Reliability Report

AOS Semiconductor
Product Reliability Report
AOWF7S60,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOWF7S60.
Accelerated environmental tests are performed on a specific sample size, and then followed by
electrical test at end point. Review of final electrical test result confirms that AOWF7S60 passes
AOS quality and reliability requirements. The released product will be categorized by the process
family and be routine monitored for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Reliability Stress Test Summary and Results
Reliability Evaluation
I. Product Description:
The AOWF7S60 have been fabricated using the advanced MOS high voltage process that is
designed to deliver high levels of performance and robustness in switching applications. By
providing low RDS(on), Qg and EOSS along with guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply designs.
TM
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bonding
Mold Material
Moisture Level
AOWF7S60
Standard sub-micron
TM
600V MOS Power Transistor
TO262F
Bare Cu
Soft solder
Al wire
Epoxy resin with silica filler
Up to Level 1
2
III. Reliability Stress Test Summary and Results
Test Item
Test Condition
Time Point
Total
Sample
size*
Number
of
Failures
Reference
Standard
MSL
Precondition
168hr 85°c/85%RH +
3 cycle reflow@260°c
(MSL 1)
-
2464 pcs
0
JESD22-A113
HTGB
Temp = 150°c ,
Vgs=100% of Vgsmax
168 / 500 /
1000 hours
693 pcs
0
JESD22-A108
HTRB
Temp = 150°c ,
Vds=80% of Vdsmax
168 / 500 /
1000 hours
693 pcs
0
JESD22-A108
HAST
130 °c , 85%RH,
33.3 psi, Vds = 80% of
Vdsmax before arcing
(typically ≤42V)
96 hours
770 pcs
0
JESD22-A110
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hours
770 pcs
0
JESD22-A102
Temperature
Cycle
-65°c to 150°c ,
air to air,
250 / 500
cycles
924 pcs
0
JESD22-A104
*Note: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 4.29
MTTF = 26608 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 4.29
9
MTTF = 10 / FIT = 26608 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
259
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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