UTAC Singapore Yes Yes LCMXO2280C Pb-Free 324-ftBGA FTN324 ASE Malaysia No Yes LC4512V Pb-Free 256-ftBGA FTN256 UTAC Singapore No Yes LFXP2-30E Pb-Free 256-ftBGA FTN256 ASE Malaysia No Yes LFE3-70EA Pb-Free 672-fpBGA FN672 ASE Malaysia No Yes LFE3-150EA Pb-Free 1156-fpBGA FN1156 ASE Malaysia No Yes LFE2M20E Pb-Free 484-fpBGA FN484 ASE Malaysia No Yes LFE2M100E Pb-Free 900-fpBGA FN900 ASE Malaysia No Yes LC5256MV Pb-Free 256-fpBGA FN256 ASE Malaysia No Yes D R AW LCMXO640C Package Type N Package Designator Product W IT H 1. Sample availability targeted for end of July EXHIBIT “B” – PCN Device Listing and Applicable Changes UTAC Singapore ispGDX160VA 208-fpBGA B208 BN208 P ispGDX240VA 388-fpBGA B388 BN388 P LX128V/EV 208-fpBGA F208 FN208 P 208-fpBGA B208 P 272-BGA B272 P 208-fpBGA B208 P 272-BGA B272 P 388-BGA B388 P 272-BGA B272 P 388-BGA B388 P 256-fpBGA F256 P 272-BGA B272 P 256-fpBGA F256 P 272-BGA B272 P 256-fpBGA F256 P 272-BGA B272 P 388-BGA B388 P 388-fpBGA F388 208-fpBGA B208 BN208 P 256-ftBGA FT256 FTN256 P P 256-ftBGA FT256 FTN256 P P 256-ftBGA FT256 FTN256 P P 56-csBGA M56 MN56 P 132-csBGA M132 MN132 P 56-csBGA M56 MN56 P LC4128ZC 132-csBGA M132 MN132 P LC4256ZC 132-csBGA M132 MN132 P LC4032ZE 64-csBGA MN64 P 144-csBGA MN144 P 64-csBGA MN64 P 64-ucBGA UMN64 P 132-ucBGA UMN132 P 144-csBGA MN144 P 144-csBGA MN144 P ispLSI 5384VA ispLSI 5384VE ispLSI 5000VE ispLSI 5512VE ispLSI 2128VE LC4256V/B/C LC4384V/B/C IT H LC4512V/B/C LC4032ZC ispMACH 4000ZC ASE Malaysia B208 ispLSI 5256VE ispMACH® 4000 Halogen-Free 208-fpBGA ispLSI 5512VA ispLSI ® 2000VE Pb-Free ispGDX160V ispLSI 5256VA ispLSI 5000VA Package Code Pb LC4064ZC LC4064ZE W ispMACH 4000ZE LC4128ZE LC4256ZE P AW N ispGDX2™ Package Type R ispGDX ® Product Line D Product Family P Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. Page 6 EXHIBIT “B” – PCN Device Listing and Applicable Changes (Cont’d) ispMACH 5000VG ® ispXPGA ASE Malaysia 256-fpBGA FA FAN P 256-fpBGA FA FAN P M4A3-384/192 256-fpBGA FA FAN P M4A3-512/192 256-fpBGA FA FAN P LC5768VG 484-fpBGA F484 LC51024VG 484-fpBGA F484 LFX125EB LFX200B/EB 256-fpBGA F256 FN256 P 256-fpBGA F256 FN256 P LC5256MB/V 256-fpBGA F256 FN256 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 256-fpBGA F256 FN256 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 484-fpBGA F484 FN484 LC5768MV LFEC3E LFEC6E LFEC10E LFEC15E IT H LFEC20E LFEC33E LFECP6E LFECP10E LFECP15E W LatticeECP ™ Halogen-Free M4A3-256/192 LC51024MV LatticeEC™ Pb-Free M4A3-256/128 LC5512MB/V ispXPLD® Package Code Pb LFECP20E UTAC Singapore AW N ® Package Type P P R ispMACH 4A3 Product Line D Product Family P 672-fpBGA F672 FN672 P Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. LFECP33E Page 7 EXHIBIT “B” – PCN Device Listing and Applicable Changes (Cont’d) LFE2-12E/SE LFE2-20E/SE ™ LatticeECP2 LFE2-35E/SE LFE2-50E/SE LFE2-70E/SE LFE2M20E/SE LFE2M35E/SE LatticeECP2M ™ LFE2M50E/SE LFE2M70E/SE LFE3-17EA LFE3-35EA LatticeECP3™ LFE3-70EA W LFE3-95EA LFE3-150EA Halogen-Free ASE Malaysia Pb-Free 256-fpBGA F256 FN256 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 672-fpBGA F672 FN672 P 900-fpBGA F900 FN900 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 256-fpBGA F256 FN256 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 900-fpBGA F900 FN900 P 1152-fpBGA F1152 FN1152 P 900-fpBGA F900 FN900 P 1152-fpBGA F1152 FN1152 P 900-fpBGA F900 FN900 P 256-ftBGA FTN256 P 484-fpBGA FN484 P 256-ftBGA FTN256 P 484-fpBGA FN484 P 672-fpBGA FN672 P 1156-fpBGA FN1156 P 484-fpBGA FN484 P 672-fpBGA FN672 P 1156-fpBGA FN1156 P 484-fpBGA FN484 P 672-fpBGA FN672 P 1156-fpBGA FN1156 P 672-fpBGA FN672 P IT H LFE2M100E/SE Package Code Pb UTAC Singapore AW N LFE2-6E/SE Package Type R Product Line D Product Family Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. Page 8 EXHIBIT “B” – PCN Device Listing and Applicable Changes (Cont’d) LatticeSC™ Product Line Package Type F256 FN256 P 900-fpBGA F900 FN900 P 900-fpBGA F900 FN900 P 256-fpBGA F256 FN256 P 900-fpBGA F900 FN900 P LFSCM3GA25EP1 900-fpBGA F900 FN900 P LFXP6C/E 256-fpBGA F256 FN256 P 256-fpBGA F256 FN256 P 388-fpBGA F388 FN388 P 256-fpBGA F256 FN256 P 388-fpBGA F388 FN388 P 484-fpBGA F484 FN484 P 256-fpBGA F256 FN256 P 388-fpBGA F388 FN388 P 484-fpBGA F484 FN484 P 132-csBGA M132 MN132 P P 256-ftBGA FT256 FTN256 P P 132-csBGA M132 MN132 P P 256-ftBGA FT256 FTN256 P P 256-ftBGA FT256 FTN256 P P 484-fpBGA F484 FN484 P LFXP20C/E LFXP2-5E LFXP2-8E LatticeXP2™ LFXP2-17E 256-ftBGA FT256 FTN256 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 484-fpBGA F484 FN484 P 672-fpBGA F672 FN672 P 100-csBGA M100 MN100 P 100-csBGA M100 MN100 P 132-csBGA M132 MN132 P 256-caBGA B256 BN256 P 256-ftBGA FT256 FTN256 P 132-csBGA M132 MN132 P 256-caBGA B256 BN256 P 256-ftBGA FT256 FTN256 P 132-csBGA M132 MN132 P 256-caBGA B256 BN256 P 256-ftBGA FT256 FTN256 P 324-ftBGA FT324 FTN324 P IT H LFXP2-30E D LFXP15C/E R LFSCM3GA15EP1 LFXP10C/E LatticeXP ™ LFXP2-40E LCMXO256C/E LCMXO640C/E ™ LCMXO1200C/E W MachXO UTAC Singapore 256-fpBGA LFSC3GA15E LCMXO2280C/E Halogen-Free ASE Malaysia Pb-Free LFSC3GA25E LatticeSCM™ Package Code Pb AW N Product Family P Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. Page 9 EXHIBIT “B” – PCN Device Listing and Applicable Changes (Cont’d) MachXO2™ ™ ORCA 2 Series ORCA 3 Series ORCA 4 Series FPSC Product Line Package Type LCMXO2-1200HC 132-csBGA LCMXO2-1200ZE 132-csBGA Package Code Pb Pb-Free Halogen-Free ASE Malaysia MG132 P MG132 P UTAC Singapore AW N Product Family OR2T15A 256-BGA BA256 P OR3T30 256-BGA BA256 P OR3T55 256-BGA BA256 ORSO42G5 484-fpBGA BM484 BMN484 P ORSO82G5 680-fpBGA F680 FN680 P ORT42G5 484-fpBGA BM484 BMN484 P ORT82G5 680-fpBGA F680 FN680 P ORT8850H 680-fpBGA BM680 BMN680 P ORT8850L 680-fpBGA BM680 BMN680 P P W IT H D R Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. Page 10 EXHIBIT “C” – Current and Future Qualified Assembly Sites and Material Sets Package Type Assembly Site csBGA ucBGA caBGA ftBGA fpBGA PBGA Alternate Qualified Material Set Die Attach Mold Compound Wire Sumitomo G770HJ1 ASE Malaysia Ablebond 2100A Kyocera KEG12502 Hitachi CEL9750HF Ablebond 2100A UTAC Singapore Ablebond 2300 Hitachi CEL97504 Nitto G100BC 5 3 Material Set AW N Current Au Au Assembly Site Die Attach Mold Compound ASE Malaysia Ablebond 2100A Kyocera KEG2250 UTAC Singapore Ablebond 2300 Nitto G100BC Wire Au Au R Note: Any of the qualified material sets above may be used with Mitsubishi, Doosan or Hitachi BGA Laminate core. Above table summarizes the current qualified material set and alternate qualified material set at ASE Malaysia and UTAC Singapore. The highlighted cells in the “Alternate Qualified” section identify the changes associated with this PCN. W IT H D 1. Currently used for LC4000, MachXO families 2. Currently used for ispLSI 2000VE, ispLSI 5000VA/VE, ispMACH 5000VG, ispXPLD, LatticeEC/ECP, ispGDX/V, ispGDX2, LatticeXP, ispMACH 4A, ispXPGA and ORCA 2/3/4 families 3. Currently used for MachXO2, LatticeECP2/M, LatticeECP3, LatticeSC/SCM and LatticeXP2 families 4. Currently used for LatticeECP2/M, MachXO, LatticeXP, LatticeXP2 families 5. Currently used for LC4000 and MachXO families. Mold compound formulation changes to low alpha Page 11 EXHIBIT “D” – Alternate Materials Qualification Plan ASEM Alternate Mold Compounds by Product & Package Type csBGA / usBGA / caBGA / ftBGA fpBGA / BGA Sumitomo G770HJ CEL9750HF Series / Kyocera KEG1250 Reliability Stress at Stress # Lots Units / Lot ASEM SMPC 3 135 J-STD-020D.1 & JESD-A113F ASEM TC 3 45 ASEM HTSL 3 ASEM UHAST Lattice Semi BHAST N/A N/A After 3x reflow JESD22-A104C Cond B (-55C/+125C) N/A 200 Cycles 1000 Cycles 45 JESD22-A103D 150C dry bake N/A 168 Hrs 3 45 JESD22-A118 3 45 JESD22-A110B UTAC TC UTAC UTAC Lattice Semi Condition R Jedec Standard Units / Lot 3 135 3 45 1000 Hours N/A 264 Hours Cond B (110C/85%RH) 1.2 / 3.3 N/A 264 Hours D # Lots Late June Qual Pass N/A Now CEL9750HF Series Nitto G100BC-U Early Release Target Date Cond B (110C/85%RH) Nitto G100 BC CFC-S Nitto G100 BC CFC-S Late July 260C 260C Condition Vcc (V) Early Release Point J-STD-020D.1 & JESD-A113F MSL3a 60C/60% RH & 260C peak reflow temp N/A N/A After 3x reflow JESD22-A104C Cond B (-55C/+125C) N/A 200 Cycles 1000 Cycles Jedec Standard Qual Complete Target Date Peak Reflow Temp Alternate IT H SMPC 260C 250C MSL3 30C/60% RH & 250C or 260C peak reflow temp W UTAC Kyocera KEG2250 Kyocera KEG2250 Early Release Point csBGA / usBGA / caBGA / ftBGA LC4000 256-ftBGA Only Stress Peak Reflow Temp Vcc (V) UTAC Alternate Mold Compounds by Product & Package Type Reliability Stress at Alternate AW N Now Early Release Target Date Late June Qual Pass HTSL 3 45 JESD22-A103D 150C dry bake N/A 168 Hrs 1000 Hours UHAST 3 45 JESD22-A118 Cond B (110C/85%RH) N/A N/A 264 Hours BHAST 3 45 JESD22-A110B Cond B (110C/85%RH) 1.2 / 3.3 N/A 264 Hours Qual Complete Target Date Late July Page 12 EXHIBIT “E” – Alternate Materials Characterization Plan Subcon ASEM LC4512V 256-ftBGA Current LC4512V 256-ftBGA Alternate LMXO-1200C 256-ftBGA Current LMXO-1200C 256-ftBGA Alternate Product Pkg LFE3-150EA 1156-fpBGA Current LFE3-150EA 1156-fpBGA Alternate LFXP2-30E 256-ftBGA Current LFXP2-30E 256-ftBGA Alternate Split W IT H ASEM Split Mold Compound # Units/ Lot Lots Temperature AW N UTAC Pkg Nitto G100BC 1 300 90C Nitto G100BC 3 300 90C 9750HF Series 1 300 90C Nitto G100BC 3 300 90C Mold Compound # Units/ Lot Lots Temperature 9750HF Series 1 300 90C Kyocera KEG2250 3 300 90C 9750HF Series 1 300 90C Kyocera KEG2250 3 300 90C R UTAC Product D Subcon Page 13 EXHIBIT “F” – Qualified BGA Laminate Core Material Stress Test Pre-condition Test Conditions Stress Conditions JEDEC 22-A113-D Level 3 Duration N/A Lot Number 1000 Cycles HAST Test (no bias) JEDEC 22-A118 130oC/85%RH 33.5PSIA 100 Hrs High Temperature Storage JEDEC 22-A103-C 150oC 0/50 0/50 0/156 0/156 0/50 0/50 0/156 0/156 0/50 0/50 0/156 0/156 Post-stress 0/25 0/25 0/25 Post-stress 0/77 0/77 0/77 Post-stress 0/25 0/25 0/25 Lot 2 Post-stress 0/77 0/77 0/77 Lot 1 Post-stress 0/25 0/25 0/25 0/77 0/77 0/77 Lot 1 Lot 1 Lot 2 Lot 1 D 1000 Hrs Lot 2 IT H W Pre-stress Post-stress Pre-stress Post-stress Test Results SAT R JEDEC 22-A104-B 150oC --> -65oC Read Point Visual Inspection O/S Test Lot 2 Temperature Cycle Test AW N Hitachi E-679FGB BGA Laminate Core Material Qualification Data Report Post-stress Page 14 EXHIBIT “F” – Qualified BGA Laminate Core Material (Cont’d) Stress Test Pre-condition Test Conditions Stress Conditions JEDEC 22-A113-D Level 3 Duration N/A Lot Number 7B218 7B219 7B220 168 Hrs Temperature Cycle Test JEDEC 22-A104-B 150oC --> -65oC 1000 Cycles HAST Test (no bias) JEDEC 22-A118 130oC/85%RH 33.5PSIA High Temperature Storage JEDEC 22-A103-C 150oC 7B218 7B219 7B220 7B218 7B219 7B220 7B218 7B219 7B220 7B218 7B219 7B220 100 Hrs 1000 Hrs IT H W Pre-stress Post-stress Pre-stress Post-stress Pre-stress Post-stress Post-stress Post-stress Post-stress Post-stress Post-stress Post-stress Post-stress Post-stress Post-stress Post-stress Post-stress Post-stress 0/180 0/180 0/180 0/180 0/180 0/180 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 R JEDEC 22-A102-C 121oC/100%RH 29.7PSIA Read Point Visual Inspection D Pressure Cooker Stress AW N Doosan DS-7409HGB BGA Laminate Core Material Qualification Data Report Test Results O/S Test SAT 0/180 0/180 0/180 0/180 0/180 0/180 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/180 0/180 0/180 0/180 0/180 0/180 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45 0/45