LatticeXP-Standard Evaluation Board User Manual

LatticeXP™ Standard Evaluation Board
User’s Guide
June 2008
EB12_02.4
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
Introduction
The LatticeXP Standard Evaluation Board provides a convenient platform to evaluate, test and debug user designs.
The board consists of a LatticeXP-10 FPGA in a 256 fpBGA package, power input jacks, a clock oscillator (33MHz)
and I/O connections. The LatticeXP I/Os are connected to a rich variety of interfaces including switches (momentary and ON/OFF), LEDs, SMA pads, RJ45, 0.10” headers and PCB test points.
The information in this document pertains to boards marked as ‘Rev. A’ and ‘Rev. B’. This marking is located on the
front of the board, beneath the Lattice logo. Any information that only applies to either the ‘Rev. A’ or ‘Rev.B’ board
will be explicitly stated as such.
Features
Included
• LatticeXP FPGA: LFXP10C-5F256C or LFXP10E-5F256C
• On-board power supply (rev. B only)
• Prototyping area
• 188 user I/Os, grouped in eight I/O banks
• Independent voltage control for core, I/O and clock voltages
• 33MHz on-board oscillator
• Status LEDs, input switches
• Lattice ispDOWNLOAD cable
• AC adapter (rev. B only)
Optional
• Optional SMA connectors (up to 16) for high-speed clock and data interfacing. The board includes pads for these
connectors. The SMA connectors must be procured and installed separately by the user.
Software Support
• To target your HDL design to the LatticeXP device, use the ispLEVER® design software. You can learn more
about ispLEVER on the Lattice web site at: www.latticesemi.com/software.
• To download your program to the LatticeXP device, use the ispVM® System software. ispVM System can be
downloaded from the Lattice web site at: www.latticesemi.com/ispvm.
• ispTRACY™ in-system logic analysis support (ispTRACY is included with the ispLEVER design software)
2
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
Figure 1. LatticeXP Standard Evaluation Board
Electrical, Mechanical and Environmental Specifications
The nominal board dimensions are 7 inches by 3.9 inches. The environmental specifications are as follows:
• Operating temperature: 0ºC to 55ºC
• Storage temperature: -40ºC to 75ºC
• Humidity: < 95% without condensation
• VDC input (+/- 10%) up to 4A
Additional Resources
Additional resources related to this board can be downloaded from the web at www.latticesemi.com/boards. Click
on the appropriate evaluation board, then follow the appropriate links for items such as updated documentation,
software, sample designs, IP evaluation bitstreams, and more.
LatticeXP Device
This board features a LatticeXP FPGA with either a 3.3V or a 1.2V DC core. The board is populated with a LatticeXP-10 device in plastic 256-ball fpBGA (1mm pitch) package. Density migration is possible for Lattice XP
devices in the 256 fpBGA package. A complete description of this device can be found in the LatticeXP Family Data
Sheet on the Lattice web site at www.latticesemi.com.
Device Core and I/O Voltage
Boards shipping with a 3.3V DC core device will allow operation of the core between 1.8V and 3.3V DC. Jumpers
(JP4, JP5 and JP6) are available to switch between 3.3V, 1.2V and an adjustable supply between the other two
voltages. Boards shipping with a 1.2V core device will not have headers installed for core voltage selection. JP4 will
be shorted on the board. Figure 2 shows the core voltage selection jumpers.
3
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
Figure 2. Core Voltage Select Jumpers
JP4
1.2V
JP5
ADJ
JP6
3.3V
VCC_CORE
The LatticeXP device has eight sysIO™ buffer banks; each is capable of supporting multiple I/O standards. Each
sysIO bank has its own I/O supply voltage (VCCIO) and two voltage reference resources, VREF1 and VREF2, that
allow each bank to be completely independent from the others.
Please refer to the LatticeXP Family Data Sheet for additional information about supported I/O standards. This data
sheet can be downloaded from www.latticesemi.com.
The LatticeXP Standard Evaluation Board provides individual control of each I/O bank capable of supporting
VCCIO between 1.2V and 3.3V. The board provides jumper blocks which allow the end user to select 1.2V, 3.3V or
an adjustable voltage between these two voltages. Figure 3 shows a typical layout for a VCCIO select jumper block.
Table 1 details the VCCIO bank selection connectors.
1.2V
ADJ
3.3V
Figure 3. VCCIO Jumper Block
VCCIO
Table 1. VCCIO Connectors
VCCIO Bank
Connector Number
VCCIO0
JP1
VCCIO1
JP2
VCCIO2
JP3
VCCIO3
JP10
VCCIO4
JP11
VCCIO5
JP12
VCCIO6
JP13
VCCIO7
JP14
Device Clocks
The LatticeXP Standard Evaluation Board provides a variety of ways to input clock signals to the LatticeXP device.
These include an on-board crystal oscillator, SMA connectors and 0.1” header pins. Clock inputs connect to pri-
4
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
mary clock inputs and device PLL inputs. Clock outputs connect to PLL outputs and external feedback pins. Table
describes the clock connections to the LatticeXP device.
Table 2. Lattice XP-10 Clock Pins and Connections
PCB Connection1
On-Board OSC.
Resistor2
Buffered (Y/N)3
RLM0_PLLT_IN_A
J23-15
R89
Y
M16
RLM0_PLLC_IN_A
J23-16
N/A
N
L13
RLM0_PLLT_OUT_A
J23-9
N/A
N
XP-10 Pin Number
N16
XP Pin Label
M14
RLM0_PLLC_OUT_A
J23-10
N/A
N
N15
RLM0_PLLT_FB_A
J23-17
N/A
N
P15
RLM0_PLLC_FB_A
J23-18
N/A
N
F16
RUM0_PLLT_IN_A
J24-7
R90
Y
G16
RUM0_PLLC_IN_A
J24-8
N/A
N
F13
RUM0_PLLT_OUT_A
J24-17
N/A
N
G12
RUM0_PLLC_OUT_A
J24-18
N/A
N
C15
RUM0_PLLT_FB_A
J24-3
N/A
N
D15
RUM0_PLLC_FB_A
J-24-4
N/A
N
M1
LLM0_PLLT_IN_A
SMA J12
N/A
N
M2
LLM0_PLLC_IN_A
SMA J14
N/A
N
K4
LLM0_PLLT_OUT_A
SMA J16
N/A
N
K5
LLM0_PLLC_OUT_A
SMA J18
N/A
N
L5
LLM0_PLLT_FB_A
SMA J20
N/A
N
M6
LLM0_PLLC_FB_A
SMA J22
N/A
N
G3
LUM0_PLLT_IN_A
SMA J19
N/A
N
G2
LUM0_PLLC_IN_A
SMA J21
N/A
N
E3
LUM0_PLLT_OUT_A
SMA J15
N/A
N
F4
LUM0_PLLC_OUT_A
SMA J17
N/A
N
D2
LUM0_PLLT_FB_A
SMA J7
N/A
N
D3
LUM0_PLLC_FB_A
SMA J9
N/A
N
A7
PCLKT0_0
OSC
R104
N
A8
PCLKC0_0
Test Point
N/A
N
H16
PCLKT2_0
J24-9
N/A
N
J16
PCLKC2_0
J24-10
N/A
N
T10
PCLKT4_0
Test Pad
N/A
N
T11
PCLKC4_0
Test Pad
N/A
N
K1
PCLKT6_0
SMA J8
N/A
N
K2
PCLKC6_0
SMA J10
N/A
N
1. Check the schematic pages for termination resistors connected to these pins.
2. 0_ resistor connecting to on-board oscillator.
3. Indicates a non-inverting buffer between the oscillator and pin.
The oscillator socket accepts both full-size and half-size oscillators and can route to different clock inputs, depending on installation of several 0Ω resistors. The oscillator has a 22Ω series termination resistor at the oscillator output. These inputs correspond with PCLKT0, RLM0_PLLT_IN_A and RUM0_PLLT_IN_A. The oscillator supply
voltage is changeable, via the VCC_OSC header, located at JP9. The onboard oscillator operates at 3.3V. It is possible to power this socket from the following supplies: 3.3V, VCCIO0, VCCIO2 or VCCIO3, depending on the I/O
bank being used and the operating conditions for the chosen oscillator.
5
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
Figure 4 shows the layout and connections for JP9. There is also an optional 10K pull-up (R91) connect to pins 1
and 4 of the oscillator socket, in the event a oscillator with enable is required. The oscillator is also connected to
J24-26, for use as a clock input to a logic analyzer.
VCCIO3
VCCIO2
VCCIO0
3.3V
Figure 4. VCC_OSC Jumper Block
JP9
VCC_OSC
6
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
Device I/O Banks 0 and 1
I/O banks 0 and 1 represent general purpose I/O banks, which connect to a combination of test pads, switches,
LEDs and an RJ45 connector. The switches consist of two user defined push-button switches and an 8-position
DIP switch. Both types of switches are pulled up to the associated VCCIO voltage with 10KΩ resistors and connected to GND when activated (pushed or levered in the down position). LEDs are active (lit) when the device I/O is
low. The RJ-45 connector is connected using paired I/O connections. Table 3 details the I/O banks 0 and 1 connections. Unlisted pins in banks 0 and 1are connected to test pads on the board.
Table 3. Banks 0 and 1 I/O Connections
I/O Bank
XP-10 Pin
Number
Connection
0
C5
LED D8
0
F5
LED D9
0
B1
LED D10
0
A2
LED D11
0
B2
LED D12
0
B3
LED D13
0
A3
LED D14
0
D5
LED D15
0
D6
RJ-45 J25-1
0
E6
RJ-45 J25-2
0
B6
RJ-45 J25-3
0
A4
RJ-45 J25-4
0
B5
RJ-45 J25-5
0
A5
RJ-45 J25-6
0
D7
RJ-45 J25-7
0
E7
RJ-45 J25-8
0
C6
Switch SW7 1
0
A6
Switch SW7 2
0
D8
Switch SW7 3
0
E8
Switch SW7 4
0
C7
Switch SW7 5
0
B7
Switch SW7 6
0
B8
Switch SW7 7
0
E9
Switch SW7 8
1
C8
Pushbutton SW0
1
C9
Pushbutton SW1
7
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
Device I/O Banks 2 and 3
I/O banks 2 and 3 contain general purpose I/Os with LVDS transmit/receive pairs. These I/O pairs are connected to
two 0.1” headers suitable for connecting to a logic analyzer or ribbon cable. Table 4 details the I/O banks 2 and 3
connections.
Table 4. Banks 2 and 3 I/O Connections
LatticeXP-10 Pin Number
Connection
I/O Bank
Positive
Negative1
Positive
Negative1
2
C15
D15
J24-3
J24-4
2
E14
F14
J24-1
J24-2
2
E15
F15
J24-19
J24-20
2
C16
B16
J24-5
J24-6
2
F13
G12
J24-17
J24-18
2
F16
G16
J24-7
J24-8
2
G14
G15
J24-13
J24-14
2
H14
H15
J24-21
J24-22
2
H12
H13
J24-15
J24-16
2
H16
J16
J24-9
J24-10
2
G13
3
J14
3
K16
L16
J23-3
J23-4
3
K13
K12
J23-13
J23-14
J24-25
J15
J23-1
J23-2
3
K15
K14
J23-5
J23-6
3
N16
M16
J23-15
J23-16
3
L14
L15
J23-7
J23-8
3
L13
M14
J23-9
J23-10
3
N14
M15
J23-21
J23-22
3
R16
P16
J23-19
J23-20
3
N15
P15
J23-17
J23-18
3
L12
SW4
1. Blank cell indicated pin with no negative paired pin.
Each I/O pair is connected to a resistor termination network, and the trace lengths are matched. Figure 5 shows
the termination network for these differential pairs. These resistors are not installed, and the series resistors use a
trace between the resistor pads. This trace can be cut to allow the installation of a series termination resistor. The
series resistors are 0805 size and the parallel resistors are 0603 size. Figure 5 shows this trace in relation to the
resistor pads.
Figure 5. Differential I/O Termination Network
XP-10 A Pad
Connector
XP-10 B Pad
8
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
Figure 6. Close-up of Series/Passthrough
Resistor Pads
Cut trace to
install resistor
Device I/O Banks 4 and 5
I/O banks 4 and 5 consist of general purpose I/O pins. These pins connect to test pads on the board. The test pads
are paired with a ground pad, which are spaced on 0.1” centers. In addition to the test pads, these I/O banks are
connected to a pull-up, pull-down and series resistor network. The resistor network is not populated. The series
resistors are 0805 size, and the pull-up/pull-down resistors are 0603 size. Figure 7 shows the schematic for the
individual I/O termination network.
Table 5. Banks 4 and 5 I/O Connections
Position
Pin Number
GND Row
Pin Number
GND Row
1
T3
GND
P5
GND
2
R3
GND
R1
GND
3
N5
GND
R2
GND
4
R4
GND
T2
GND
5
T5
GND
R5
GND
6
P6
GND
T4
GND
7
N6
GND
T6
GND
8
M7
GND
R6
GND
9
N7
GND
T8
GND
10
M8
GND
P8
GND
11
R8
GND
N8
GND
12
T9
GND
P7
GND
13
T7
GND
R9
GND
14
R7
GND
P9
GND
15
T11
GND
N9
GND
16
T10
GND
M9
GND
17
P13
GND
T13
GND
18
R13
GND
P14
GND
19
M11
GND
N10
GND
20
N11
GND
M10
GND
21
R10
GND
P11
GND
22
P10
GND
N12
GND
23
R12
GND
R11
GND
24
T12
GND
P12
GND
25
T15
GND
T14
GND
26
R15
GND
R14
GND
9
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
Figure 7. Banks 4 and 5 I/O Termination Network
VCCIO
Test Points
XP-10 A Pad
Device I/O Banks 6 and 7
I/O banks 6 and 7 contain general purpose I/Os with LVDS transmit/receive pairs. The I/O pairs in these banks
have been routed to test pads on the PCB and eight pairs have been routed to SMA connectors. Table 6 details the
I/O bank 6 and 7 SMA connections. Unlisted pins are connected to test pads on the board.
Table 6. Bank 6 and 7 I/O Connections
LatticeXP-10 Pin Number
1
SMA Connection
I/O Bank
Positive
Negative
Positive
Negative1
6
K1
K2
J8
J10
6
M1
M2
J12
J14
6
K4
K5
J16
J18
6
L5
M6
J20
J22
7
D2
D3
J7
J9
7
E1
F1
J11
J13
7
E3
F4
J15
J17
7
G3
G2
J19
J21
Pairs routed to SMA connectors are connected with series and parallel termination resistors, similar to the network
shown in Figure 5 (see Bank 2 and 3 description). The SMA connectors are not included with the LatticeXP-Standard board, and must be procured and installed separately. AMP SMA connector 221780-1 or similar is recommended.
10
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
Programming Headers
Two programming headers are provided on the evaluation board, providing access to the LatticeXP JTAG port.
Both 1x10 and 2x5 formats are available for compatibility with all Lattice ispDOWNLOAD® cables. The pinouts for
the headers are provided in Tables 6 and 7.
Important Note: The board must be un-powered when connecting, disconnecting, or reconnecting the ispDOWNLOAD Cable. Always connect the ispDOWNLOAD Cable's GND pin (black wire), before connecting any other JTAG
pins. Failure to follow these procedures can in result in damage to the LatticeXP FPGA device and render the
board inoperable.
Table 7. JTAG Programming Headers Function JP8 (2x5)
JTAG Programming Function
JP8 Pin Number (2x5)
TCK
1
GND
2
TMS
3
GND
4
TDI
5
VCC (3.3V)
6
TDO
7
GND
8
TRST
9
PROGRAM
10
Table 8. JTAG Programming Headers Function JP7 (1x10)
JTAG Programming Function
JP7 Pin Number (1x10)
VCC (3.3V)
1
TDO
2
TDI
3
PROGRAM
4
TRST
5
TMS
6
GND
7
TCK
8
DONE
9
INIT
10
Power Supply
Power can be supplied to the LatticeXP Standard Evaluation Board via the banana jacks (J1, 2, 5, 6 – all PCB revisions), or a coaxial DC connector (J3 – Rev. B PCB only), which receive power from either a bench power supply or
a brick style power supply.
[Rev. B Only] The output from the DC system is controlled by switch SW1. This is a small surface mount switch that
enables and disables the LTC1775 DC-DC conversion chip. The output voltages from the power supply are enabled
when the switch is in the left position.
[Rev. B Only] The 5.0V to 28.0V DC input voltage (input to either J2 or J3) is converted by DC-DC converters and
switching power supplies to provide 3.3V, 1.2V, and an adjustable DC source on the board. The output from these
11
LatticeXP Standard Evaluation Board
User’s Guide
Lattice Semiconductor
supplies travels through surface mounted fuse holders. Fuses are supplied and prevent over-current conditions
from damaging the components on the board (vendor: Littlefuse, make: Nano SMF Very Fast Acting, 1.5A or 3A).
Both Rev. A and Rev. B boards may be supplied with DC voltage through the banana plug connector. On both
boards, J4 is the GROUND connection point, J1 is the +3.3V input, J6 is the +1.2V input and J5 is the input for the
Adjustable rail. J2 connects to the VIN input of the on-board power supply of the Rev. B board. J2 is unconnected
on the Rev. A board. To directly connect power to the banana jacks on the Rev. B board, the SMT fuses must be
removed. SMT fuses are not installed on Rev. A boards.
Ordering Information
Description
Ordering Part Number
LatticeXP10C Evaluation Board - Standard (upper voltage)
China RoHS EnvironmentFriendly Use Period (EFUP)
LFXP10C-L-EV
10
LatticeXP10C Evaluation Board - Standard (lower voltage)
LFXP10E-L-EV
ispLEVER Base with LatticeXP10 Standard Development Kit
LS-XP10-BASE-PC-N
Technical Support Assistance
Hotline: 1-800-LATTICE (North America)
+1-503-268-8001 (Outside North America)
e-mail: [email protected]
Internet: www.latticesemi.com
Revision History
Date
Version
Change Summary
—
—
August 2006
02.1
Changes to I/O Bank column of Bank 6 and 7 I/O Connections table.
March 2007
02.2
Added Ordering Information section.
April 2007
02.3
Added important information for proper connection of ispDOWNLOAD
(Programming) Cables.
June 2008
02.4
Updated schematic.
Previous Lattice releases.
© 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as
listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of
their respective holders. The specifications and information herein are subject to change without notice.
12
13
A
B
C
D
5
Page 2
Programming
Interfaces
Page 6
SMAs for Testing
Differential or
Single Ended
High-speed Signals
5
4
4
XP
FPGA
Bank 4
Bank 3
Bank 2
Bank 1
3
Page 5
Single Ended Signal
Testing
Bank 5
Bank 6
Bank 7
Bank 0
Page 4
Prototype
Area
3
1
2
Wednesday, September 07, 2005
Document Number
<Doc>
Sheet
LatticeXP Evaluation Board
1
1
of
8
Rev
A
Lattice Semiconductor Corporation
Date:
Size
A
Title
Page 7
Power Supplies
Page 3
Diffferential
Signals and
Logic
Analyzer
Headers
2
A
B
C
D
Lattice Semiconductor
LatticeXP Standard Evaluation Board
User’s Guide
Appendix A. Schematic
Figure 8. LatticeXP Evaluation Board
A
MT1
[7]
MT2
MT3
VCC_CORE
1
B
VCC_3.3V
1
[7]
VCCM_3.3V
MT4
5
1
[7]
FD1
C31
10uF
SizeC
FD2
TCK
TMS
TDI
TDO
TRST
C26
10uF
SizeC
1
C
1
ispJTAG Download
Cable Headers
1
2
3
4
5
6
7
8
9
10
JP7
JP8
FD3
2
4
6
8
10
FD4
C33
0.01uF
CC0402
HEADER5X2
hdr5x2_100mil
1
3
5
7
9
HEADER1X10
C32
0.1uF
CC0402
1
D
1
Download Cable Header
TDO
Input
TDI
Output
PROGRAMN
Output
DONE
Input
TMS
Output
TCK
Output
INITN
Input
1
5
FD5
FD6
C34
0.1uF
CC0402
C35
0.01uF
CC0402
VCC_3.3V
PROGRAMN
VCC_3.3V
TCK
DONE
INITN
VCC_3.3V
TDO
TDI
PROGRAMN
TRST
TMS
1
14
1
4
4
C36
0.1uF
CC0402
TP1
TRST
1
R41
C45
10uF
SizeC
0
2
INDUCTOR
2
CR0603
C46
10uF
SizeC
C43
10uF
SizeC
C38
0.1uF
CC0402
C27
0.1uF
CC0402
INDUCTOR
C42
10uF
SizeC
L5
1
L4
C37
0.01uF
CC0402
C24
10uF
SizeC
R39
4.7K
CR0603
TDO
TDI
TMS
TCK
C40
0.1uF
CC0402
C29
0.1uF
CC0402
C25
0.1uF
CC0402
TDI
TMS
TCK
TDO
INITN
PROGRAMN
DONE
C47
0.01uF
CC0402
C44
0.01uF
CC0402
C39
0.01uF
CC0402
C28
0.1uF
CC0402
C23
0.1uF
CC0402
H4
J12
D4
D13
E5
E12
M5
M12
N4
N13
E4
E13
M4
M13
D16
D14
C14
B14
E16
3
R37
R36
LFXP10E-5F256C
VCCP0
VCCP1
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCJ
TDI
TMS
TCK
TDO
CFG0
CFG1
GNDP0
GNDP1
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
H5
J13
2
2
TP2
CCLK
DONE
PROGRAMN
INITN
A1
A16
F6
F11
G7
G8
G9
G10
H7
H8
H9
H10
J7
J8
J9
J10
K7
K8
K9
K10
L6
L11
T1
T16
CFG0
CFG1
C3
C2
P3
C1
CFG1
CFG0
C4
B4
10K CR0603
10K CR0603
DONE
PROGRAMN
INITN
CCLK
(5 OF 5)
LFXP10E (fpBGA256)
U4E
VCC_3.3V
PLANES FOR VCC and GND should be
seperate. These are to isolate /
filter noise to PLL power
C41
0.1uF
CC0402
C30
0.1uF
CC0402
3
1
2
3
4
SW DIP-2
261milX425mil
SW2
Down = 0, Up = 1
VCC_3.3V
Slave Serial, External Device
Master Serial, External Device
Slave Parallel, External Device
Internal Flash
2
D ate :
DONE
Gate
SOT-23
Q7
BSS138LT1
D7
GREEN_LED
CR0603
R40
470
CR0603
Tuesday, June 17, 2008
1
S he e t
2
JTAG and FPGA Programming
Silk Screened 8 pin SOIC
package with X through it.
Printing to say no PROM
needed.
1
SW3
SW PUSHBUTTON
4.7mmX3.5mm
D6
YELLOW_LED
CR0603
R38
470
CR0603
0
1
0
1
S ize
D o c um e nt Num b e r
Custom<Doc>
Title
PROGRAMN
0
0
1
1
CFG1 CFG0 Description
1
of
Source
Drain
8
Rev
A
A
B
C
D
Lattice Semiconductor
LatticeXP Standard Evaluation Board
User’s Guide
Figure 9. JTAG and FPGA Programming
15
A
B
C
D
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
[7]
[7]
[7]
VCCIO_2
VCCIO_3
VCC_3.3V
HEADER 14x2
J23
5
5
C52
10uF
SizeC
C49
10uF
SizeC
DNS
DNS
R56
R62
DNS
R87 0
R81 0
R83 0
R77 0
R75 0
R70 0
R269 0
R66 0
GSRN
R64 0
R58 0
R60 0
R54 0
R52 0
R46 0
R48 0
OSC_CLK
3
2
1
Y
4
4
5
SN74AUP1G34
GND
A
NC VCC
U6
Routing to Connector for pairs needs to be matched
R85
DNS
DNS
R73
R79
DNS
R68
[4]
DNS
DNS
R44
R50
R42 0
4
C53
0.1uF
CC0402
C50
0.1uF
CC0402
R89
0
DNS
GSRN
C54
0.01uF
CC0402
C51
0.01uF
CC0402
J11
K11
N15
P15
R16
P16
N14
M15
L13
M14
L14
L15
L12
N16
M16
K15
K14
K13
K12
K16
L16
J14
J15
PR24A / RDQS24
PR24B
LFXP10E-5F256C
VCCIO3_J11
VCCIO3_K11
PR34A / RLM0_PLLT_FB_A
PR34B / RLM0_PLLC_FB_A
PR33A / RDQS33
PR33B
PR31A / VREF0_3
PR32B / RLM0_PLL_RST
PR29A / RLM0_PLLT_OUT_A
PR29B / RLM0_PLLC_OUT_A
PR28A
PR28B
PR26A
PR25A / RLM0_PLLT_IN_A
PR25B / RLM0_PLLC_IN_A
BANK 2
3
3
2
1
Y
4
5
VCCIO_0
SN74AUP1G34
GND
A
NC VCC
U7
VCCIO2_G11
VCCIO2_H11
PCLKT2_0 / PR17A
PCLKC2_0 / PR17B
RDQS16 / PR16A
PR16B
VREF0_2 / PR14A
RUM0_PLL_RST / PR15B
PR13A
PR13B
RUM0_PLLT_IN_A / PR12A
RUM0_PLLC_IN_A / PR12B
PR11B
RUM0_PLLT_OUT_A / PR8A
RUM0_PLLC_OUT_A / PR8B
RDQS7 / PR7A
PR7B
VREF1_2 / PR5A
PR6B
PR4A
PR4B
RUM0_PLLT_FB_A / PR3A
RUM0_PLLC_FB_A / PR3B
(3 OF 5)
LFXP10E (fpBGA256)
PR22A / VREF1_3
PR23B
PR21A
PR21B
PR19A
PR19B
BANK 3
U4C
3
G11
H11
H16
J16
H12
H13
H14
H15
G14
G15
F16
G16
G13
F13
G12
C16
B16
E15
F15
E14
F14
C15
D15
VCCIO_0
VCCIO_2
VCCIO_3
VCC_3.3V
R90
0
DNS
R86
R80
R74
R69
R63
R57
R51
R45
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
2
4
6
8
2
HEADER4X2
1
3
5
7
JP9
Da te :
Size
B
Title
10K
CR0603
R91
14
13
12
11
10
9
8
33MHz
DIP14
Y1
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Tuesday, June 17, 2008
Do c ume nt Numbe r
<Doc>
Banks 3 and 4
Oscillator
1
2
3
4
5
6
7
Routing to Connector for pairs needs to be matched
R88 0
R82 0
R84 0
R78 0
R76 0
R71 0
R72 0
R67 0
R65 0
R59 0
R61 0
R55 0
R53 0
R47 0
R49 0
R43 0
2
27
1
1
She e t
R92
22
3
J24
of
28
2
8
Re v
A
C48
0.1uF
CC0603
OSC_CLK
[4]
HEADER14x2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
14x2 Header
Top View
OSC_CLK
1
A
B
C
D
Lattice Semiconductor
LatticeXP Standard Evaluation Board
User’s Guide
Figure 10. Banks 3 and 4
A
B
C
D
VCCIO_0
[7]
VCCIO_1
[7]
TP_6
C58
0.01uF
CC0402
E11
F12
B13
A14
TP_E11
TP_F12
TP_B13
TP_A14
C57
0.1uF
CC0402
C13
A13
TP_C13
TP_A13
C60
10uF
SizeC
C56
10uF
SizeC
5
TP_7
C61
0.1uF
CC0402
C62
0.01uF
CC0402
VCCIO_0
C55
0.1uF
CC0402
(4 OF 5)
TP_18
TP_17
TP_16
TP_15
4
C59
0.1uF
CC0402
LFXP10E-5F256C
VCCIO1_F9
VCCIO1_F10
PT35A
PT35B
PT34A / TDQS34
PT34B / VREF0_1
PT32A
PT33B
PT31A
PT31B
PT30A / D0
PT30B
PT29A / VREF1_1
PT29B / D1
PT28A / D2
PT28B
PT27A
PT27B / D3
PT26A / TDQS26
PT26B
PT24A / D4
PT25B
PT23A / D5
PT23B
4
PT8A
PT9B
PT7A
PT7B
PT6A
PT6B
BANK 0
VCCIO0_F7
VCCIO0_F8
CS1N / PT20A
BUSY / PT20B
PCLKT0_0 / PT19A
PCLKC0_0 / PT19B
TDQS18 / PT18A
PT18B
PT16A
PT17B
WRITEN / PT15A
DOUT / PT15B
VREF0_0 / PT14A
PT14B
DI / PT13A
PT13B
CSN / PT12A
PT12B
PT11A
PT11B
TDQS10 / PT10A
VREF1_0 / PT10B
LFXP10E (fpBGA256)
PT22A
PT22B / D0 (MSB)
PT21A
PT21B/D7(LSB)
BANK 1
U4D
C63
0.1uF
CC0402
F9
F10
B15
A15
E10
C10
TP_E10
TP_C10
TP_B15
TP_A15
B12
A12
TP_B12
TP_A12
C11
D12
A11
C12
TP_C11
TP_D12
D11
B11
D9
B9
TP_D9
TP_B9
TP_D11
TP_B11
B10
A10
TP_A11
TP_C12
A9
D10
C8
C9
TP_B10
TP_A10
SW0
SW1
TP_A9
TP_D10
TP_C8
TP_C9
5
F7
F8
B8
E9
A7
A8
C7
B7
D8
E8
C6
A6
D7
E7
B5
A5
B6
A4
D6
E6
A3
D5
B2
B3
B1
A2
C5
F5
RJ6
RJ7
RJ4
RJ5
RJ2
RJ3
RJ0
RJ1
TP_D7
TP_E7
TP_B5
TP_A5
TP_B6
TP_A4
TP_D6
TP_E6
TP_14
OSC_CLK
[3]
3
3
D8
GREEN_LED
CR0603
R93
220
CR0603
TP_A8
TP_8
VCCIO_0
VCCIO_0
TP_A7
R104
0
RJ0
RJ2
RJ4
RJ6
D9
GREEN_LED
CR0603
R94
220
CR0603
2
4
6
8
D11
GREEN_LED
CR0603
R96
220
CR0603
RJ1
RJ3
RJ5
RJ7
D12
GREEN_LED
CR0603
R97
220
CR0603
D13
GREEN_LED
CR0603
R98
220
CR0603
TP_13
TP_12
TP_11
TP_10
TP_9
2
R105 R106 R107 R108 R109 R110 R111 R112
10K
10K
10K
10K
10K
10K
10K
10K
CR0603CR0603CR0603CR0603CR0603CR0603CR0603CR0603
RJ-45
1
3
5
7
J25
D10
GREEN_LED
CR0603
R95
220
CR0603
2
Title
Da te :
Size
B
Tuesday, June 17, 2008
Do c ume nt Numbe r
<Doc>
Banks 0 and 1
SW7
SW DIP-8
861milX425mil
SW1
1
1
SW4
1
She e t
of
8
SW PUSHBUTTON
4.7mmX3.5mm
2
SW6
1
4
SW PUSHBUTTON
4.7mmX3.5mm
2
1
SW5
R102R103
10K 10K
CR0603
CR0603
Re v
A
SW PUSHBUTTON
4.7mmX3.5mm
2
D16
RED_LED
CR0603
R101
220
CR0603
Global Reset
or User
Defined
VCCIO_1
[3]
GSRN
D15
GREEN_LED
CR0603
R100
220
CR0603
GSRN
SW0
D14
GREEN_LED
CR0603
R99
220
CR0603
16
15
14
13
12
11
10
9
16
1
2
3
4
5
6
7
8
A
B
C
D
Lattice Semiconductor
LatticeXP Standard Evaluation Board
User’s Guide
Figure 11. Banks 0 and 1
17
A
B
C
D
R300
TP_TOE
TOE
TP_P5
TP_R1
TP_N6
TP_M7
TP_R2
TP_T2
TP_R3
TP_T3
TP_T4
TP_R5
TP_N7
TP_M8
TP_T5
TP_P6
TP_T6
TP_R6
TP_P7
TP_N8
TP_R7
TP_T7
TP_P8
TP_T8
TP_R8
TP_T9
TPP5G
TPR1G
TPN6G
TPM7G
TPR2G
TPT2G
TPR3G
TPT3G
TPT4G
TPR5G
TPN7G
TPM8G
TPT5G
TPP6G
TPT6G
TPR6G
TPP7G
TPN8G
TPR7G
TPT7G
TPP8G
TPT8G
TPR8G
TPT9G
R1250
R131
0
R1370
R139
0
R1450
R151
0
R1570
R159
0
R1650
R171
0
R1770
R179
0
R1850
R191
0
R1970
R199
0
R2050
R211
0
R2170
R219
0
R2250
R231
0
R2370
R239
0
R2450
R251
0
0
A1
A0
A3
A2
A5
A4
A7
A6
A9
A8
A11
A10
A13
A12
A15
A14
A17
A16
A19
A18
A21
A20
A23
A22
A25
A24
[7]
[7]
VCCIO_4
VCCIO_5
5
C67
10uF
SizeC
C64
10uF
SizeC
Optional pull-up, pull-down,
and pad resistors. Do not
load these resistors.
TP_R4
TP_N5
TPR4G
TPN5G
Test Points have
0.100 inch spacing.
VCCIO_5
5
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
R113
R265
R261
R257
R253
R246
R240
R233
R226
R220
R213
R206
R200
R193
R186
R180
R173
R166
R160
R153
R146
R140
R133
R126
R121
R117
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
A[25..0]
4
R114
DNS
R118
DNS
R122
DNS
R127
DNS
R134
DNS
R141
DNS
R147
DNS
R154
DNS
R161
DNS
R167
DNS
R174
DNS
R181
DNS
R187
DNS
R194
DNS
R201
DNS
R207
DNS
R214
DNS
R221
DNS
R227
DNS
R234
DNS
R241
DNS
R247
DNS
R254
DNS
R258
DNS
R262
DNS
R266
DNS
4
C68
0.1uF
CC0402
C65
0.1uF
CC0402
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
C69
0.01uF
CC0402
C66
0.01uF
CC0402
A1
A0
A3
A2
A5
A4
A7
A6
A9
A8
A11
A10
A13
A12
A15
A14
A17
A16
A19
A18
A21
A20
A23
A22
A25
A24
TOE
L7
L8
R8
T9
P8
T8
R7
T7
P7
N8
T6
R6
T5
P6
N7
M8
T4
R5
R3
T3
R2
T2
N6
M7
P5
R1
R4
N5
P4
LFXP10E-5F256C
VCCIO5_L7
VCCIO5_L8
PB20A
PB20B
PB19A
PB19B
PB18A / BDQS18
PB18B
PB16A
PB17B
PB15A
PB15B
PB14A
PB14B
PB13A
PB13B
PB12A
PB12B / VREF1_5
PB11A
PB11B
PB10A / BDQS10
PB10B
PB8A
PB9B
3
3
(2 OF 5)
PB21A
PB21B
BANK 4
VCCIO4_L9
VCCIO4_L10
PB35A
PB35B
BDQS34 / PB34A
PB34B
PB32A
PB33B
VREF1_4 / PB31A
PB31B
PB30A
PB30B
PB29A
PB29B
PB28A
PB28B
PB27A
PB27B
BDQS26 / PB26A
VREF0_4 / PB26B
PB24A
PB25B
PB23A
PB23B
PCLKT4_0 / PB22A
PCLKC4_0 / PB22B
LFXP10E (fpBGA256)
PB7A / VREF0_5
PB7B
PB6A
PB6B
TOE
BANK 5
U4B
L9
L10
T15
R15
P11
N12
T14
R14
R11
P12
T13
P14
N10
M10
M11
N11
P13
R13
R12
T12
N9
M9
R10
P10
T10
T11
R9
P9
B1
B0
B3
B2
B5
B4
B7
B6
B9
B8
B11
B10
B13
B12
B15
B14
B17
B16
B19
B18
B21
B20
B23
B22
B25
B24
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
2
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
2
R267
R263
R259
R255
R248
R242
R235
R228
R222
R215
R208
R202
R195
R188
R182
R175
R168
R162
R155
R148
R142
R135
R128
R123
R119
R115
Da te :
Size
B
Title
B[25..0]
R268
R264
R260
R256
R249
R243
R236
R229
R223
R216
R209
R203
R196
R189
R183
R176
R169
R163
R156
R149
R143
R136
R129
R124
R120
R116
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
Tuesday, June 17, 2008
Do c ume nt Numbe r
<Doc>
B1
B0
B3
B2
B5
B4
B7
B6
B9
B8
B11
B10
B13
B12
B15
B14
B17
B16
B19
B18
B21
B20
B23
B22
B25
B24
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TP_T15
R250 TP_R15
R252
TP_P11
R238TP_N12
R244
TP_T14
R230 TP_R14
R232
TP_R11
R218 TP_P12
R224
TP_T13
R210 TP_P14
R212
TP_N10
R198TP_M10
R204
TP_M11
R190 TP_N11
R192
TP_P13
R178TP_R13
R184
TP_R12
R170 TP_T12
R172
TP_N9
R158 TP_M9
R164
TP_R10
R150 TP_P10
R152
TP_T10
R138TP_T11
R144
TP_R9
R130 TP_P9
R132
TPT15G
TPR15G
TPP11G
TPN12G
TPT14G
TPR14G
TPR11G
TPP12G
TPT13G
TPP14G
TPN10G
TPM10G
TPM11G
TPN11G
TPP13G
TPR13G
TPR12G
TPT12G
TPN9G
TPM9G
TPR10G
TPP10G
TPT10G
TPT11G
TPR9G
TPP9G
Test Points have
0.100 inch spacing.
1
She e t
5
of
8
Re v
A
Optional pull-up, pull-down,
and pad resistors. Do not
load these resistors.
Banks 4 and 5
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
DNS
1
A
B
C
D
Lattice Semiconductor
LatticeXP Standard Evaluation Board
User’s Guide
Figure 12. Banks 4 and 5
18
A
B
C
D
5
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
S
S
S
S
5
J17
SMA Connector
th_sma
2
3
4
5
J15
SMA Connector
th_sma
2
3
4
5
J9
SMA Connector
th_sma
2
3
4
5
J7
SMA Connector
th_sma
2
3
4
5
1
1
1
1
50 ohm SMA Connectors
GND
GND
GND
GND
GND
GND
GND
GND
S
GND
GND
GND
GND
GND
GND
GND
GND
S
S
J21
SMA Connector
th_sma
2
3
4
5
J19
SMA Connector
th_sma
2
3
4
5
J13
SMA Connector
th_sma
2
3
4
5
J11
SMA Connector
th_sma
2
3
4
5
S
1
1
1
1
R31
DNS
R25
DNS
R19
DNS
R14
DNS
[7]
[7]
VCCIO_6
VCCIO_7
4
TP_4
C20
10uF
SizeC
C17
10uF
SizeC
Diff pair, equal length, 50 ohms
Diff pair, equal length, 50 ohms
Diff pair, equal length, 50 ohms
Diff pair, equal length, 50 ohms
TP_3
4
R33
R29
R27
R23
R21
R18
R16
R12
0
0
0
0
0
0
0
C21
0.1uF
CC0402
C18
0.1uF
CC0402
C19
0.01uF
CC0402
C22
0.01uF
CC0402
G6
H6
J1
J2
H3
J3
TP_H3
TP_J3
G4
G5
H1
H2
G3
G2
G1
F3
F2
E3
F4
E1
F1
D1
E2
TP_J1
TP_J2
TP_G4
TP_G5
TP_H1
TP_H2
TP_G1
TP_F3
TP_F2
TP_D1
TP_E2
D2
D3
LFXP10E-5F256C
VCCIO7_G6
VCCIO7_H6
PL18A
PL18B
PL16A / LDQS16
PL16B
PL14A / VREF1_7
PL15B
PL13A
PL13B
PL12A / LUM0_PLLT_IN_A
PL12B / LUM0_PLLC_IN_A
PL11B
PL9A
PL9B
PL8A / LUM0_PLLT_OUT_A
PL8B / LUM0_PLLC_OUT_A
PL7A / LDQS7
PL7B
PL5A / LUM0_PLL_RST
PL6B / VREF0_7
LDQS24 / PL24A
PL24B
PL22A
VREF0_6 / PL23B
PCLKT6_0 / PL20A
PCLKC6_0 / PL20B
BANK 6
3
VCCIO6_J6
VCCIO6_K6
PL35A
PL35B
LLM0_PLLT_FB_A / PL34A
LLM0_PLLC_FB_A / PL34B
LDQS33 / PL33A
PL33B
VREF1_6 / PL31A
LLM0_PLL_RST / PL32B
LLM0_PLLT_OUT_A / PL29A
LLM0_PLLC_OUT_A / PL29B
PL28A
PL26A
PL26B
LLM0_PLLT_IN_A / PL25A
LLM0_PLLC_IN_A / PL25B
(1 OF 5)
LFXP10E (fpBGA256)
PL3A / LUM0_PLLT_FB_A
PL3B / LUM0_PLLC_FB_A
BANK 7
Short stubs on all diff pairs
U4A
0
J6
K6
M3
N3
L5
M6
P1
P2
N1
N2
K4
K5
L4
K3
L3
M1
M2
L1
L2
J4
J5
K1
K2
TP_M3
TP_N3
TP_P1
TP_P2
TP_N1
TP_N2
TP_L4
TP_K3
TP_L3
TP_L1
TP_L2
TP_J4
TP_J5
TP_5
R35
R32
R30
R26
R24
R20
R17
R13
Short stubs on all diff pairs
Check Datasheet for Proper Termination Selection
3
0
0
0
0
0
0
0
0
R34
DNS
R28
DNS
R22
DNS
R15
DNS
Diff pair, equal length, 50 ohms
2
Diff pair, equal length, 50 ohms
1
1
1
1
GND
GND
GND
GND
2
3
4
5
GND
GND
GND
GND
2
3
4
5
GND
GND
GND
GND
2
3
4
5
GND
GND
GND
GND
2
3
4
5
D ate:
1
1
1
1
1
Tuesday, June 17, 2008
GND
GND
GND
GND
2
3
4
5
GND
GND
GND
GND
2
3
4
5
GND
GND
GND
GND
2
3
4
5
GND
GND
GND
GND
2
3
4
5
1
Sheet
J18
SMA Connector
th_sma
S
J16
SMA Connector
th_sma
S
J10
SMA Connector
th_sma
S
J8
SMA Connector
th_sma
S
50 ohm SMA Connectors
Banks 6 and 7
J22
SMA Connector
th_sma
S
J20
SMA Connector
th_sma
S
J14
SMA Connector
th_sma
S
J12
SMA Connector
th_sma
S
Si ze
D ocument Number
Custom <Doc>
Title
Diff pair, equal length, 50 ohms
Diff pair, equal length, 50 ohms
2
6
of
8
Rev
A
A
B
C
D
Lattice Semiconductor
LatticeXP Standard Evaluation Board
User’s Guide
Figure 13. Banks 6 and 7
A
B
C
D
1
2
3
R271
DNI
CR0805
R272
0
CR0805
1
FCB
D1
MBRS340
SMC
+
VCC_3.3V
VCC_ADJ
VCC_1.2V
VCC_3.3V
VCC_ADJ
VCC_1.2V
VCC_3.3V
VCC_ADJ
VCC_1.2V
VCC_3.3V
VCC_ADJ
VCC_1.2V
VCC_3.3V
VCC_ADJ
VCC_1.2V
VCC_3.3V
VCC_ADJ
VCC_1.2V
VCC_3.3V
VCC_ADJ
VCC_1.2V
VCC_3.3V
5
2
4
6
JP13
JP12
2
4
6
2
4
6
JP11
2
4
6
JP10
2
4
6
JP3
2
4
6
JP2
2
4
6
JP1
HEADER_3X2
1
3
5
HEADER_3X2
1
3
5
HEADER_3X2
1
3
5
HEADER_3X2
1
3
5
HEADER_3X2
1
3
5
HEADER_3X2
1
3
5
3
VCCIO_0
VCCIO_6
VCCIO_5
VCCIO_4
VCCIO_3
VCCIO_2
VCCIO_1
C9
10uF
SizeC
C7
2200pF
CC0805
[2]
VCCIO_0
VCCM_3.3V
PWR_3.3V
R270
1
CR0805
R3
10K
CR0805
Place Switch next to
DC input jack
HEADER_3X2
1
3
5
2
C2
0.001uF
CC0805
3.3V On/Off Switch
1
On
SW1
SW SPDT
Off
EEVFK1V101P
C1
100uF
Select only one voltage for each VCCIO
VCC_3.3V
INTVCC
Banana Jack
CONN_BLACK
S
J4
2.5mm Pin, (+)
5.5mm Barrel, (-)
VCC_IN
Banana Jack
4.5VDC to 28VDC
J3
PWR JACK
RAPC712
1
EG1257
S
1
2
Vosence
Vprog
Ith
FCB
Run/SS
EXTVcc
1
2
3
SW
VIN
ISENSE
SOT23-6
4
2
4
6
JP14
TPS64203DVB
/EN
GND
FB
U2
LTC1775
7
8
5
4
3
1
VCC_3.3V
VCC_ADJ
VCC_1.2V
FCB
C70
0.1uF
CC0805
U1
16
Vin
CONN_RED
SGND
6
PGND
6
5
4
9
J2
1
2
+
R1
10
CR0805
CR0805
C6
4.7uF
C2012X5ROJ475M
D2
1N5819
SOD-123
R4
VCCIO_7
R8
10K
CR0805
C12
4.7pF
CC0805
DRAIN_ADV
10
.47uF C0603C474K8PACTU
CC0805
INTVCC
C3
R6
10
CR0805
10
11
12
14
13
15
HEADER_3X2
1
3
5
BG
INTVcc
Boost
SW
TG
TK
5
6
7
8
S
D
D
D
G
D
D
D
D4
B320A
SMA
1
4
Q5
C16
4.7pF
CC0805
2
3 2 1
3
C11
1uF
SizeA
F2
3A
VCC_ADJ
J5
CONN_RED
D3
MBRS340
SMC
VCC_3.3V
VCC_ADJ
VCC_1.2V
3
JP4
2
2
HEADER1X2
1
JP6
HEADER1X2
1
JP5
HEADER1X2
1
2
L1 DO5022P-103
1
2
10uH
15.24mmX18.54mm
TP_1
Output Voltage Adjust
R9
200K POT
5.6mmX3.6mm
C10
100uF
SizeD
PWR_ADJ
Q2
Si4840DY
8 7 6 5
3 2 1
Q1
Si4840DY
8 7 6 5
R11
100K
CR0805
Si5447DC
R5
10K
CR0805
4
R2
10K
CR0805
2
6.2uH
7mmX7mm
L2
4
3
2
1
+
+
C5
470uF
1
2
3
SW
VIN
ISENSE
2
SOT23-6
TPS64203DVB
/EN
GND
FB
U3
6
5
4
2
Use 1.2V for LFXPxxE devices
Use 1.8V, 2.5V, or 3.3V for LFXPxxC devices
For 1.8V and 2.5V use VCC_ADJ
Load only one current
sense resistor for VCC_CORE
[2]
C8
10uF
SizeC
TP_2
T520D477M004ASE040
VCC_CORE
PWR_3.3V
C4
470uF
PWR_3.3V
F1
3A
J1
CONN_RED
S
1
2
1
R7
10
R10
10K
CR0805
C15
4.7pF
CC0805
DRAIN_1.2
CR0805
[2,3]
VCC_3.3V
JB2
PWR_1.2V
JB3
C13
100uF
SizeD
JB4
JB5
C14
1uF
SizeA
F3
3A
JB6
VCC_1.2V
J6
CONN_RED
JB7
JB9
JB10
JB11
JB12
JB13
JB14
1
Wednesday, September 07, 2005
D ocument Number
<D oc>
Sheet
7
of
8
Rev
A
JBLOCK JBLOCK JBLOCK JBLOCK JBLOCK JBLOCK JBLOCK
JB8
Lattice Semiconductor Corporation
Power
D ate:
Si ze
C
Q3
Si2323DS
SOT23
JBLOCK JBLOCK JBLOCK JBLOCK JBLOCK JBLOCK JBLOCK
JB1
G
Another P-Channel MOSFET option in SOT23 package
Si5447DC
L3
2
6.2uH
7mmX7mm
Title
Title
D5
B320A
SMA
1
Q6
Q4
Si2323DS
SOT23
Another P-Channel MOSFET option in SOT23 package
G
1
S
D
S
D
4
1
2
S
1
2
1
1
2
1
2
5
6
7
8
S
D
D
D
G
D
D
D
4
3
2
1
5
3
1
1
2
S
1
2
1
1
19
2
A
B
C
D
Lattice Semiconductor
LatticeXP Standard Evaluation Board
User’s Guide
Figure 14. Power
20
4
3
2
Lattice Semiconductor Corporation
D ate:
1
Wednesday, September 07, 2005
D ocument Number
<D oc>
Mechanical Drawing
Sheet
8
of
8
Rev
A
A
A
Si ze
C
B
B
5
Title
1
C
2
C
3
D
4
D
5
Lattice Semiconductor
LatticeXP Standard Evaluation Board
User’s Guide
Figure 15. Mechanical Drawing