MB39C811

MB39C811
Ultra Low Power Buck PMIC
Solar/Vibrations Energy Harvesting
The MB39C811 is the high efficient buck (Power Management) DC/DC converter IC which adopts the all-wave bridge
rectifier using the low-dissipation and the comparator system. It achieves the energy harvest solution for the energy
source of the high output impedance such as the piezoelectric transducer.
It is possible to select from eight preset output voltages and supply up to 100 mA of the output curr ent.
Features
 Quiescent current (No load, Output in regulation):
1.5µA
 Output current: Up to 100mA
 Quiescent current (VIN = 2.5V UVLO): 550nA
 Integrated Low Loss Full-Wave Bridge Rectifier
 Shunt for input protection: VIN ≥ 21V, Up to 100mA
Pull-down
 VIN input voltage range: 2.6V to 23V
 Over current limit
 Preset output voltage: 1.5V, 1.8V, 2.5V, 3.3V, 3.6V,
4.1V, 4.5V, 5.0V
 I/O power-good detection signal output
 Protection functions
Applications
 Light energy harvesting
 Wireless HVAC sensor
 Piezoelectric energy harvesting
 Stand-alone nano-power buck regulator
 Electro-Mechanical energy harvesting
Online Design Simulation
Easy DesignSim
This product supports the web-based design simulation tool.
It can easily select external components and can display useful information.
Please access from the following URL.
http://cypress.transim.com/login.aspx
Cypress Semiconductor Corporation
Document Number: 002-08401 Rev *A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised February 22, 2016
MB39C811
Contents
1.
Pin Assignments ................................................................................................................................................... 3
2.
Pin Descriptions .................................................................................................................................................... 4
3.
Block Diagram ....................................................................................................................................................... 5
4.
Absolute Maximum Ratings ................................................................................................................................. 6
5.
Recommended Operating Conditions ................................................................................................................. 7
6.
Electrical Characteristics ..................................................................................................................................... 8
6.1
DC Characteristics ............................................................................................................................................... 8
6.2
Characteristics of Built-in Bridge Rectification Circuit ........................................................................................... 9
6.3
AC Characteristics (Input/Output Power-Good).................................................................................................... 9
7.
Function ............................................................................................................................................................... 10
7.1
Operational Summary ........................................................................................................................................ 10
7.2
Start-Up/Shut-Down Sequences ........................................................................................................................ 11
7.3
Function Descriptions ......................................................................................................................................... 11
8.
Typical Application Circuits ............................................................................................................................... 13
9.
Application Notes................................................................................................................................................ 15
10. Typical Characteristics ....................................................................................................................................... 19
11. Layout for Printed Circuit Board........................................................................................................................ 25
12. Usage Precaution ................................................................................................................................................ 26
13. Ordering Information .......................................................................................................................................... 26
14. Marking ................................................................................................................................................................ 26
15. Product Labels .................................................................................................................................................... 27
16. Recommended Mounting Conditions................................................................................................................ 30
17. PackageDimensions ........................................................................................................................................... 32
18. Major Changes .................................................................................................................................................... 33
Document History........................................................................................................................................................ 35
Document Number: 002-08401 Rev *A
Page 2 of 36
MB39C811
1.
Pin Assignments
Figure 1. Pin Assignments
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
(TOP VIEW)
40
39
38
37
36
35
34
33
32
31
28
VOUT
N.C.
4
27
IPGOOD
VIN
5
26
OPGOOD
LX
6
25
GND
PGND
7
24
S0
N.C.
8
23
S1
GND
9
22
S2
N.C.
10
21
GND
11
12
13
14
15
16
17
18
19
20
N.C.
3
AC2_1
N.C.
DCOUT2
VB
AC2_2
29
DCGND2
2
DCGND1
N.C.
AC1_2
GND
DCOUT1
30
AC1_1
１
N.C.
N.C.
(QFN_40PIN)
Document Number: 002-08401 Rev *A
Page 3 of 36
MB39C811
2.
Pin Descriptions
Table 1. Pin Descriptions.
Pin
Pin No.
I/O
Name
Description
1 to 4
N.C.
-
Non connection pins (Leavethese pins open)
5
VIN
-
DC power supply input pin
6
LX
O
DC/DC output pin
7
PGND
-
PGND pin
8
N.C.
-
Non connection pin (Leavethis pin open)
9
GND
-
GND pin
10,11
N.C.
-
Non connection pins (Leavethese pins open)
12
AC1_1
I
Bridge Rectifier1 AC input pin 1
13
DCOUT1
O
Bridge Rectifier1 DC output pin
14
AC1_2
I
Bridge Rectifier1 AC input pin 2
15
DCGND1
-
GND pin
16
DCGND2
-
GND pin
17
AC2_2
I
Bridge Rectifier2 AC input pin 2
18
DCOUT2
O
Bridge Rectifier2 DC output pin
19
AC2_1
I
Bridge Rectifier2 AC input pin 1
20
N.C.
-
Non connection pin (Leavethis pin open)
21
GND
-
GND pin
22
S2
I
Output voltage select pin 2
23
S1
I
Output voltage select pin 1
24
S0
I
Output voltage select pin 0
25
GND
-
GND pin
26
OPGOOD
O
Output power-good output pin
27
IPGOOD
O
Input power-good output pin
28
VOUT
I
Output voltage feedback pin
29
VB
O
Internal circuit power supply pin
30
GND
-
GND pin
31 to 40
N.C.
-
Non connection pins (Leavethese pins open)
Document Number: 002-08401 Rev *A
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MB39C811
3.
Block Diagram
C1
CVIN
VIN
DCOUT2
DCOUT1
Figure 2. Block Diagram
AC1_1
SHUNT
DCGND1
AC1_2
AC2_1
LX
L1
C2
CVOUT
DCGND2
AC2_2
PGND
ERR
CMP
S2,S1,S0
VOUT
CONTROL
3
VOUT
CTL
VOUT
VIN
BGR
IPGOOD
UVLO
VB
C3
CVB
OPGOOD
VB REG.
PGOOD
UVLO_VB
Document Number: 002-08401 Rev *A
Page 5 of 36
MB39C811
4.
Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings
Parameter
Symbol
Rating
Condition
Unit
-0.3
Max
+24
V
-
0.25
V/ms
-
100
mA
-0.3
+24
V
-
50
mA
LX pin
-0.3
+24
V
S0 pin, S1 pin, S2 pin
-0.3
VIN pin input voltage
VVINMAX
VIN pin
VIN pin input slew rate
SRMAX
VIN pin
VIN pin input current
IINMAX
VIN pin
Min
(VIN≥7V)
AC1_1 pin, AC1_2 pin,
AC pin input voltage
VACMAX
AC pin input current
IPVMAX
LX pin input voltage
VLXMAX
Input voltage
VVINPUTMAX
VOUT pin
-0.3
+7.0
V
Power dissipation
PD
Ta≤ +25°C
-
2500
mW
Storage temperature
TSTG
-
-55
+125
°C
VESDH
Human Body Model
(100pF, 5kΩ)
-900
+2000
V
VESDM
Machine Model (200pF,
0Ω)
-150
+150
V
VCDM
Charged Device Model
-1000
+1000
V
ESD voltage 1
ESD voltage 2
ESD voltage3
AC2_1 pin, AC2_2 pin
AC1_1 pin, AC1_2 pin,
AC2_1 pin, AC2_2 pin
VVB + 0.3
(≤+7.0)
V
Figure 3. Power Dissipation - Operating Ambient Temperature
Power dissipation [W]
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
0
25
50
75
100
Temperature [℃]
WARNING:
− Semiconductor devices may be permanently damaged by application of stress (including, without limitation,
voltage, current or temperature) in excess of absolute maximum ratings.Do not exceed any of these ratings.
Document Number: 002-08401 Rev *A
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MB39C811
5.
Recommended Operating Conditions
Table 3. Recommended operating conditions
Parameter
VIN pin input voltage
AC pin input voltage
Input voltage
Operating ambient temperature
Symbol
VVIN
VPV
Condition
VIN pin
AC1_1 pin, AC1_2 pin,
AC2_1 pin, AC2_2 pin
Value
Min
2.6
Typ
Unit
-
Max
23
V
-
-
23
V
VSI
S0 pin, S1 pin, S2 pin
0
-
VVB
V
VFB
VOUT pin
0
-
5.5
V
-
-40
-
+85
°C
Ta
WARNING:
− The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is operated
under these conditions.
− Any use of semiconductor devices will be under their recommended operating condition.
− Operation under any conditions other than these conditions may adversely affect reliability of device and could
result in device failure.
− No warranty is made with respect to any use, operating conditions or combinations not represented on this data
sheet. If you are considering application under any conditions other than listed herein, please contact sales
representatives beforehand.
Document Number: 002-08401 Rev *A
Page 7 of 36
MB39C811
6.
Electrical Characteristics
6.1
DC Characteristics
Table 4. DC Characteristics
(Ta = -40°C to +85°C, VVIN = 7.0V, L1 = 22µH, C2 = 47µF)
Parameter
Quiescent current
Preset output voltage
Symbol
IVIN
VVOUT
Peak switching current
IPEAK
Maximum Output
current
IOUTMAX
Condition
Value
Max
Unit
Min
Typ
VVIN = 2.5V (UVLO), Ta = +25°C
-
550
775
nA
VVIN = 4.5V (sleep mode), Ta = +25°C
-
1.5
2.25
µA
VVIN = 18V (sleep mode), Ta =+25°C
-
1.9
2.85
µA
S2 = L, S1 = L, S0 = L, IOUT = 1mA
1.457
1.5
1.544
V
S2 = L, S1 = L, S0 = H, IOUT = 1mA
1.748
1.8
1.852
V
S2 = L, S1 = H, S0 = L, IOUT = 1mA
2.428
2.5
2.573
V
S2 = L, S1 = H, S0 = H, IOUT = 1mA
3.214
3.3
3.386
V
S2 = H, S1 = L, S0 = L, IOUT = 1mA
3.506
3.6
3.694
V
S2 = H, S1 = L, S0 = H, IOUT = 1mA
3.993
4.1
4.207
V
S2 = H, S1 = H, S0 = L, IOUT = 1mA
4.383
4.5
4.617
V
S2 = H, S1 = H, S0 = H, IOUT = 1mA
4.870
5.0
5.130
V
-
200
250
400
mA
100*
-
-
mA
3.8
4.0
4.2
V
4.94
5.2
5.46
V
6.84
7.2
7.56
V
2.6
2.8
3.0
V
3.8
4.0
4.2
V
5.7
6.0
6.3
V
Ta = +25°C
S2 = L, S1 = L, S0 = L
S2 = L, S1 = L, S0 = H
UVLO release voltage
(Input power-good
detectionvoltage)
S2 = L, S1 = H, S0 = L
VUVLOH
S2 = L, S1 = H, S0 = H
S2 = H, S1 = L, S0 = L
S2 = H, S1 = L, S0 = H
S2 = H, S1 = H, S0 = L
S2 = H, S1 = H, S0 = H
S2 = L, S1 = L, S0 = L
S2 = L, S1 = L, S0 = H
UVLO detection
voltage
(Input power-good
resetvoltage)
S2 = L, S1 = H, S0 = L
VUVLOL
S2 = L, S1 = H, S0 = H
S2 = H, S1 = L, S0 = L
S2 = H, S1 = L, S0 = H
S2 = H, S1 = H, S0 = L
S2 = H, S1 = H, S0 = H
VIN pin shunt voltage
VSHUNT
IVIN = 1mA
19
21
23
V
VIN pin shunt current
ISHUNT
-
100
-
-
mA
Output power-good
detectionvoltage
(Rising)
VOPGH
To preset voltage ratio
VVOUT≥3.3V[2]
90
94
98
%
Output power-good
resetvoltage (Falling)
VOPGL
65.5
70
74.5
%
Power supply output
voltage forinternal
circuit
VVB
-
5.0[1]
-
V
To preset voltage ratio
VVIN = 6V to 20V
[1]: This parameter is not be specified. This should be used as a reference to support designing the circuits.
Document Number: 002-08401 Rev *A
Page 8 of 36
MB39C811
[2]: Please contact the department in charge if use this output power-good function under the conditions of
VVOUT≤2.5V.
6.2
Characteristics of Built-in Bridge Rectification Circuit
Table 5. Characteristics of Built-in Bridge Rectification Circuit
(Ta = +25°C)
Parameter
Symbol
Condition
Value
Unit
Forward bias voltage
VF
IF = 10µA
Min
150
Forward direction current
IF
-
-
-
50
mA
Reverse bias leak current
IR
VR = 18V
-
-
20
nA
Break down voltage
VBREAK
IR = 1µA
VSHUNT
25
-
V
6.3
Typ
280
Max
450
mV
AC Characteristics (Input/Output Power-Good)
Table 6. AC Characteristics
(Ta = +25°C, VOUT = 3.3V)
Parameter
Symbol
Value
Condition
Min
Typ
Max
Unit
Input power-good detection delay time
(Rising)
tIPGH
SRVIN = 0.1V/ms
-
1
-
ms
Input power-good reset delay time (Falling)
tIPGL
SRVIN = 0.1V/ms
-
1
-
ms
Input power-good undefined time
tIPGX
-
1
3
ms
Output power-good detection delay time
(Rising)
tOPGH
OPGOOD rising
IOUT = 0mA,
L1 = 22μH,
C2 = 47μF,
-
1
-
ms
Output power-good reset delay time (Falling)
tOPGL
-
1
-
ms
IOUT = 1mA,
C2 = 47μF
Figure 4. AC characteristics
VUVLOH
VIN
VUVLOL
VOPGH
VOPGL
VOUT
tIPGH
IPGOOD
tIPGL
tIPGX
OPGOOD
tOPGH
tOPGL
Document Number: 002-08401 Rev *A
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MB39C811
7.
Function
7.1
Operational Summary
Bridge Rectifier
The A/C voltage which is input to the AC1_1 and AC1_2 pins or the AC2_1 and AC2_2 pins is all-wave rectified at the
bridge rectifier of the low-dissipation diode. The bridge rectifier output is output from the DCOUT1 pin and the
DCOUT2 pin. By connecting those outputs to the VIN pin, the electric charge is accumulated to the capacitor and it is
used as the energy condenser of the buck converter.
Power Supply for Internal Circuit
When the VIN pin voltage is 3.5V or lower, the power supply is supplied from the VIN pin to the internal circuit directly.
If the VIN pin is over 3.5V, the internal regulator is activated and the power supply is supplied from the internal
regulator to the internal circuit. Therefore, the stable output voltage is maintained in the wide input voltage range 2.6 V
to 23V.
DC/DC Start-Up/Shut-Down
When the VIN pin voltage is over the release voltage VUVLOH for the under voltage lockout protection circuit (UVLO),
the converter circuit is enabled and the electric charge is supplied from the input capacitor to the output capacitor.
IN
When the V pin voltage is below the UVLO detection voltage VUVLOL, the converter is disabled. The 12V hysteresis
between the release voltage and the detection voltage for UVLO prevents the converter from noise or frequent
ON/OFF which is caused by the VIN pin voltage-drop during start-up.
Sleep/Auto Active Control
When the feedback voltage VFB for the converter reaches the determinate voltage, the sleep state to stop the
switching operation starts and that can reduce the consumption power from the internal circuit. When the VOUT voltage
is below the threshold value, the VOUT voltage is maintained to the rated value by making the converter active again.
Document Number: 002-08401 Rev *A
Page 10 of 36
MB39C811
7.2
Start-Up/Shut-Down Sequences
Figure 5. Timing Chart
AC1_1,
AC1_2
or
AC2_1,
AC2_2
VSHUNT
Charge
Voltage
VVB
VIN
VUVLOH
VUVLOL
VB
VVB
Internal
Regulator
Start-up
UVLO
Rising
UVLO
(internal signal)
DC/DC
Enable
LX
active
Transfer Charge
to the Output
VOUT
VOPGH
sleep
VOPGL
Output
IPGOOD
IPGOOD
Rest
IPGOOD
Output
OPGOOD
OPGOOD
7.3
UVLO
Falling
UVLO
Falling
Reset
OPGOOD
Function Descriptions
Output Voltage Setting and Under Voltage Lockout Protection (UVLO) Function
It is possible to select the output voltage from eight kinds of presets using the S2, S1 and S0 pins.
Also, the under voltage lockout protection circuit is provided to prevent IC's malfunction by the transient state or the
instant drop during the VIN pin voltage activation, system destroy and deterioration, and it is set as follows according
to the preset voltage. When the VIN pin exceeds the release voltage for the UVLO circuit, the system is recovered.
Table 7. Output Voltage Setting and Under Voltage Lockout Protection (UVLO) Function
Under voltage lockout protection (UVLO) -TypS2
S1
S0
VOUT[V]
L
L
L
1.5
L
L
H
1.8
L
H
L
2.5
L
H
H
3.3
H
L
L
3.6
H
L
H
4.1
H
H
L
4.5
H
H
H
5.0
Document Number: 002-08401 Rev *A
Detection voltage
(Falling) VUVLOL [V]
Release voltage
(Rising) VUVLOH [V]
2.8
4.0
4.0
5.2
6.0
7.2
Page 11 of 36
MB39C811
Input/output power-good signal output
When the VIN pin input voltage is equal to the release voltage VUVLOH for UVLO or more, the output for the
IPGOOD pin is set to the “H” level as the input power-good. When the VIN pin input voltage is equal to the detection
voltage VUVLOL for UVLO or less, the output for the IPGOOD pin is reset to the “L” level. The IPGOOD output is
enabled only when the following output power-good signal output OPGOOD is “H” level.
The output power-good signal OPGOOD is set to the “H” level when the feedback voltage VFB for the VOUT pin is
equal to the detection voltage VOPGH or more. When the feedback voltage VFB is equal to the reset voltage VOPGL
or less, the output for the OPGOOD pin is reset to the “L” level.
Table 8. Input Power-Good Signal Output (IPGOOD)
OPGOOD
L
UVLO
Don’t care
IPGOOD
L
H
L
L
H
H
H
Table 9. Output Power-Good Signal Output (OPGOOD)
VFB
≤ VOPGL
OPGOOD
L
≥ VOPGH
H
(VVOUT ≥ 3.3V) [1]
[1]:Please contact the department in charge if use this output power-good function under the conditions of
VVOUT≤2.5V.
Figure 6. Input/Output Power-Good Signal Output
OPGOOD
Logic
High
Logic
Low
VOPGL
VOPGH
VOUT
Input Over Voltage Protection
If the voltage exceeding VSHUNT (Typ : 21V) is input to the VIN pin, the input level is clamped enabling the over
voltage protection circuit. The flowing current is ISHUNT (Min 100mA) during clamp .
Over Current Protection
If the output current for the LX pin reaches the over current detection level IPEAK, the circuit is protected by
controlling the peak value for the inductor current setting the main side FET to the OFF state.
Document Number: 002-08401 Rev *A
Page 12 of 36
MB39C811
8.
Typical Application Circuits
Figure 7. Application Circuit For Photovoltaic Energy Harvester
PV
AC1_1
DCGND1
AC1_2
C3
4.7uF
DCOUT1
VIN
C1
10uF
VB
L1
22uH
VOUT
LX
S2
S1
S0
Output voltage
select
GND
VOUT
C2
47uF
IPGOOD
OPGOOD
PGND
Figure 8. Application circuit for vibration energy harvester
AC2_1
DCGND2
PZ1
AC2_2
C3
4.7uF
DCOUT2
VIN
C1
10uF
VB
LX
S2
S1
S0
Output voltage
select
Document Number: 002-08401 Rev *A
GND
VOUT
L1
22uH
VOUT
C2
47uF
IPGOOD
OPGOOD
PGND
Page 13 of 36
MB39C811
Figure 9. Voltage doubler rectification circuit for vibration harvester
C4
10uF
PZ1
DD
DCGND1
1
C5
10uF
DD
2
AC1_1
DCOUT1
AC1_2
C3
4.7uF
VIN
VB
L1
22uH
LX
VOUT
S2
S1
S0
Output voltage
select
VOUT
C2
47uF
IPGOOD
OPGOOD
GND
PGND
Operation of the double voltage rectifier circuit rectifying an AC input voltage
When the AC1_1 input voltage is positive, the capacitor C4 charges up through the diode DD1, and when the AC1_1
input voltage is negative, the capacitor C5 charges up through the diode DD2. Each capacitor takes on a charge of
the positive peak of the AC input. The output voltage at the VIN pin is the series total of C4+C5.
Table 10. Parts list
Part number
C1
Value
10μF[1]
Description
Capacitor
C2
47μF[1]
Capacitor
C3
4.7μF
Capacitor
C4
10μF
[1]
Capacitor
C5
10μF[1]
Capacitor
L1
10μH to 22μH
Inductor
[1]: Adjust the values according to the source supply ability and the load power.
Document Number: 002-08401 Rev *A
Page 14 of 36
MB39C811
9.
Application Notes
Inductor
The MB39C811 is optimized to work with an inductor in the range of 10µH to 22µH. Also, since the peak switching
current is up to 400mA, select an inductor with a DC current rating greater than 400mA.
Table 11. Manufactures of Recommended Inductors
Part number
LPS5030-223ML
Value
22μH
Manufacture
Coilcraft, Inc.
VLF403215MT-220M
22μH
TDK Corporation
Harvester (Photovoltaic Power Generator)
In case of photovoltaic energy harvesting, such as solar or light energy harvesting, use a solar cell with high
open-circuit voltage which must be higher than the UVLO release voltage. Electric power obtained from light or solar
is increased in proportion to the ambient illuminance.
There are silicone-based solar cells and organic-based solar cells about photovoltaic power
generators.Silicone-based solar cells are single crystal silicon solar cell, polycrystalline silicon solar cell, and
amorphous silicon solar cell. Organic-based solar cells are dye-sensitized solar cell (DSC), and organic thin film solar
cell. Crystal silicon and polycrystalline silicon solar cells have high energy conversion efficiency. Amorphous silicon
solar cells are lightweight, flexible, and produced at low cost. Dye-sensitized solar cells are composed by sensitizing
dye and electrolytes, and are low-cost solar cell. Organic thin film solar cells are lightweight, flexible, and easily
manufactured.
Table 12. Manufactures Of Photovoltaic Harvesters
Part number/Series name
BCS4630B9
Type
Film amorphous silicon solar cells
Manufacture
TDK Corporation
Amorton
Amorphous silicon solar cells
Panasonic Corporation
Harvester (Vibration Power Generator,Piezoelectric Generator)
Vibration power generators produce AC power by vibration. For AC to DC rectification, the MB39C811 integrates two
bridge rectifiers. Electric power obtained from a vibration power generator depends on frequency of vibration and
usage of the generator. Although, vibration generators produce high voltage, the shunt circuit protects from higher
voltage than 21V.
There are electromagnetic induction generators and piezoelectric generators about vibration harvesters. The
electromagnetic induction generator is consists of coil and magnet. The piezoelectric generators are made from
plastics or ceramics. Plastic-based piezoelectric generators made from polyvinylidene fluoride are lightweight, flexible.
Ceramic-based piezoelectric generators are made from barium titanate or leas zirconate titanate ceramics.
Table 13. Manufactures of Vibration Harvesters
Part number
EH12, EH13, EH15
Document Number: 002-08401 Rev *A
Type
Electromagnetic induction
Manufacture
Star Micronics Co., Ltd.
Page 15 of 36
MB39C811
Sizing of Input and Output Capacitors
Energy from harvester should be stored on the Cin and Cout to operate the application block. If the size of these
capacitors were too big, it would take too much time to charge energy into these capacitors, and the system cannot be
operated frequently. On the other hand, if these capacitors were too small, enough energy cannot be stored on these
capacitors for the application block. The sizing of the Cin and Cout is important.
Common capacitors are layered ceramic capacitor, electrolytic capacitor, electric double layered capacitor, and so on.
Electrostatic capacitance of layered ceramic capacitors is relatively small. However, layered ceramic capacitors are
small and have high voltage resistance characteristic. Electrolytic capacitors have high electrostatic capacitance from
µF order to mF order. The size of capacitor becomes large in proportion to the size of capacitance. Electric double
layered capacitors have high electrostatic capacitance around 0.5F to 1F, but have low voltage resistance
characteristics around 3V to 5V. Be very careful with a voltage resistance characteristic. Also, leak current, equivalent
series resistance (ESR), and temperature characteristic are criteria for selecting,
Table 14. Manufactures Of Capacitors
Part number/Series name
EDLC351420-501-2F-50
Type, Capacitance
EDLC, 500mF
EDLC082520-500-1F-81
EDLC, 50mF
EDLC041720-050-2F-52
EDLC, 5mF
Gold capacitor
EDLC
Manufacture
TDK Corporation
Panasonic Corporation
First of all, apply the following equation and calculate energy consumption for an application from voltage, current, and
time during an operation.
The energy stored on a capacitor is calculated by the following equation.
Since the energy in a capacitor is proportional to the square of the voltage, it is energetically advantageous for the
buck DC/DC converter to make the Cin larger.
An example of an application using the power gating by the OPGOOD signal is shown in the Figure 10. The Cin and
the Cout are sized so as to satisfy the following equation. The η, the efficiency of the MB39C811, is determined from
the current of application and the graph shown in Figure 12, Efficiency vs IOUT.
dECin and dECout are the available energies for the application.
Document Number: 002-08401 Rev *A
Page 16 of 36
MB39C811
Figure 10. Application example using the power gating by the OPGOOD signal
OPGOOD
VIN
Cin
Harvester
VUVLOH
VUVLOL
+
VUVLOH : UVLO release voltage
VUVLOL : UVLO detection voltage
Power
Gating
Cout
MB39C811
Efficiency(η)
0V
Available Energy
VOUT
Appli.
VVOUT
VOPGL
0V
Total Energy
VVOUT : Preset output voltage
VUVLOL : Output power-good reset voltage
Before calculating the initial charging time (TInitial[s]), calculate the total energy (ECin and ECout) stored on both Cin and
Cout.
A PHarvester[W] is a power generation capability of a harvester. An initial charging time (TInitial[s]) is calculated by the
following equation.
A repeat charging time (TRepeat[s]) is calculated by the following equation. The TRepeat[s] become shorter than the
TInitial[s].
Additionally, waiting for a period of time after the OPGOOD signal goes high can store more energy on the capacitor
Cin Figure 11.
Document Number: 002-08401 Rev *A
Page 17 of 36
MB39C811
Figure 11. Waiting for a Period of Time after the OPGOOD Signal goes High
OPGOOD
Light
VIN
Solar
Cell
Open circuit
voltage of
solar cell
Cin
VOUT
VVOUT
VOPGL
0V
0V
Available Energy
Cout
MB39C811
VUVLOL
+
VUVLOL : UVLO detection voltage
Power
Gating
Appli.
Wait after
OPGOOD
was High.
Total Energy
VVOUT : Preset output voltage
VUVLOL : Output power-good reset voltage
For more information about the energy calculation, refer to the APPLICATION NOTE, Energy Calculation For
Energy Harvesting.
Document Number: 002-08401 Rev *A
Page 18 of 36
MB39C811
10.
Typical Characteristics
Figure 12. Typical characteristics of DC/DC Converter
Line Regulation: VOUT vs VIN
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 22µH
1.54
5.00
1.50
3.30
4.98
1.48
3.28
3.26
1.46
8
10
12
VIN [V]
14
16
4.96
4.94
3.24
6
18
Load Regulation: VOUT vs IOUT
1.54
VOUT [V]
3.32
VOUT [V]
VOUT [V]
Preset output voltage = 5.0V
1.52
1.44
6
IOUT = 100mA, L = 22µH
5.02
Preset output voltage = 3.3V
Preset output voltage = 1.5V
8
10
12
VIN [V]
14
16
18
4.92
6
8
Load Regulation: VOUT vs IOUT
VIN = 7.0V, L = 22µH
5.02
Preset output voltage = 3.3V
1.50
3.30
4.98
VOUT [V]
5.00
VOUT [V]
3.32
1.46
3.28
3.26
1.44
10µ
100µ
1m
IOUT [A]
10m
100m
100µ
1m
IOUT [A]
10m
100m
100
100
90
90
80
80
70
70
30
Efficiency [%]
40
Efficiency [%]
Efficiency [%]
80
Preset output voltage = 3.3V
Preset output voltage = 1.5V
Preset output voltage = 3.3V
60 Preset output voltage = 1.5V
50
40
30
20
10
10
10
100µ
1m
IOUT [A]
10m
Document Number: 002-08401 Rev *A
100m
4
6
8
10
12
VIN [V]
14
16
18
IOUT = 100mA
IOUT = 30mA
IOUT = 1mA
IOUT = 100µA
IOUT = 10µA
40
20
10µ
100m
50
30
0
2
10m
L = 22µH
60
20
0
1µ
1m
IOUT [A]
Preset output voltage = 3.3V
Preset output voltage = 5.0V
50
100µ
Efficiency in VOUT=3.3V vs VIN
IOUT = 100mA, L = 22µH
90
60
18
VIN = 7.0V, L = 22µH
4.92
10µ
Efficiency in IOUT=100mA vs VIN
VIN = 7.0V, L = 22µH
70
16
4.94
3.24
10µ
Preset output voltage = 5.0V
14
4.96
Efficiency vs IOUT
100
12
VIN [V]
Preset output voltage = 5.0V
1.52
1.48
10
Load Regulation: VOUT vs IOUT
VIN = 7.0V, L = 22µH
3.34
Preset output voltage = 1.5V
VOUT [V]
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 22µH
3.34
0
2
IOUT = 1µA
4
6
8
10 12
VIN [V]
14
16
18
Page 19 of 36
MB39C811
Line Regulation: VOUT vs VIN
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 10µH
1.54
5.00
1.50
3.34
4.98
1.48
3.32
3.30
8
10
12
VIN [V]
14
16
4.96
4.94
3.28
6
18
8
10
12
VIN [V]
14
16
4.92
6
18
VIN = 7.0V, L = 10µH
3.34
VIN = 7.0V, L = 10µH
5.02
5.00
1.50
3.30
4.98
VOUT [V]
3.32
VOUT [V]
1.52
1.48
3.28
1.44
10µ
100µ
1m
IOUT [A]
10m
3.24
10µ
100m
100µ
1m
IOUT [A]
10m
Preset output voltage = 5.0V
100
70
Efficiency [%]
30
Efficiency [%]
Efficiency [%]
40
Preset output voltage = 3.3V
60 Preset output voltage = 1.5V
50
40
20
20
10
10
10m
Document Number: 002-08401 Rev *A
100m
IOUT = 30mA
IOUT = 1mA
IOUT = 100µA
IOUT = 10µA
40
10
100µ
1m
IOUT [A]
IOUT = 100mA
50
30
10µ
L = 10µH
60
20
0
2
100m
70
30
0
1µ
10m
80
80
50
1m
IOUT [A]
90
80
Preset output voltage = 3.3V
Preset output voltage = 1.5V
100µ
Preset output voltage = 3.3V
Preset output voltage = 5.0V
90
60
18
Efficiency in VOUT=3.3V vs VIN
100
IOUT = 100mA, L = 10µH
90
70
16
VIN = 7.0V, L = 10µH
4.92
10µ
100m
Efficiency in IOUT=100mA vs VIN
VIN = 7.0V, L = 10µH
14
4.96
Efficiency vs IOUT
100
12
VIN [V]
4.94
3.26
1.46
10
Preset output voltage = 5.0V
Preset output voltage = 3.3V
Preset output voltage = 1.5V
8
Load Regulation: VOUT vs IOUT
Load Regulation: VOUT vs IOUT
Load Regulation: VOUT vs IOUT
1.54
VOUT [V]
3.36
1.46
VOUT [V]
Preset output voltage = 5.0V
1.52
1.44
6
IOUT = 100mA, L = 10µH
5.02
Preset output voltage = 3.3V
VOUT [V]
VOUT [V]
Preset output voltage = 1.5V
Line Regulation: VOUT vs VIN
IOUT = 100mA, L = 10µH
3.38
IOUT = 1µA
4
6
8
10
12
VIN [V]
14
16
18
0
2
4
6
8
10
12
VIN [V]
14
16
18
Page 20 of 36
MB39C811
IVIN in Start-up vs VIN
IVIN in Sleep mode vs Temp.
IVIN in Sleep mode vs VIN
IOUT = 0A, L = 22µH
3.0
Preset output voltage = 3.3V
IOUT = 0A, L = 22µH
Preset output voltage = 1.5V
Preset output voltage = 3.3V
2.5
2.5
2.5
VUVLOH
1.5
1.0
85oC
2.0
25oC
2.0
IVIN [µA]
IVIN [µA]
VIN=18V (Sleep mode)
85oC
2.0
0.5
IOUT = 0A, L = 22µH
3.0
IVIN [µA]
3.0
o
－40 C
1.5
1.5
1.0
1.0
0.5
0.5
VIN=4.5V (Sleep mode)
VIN=2.5V
25oC
－40oC
0.0
0
1
2
3
VIN [V]
4
5
0.0
0
6
VUVLOH vs Temp.
8
2
4
6
8
10
VIN [V]
12
14
16
0.0
-40
18
VUVLOL vs Temp.
VIN = 7.0V, L = 22µH
8
-20
0
20
40
Temp. [oC]
60
80 90
60
80 90
VSHUNT vs Temp.
VIN = 7.0V, L = 22µH
24
IVIN = 1mA, IOUT = 0A, L = 22µH
Preset output voltage = 1.5V
7 Preset output voltage = 5.0V
7
VUVLOL : VIN [V]
5 Preset output voltage = 3.3V
4
Preset output voltage = 1.5V
6
5
Preset output voltage = 3.3V
4
3 Preset output voltage = 1.5V
3
2
-40
-20
0
20
40
Temp. [oC]
60
2
-40
80 90
IPEAK vs Temp.
290
VSHUNT : VIN [V]
VUVLOH : VIN [V]
23
Preset output voltage = 5.0V
6
VIN = 7.0V, L = 22µH
2.6
-20
0
20
40
Temp. [oC]
22
21
20
60
80 90
19
-40
-20
0
20
40
Temp. [oC]
On-Resistance of PMOS/NMOS
vs Temp.
Preset output voltage = 1.5V
2.4
270
260
Preset output voltage = 3.3V
250
Preset output voltage = 5.0V
2.2
2.0
NMOS
1.8
1.6
PMOS
240
230
-40
On-Resistance [Ω]
IPEAK : ILX [mA]
280
1.4
-20
0
20
40
Temp. [oC]
60
Document Number: 002-08401 Rev *A
80 90
1.2
-40
-20
0
20
40
Temp. [oC]
60
80 85
Page 21 of 36
MB39C811
Figure 13. Typical Characteristics of Bridge Rectifier
0.5
Bridge Rectifier
Frequency Characteristics
1
In applying 1.64Vp-p to AC1_1/AC1_2
Diode in Bridge Rectifier
IF vs VF
1m
100m
Forward Current : IF [A]
-40 C
DCOUT1 [V]
25oC
0.3
85oC
0.2
0.1
100µ
85oC
10m
o
Reverse Current : IR [A]
0.4
1m
100µ
25oC
10µ
1µ
o
-40 C
100n
10n
10µ
1µ
85oC
100n
25oC
10n
1n
-40oC
1n
100p
100p
0.0
10
Diode in Bridge Rectifier
IR vs VR
100
1k
10k 100k
Freq. [Hz]
1M
10M 100M
10p
0.0
0.2
0.4
0.6
0.8
1.0
Forward Voltage: VF [V]
1.2
10p
0
10
20
30
40
50
Reverse Voltage: VR [V]
60
70
Figure 14. DC/DC Converter Sudden Load Change
Load Change Waveforms
VIN = 5.0V, L = 22µH, IOUT = 5mA and 65mA
Preset output voltage = 3.3V
VOUT
20mV/DIV
17.2mV
IOUT
50mA/DIV
200µs/DIV
Document Number: 002-08401 Rev *A
Page 22 of 36
MB39C811
Figure 15. Switching Waveforms of DC/DC Converter
Waveforms
Waveforms
VIN = 7.0V, L = 22µH, IOUT = 1mA
VIN = 7.0V, L = 22µH, IOUT = 1mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
100µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 22µH, IOUT = 30mA
VIN = 7.0V, L = 22µH, IOUT = 30mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
5µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 22µH, IOUT = 100mA
VIN = 7.0V, L = 22µH, IOUT = 100mA
VOUT setting
Preset
output =voltage
3.3V = 3.3V
Preset output voltage = 3.3V
VOUT
50mV/DIV
VOUT
50mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
5µs/DIV
Document Number: 002-08401 Rev *A
10µs/DIV
Page 23 of 36
MB39C811
Waveforms
Waveforms
VIN = 7.0V, L = 10µH, IOUT = 1mA
VIN = 7.0V, L = 10µH, IOUT = 1mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
100µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 10µH, IOUT = 30mA
VIN = 7.0V, L = 10µH, IOUT = 30mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
20mV/DIV
VOUT
20mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
2µs/DIV
5µs/DIV
Waveforms
Waveforms
VIN = 7.0V, L = 10µH, IOUT = 30mA
VIN = 7.0V, L = 10µH, IOUT = 30mA
Preset output voltage = 3.3V
Preset output voltage = 3.3V
VOUT
50mV/DIV
VOUT
50mV/DIV
VLX
5.0V/DIV
VLX
5.0V/DIV
ILX
200mA/DIV
ILX
200mA/DIV
5µs/DIV
Document Number: 002-08401 Rev *A
10µs/DIV
Page 24 of 36
MB39C811
11.
Layout for Printed Circuit Board
Note the points listed below in layout design
 Place the switching parts
[1]
on top layer, and avoid connecting each other through through-holes.
 Make the through-holes connecting the ground plane close to the GND pins of the switching parts
[1]
 Be very careful about the current loop consisting of the input capacitor CVIN, the VIN pin of IC, and the PGND pin.
Place and connect these parts as close as possible to make the current loop small.
 The output capacitor CVOUT and the inductor L are placed adjacent to each other.
 Place the bypass capacitor CVB close to VB pin, and make the through-holes connecting the ground plane close to
the GND pin of the bypass capacitor CVB.
 Draw the feedback wiring pattern from the VOUT pin to the output capacitor CVOUT pin. The wiring connected to
[1]
the VOUT pin is very sensitive to noise so that the wiring should keep away from the switching parts . Especially,
be very careful about the leaked magnetic flux from the inductor L, even the back side of the inductor L.
[1]: Switching parts: IC (MB39C811), Input capacitor (CVIN), Inductor (L), Output capacitor (CVOUT).
Refer to Figure 2.
Figure 16. Example of a Layout Design
CVOUT
feedback wiring pattern
L
CVIN
VB
VOUT
Top Layer
Document Number: 002-08401 Rev *A
CVB
through-holes
VIN
LX
PGND
Back Layer
Page 25 of 36
MB39C811
12.
Usage Precaution
Do Not Configure the IC Over the Maximum Ratings
If the IC is used over the maximum ratings, the LSI may be permanently damaged.
It is preferable for the device to be normally operated within the recommended usage conditions. Usage outside of
these conditions can have a bad effect on the reliability of the LSI.
Use the Devices within Recommended Operating Conditions
The recommended operating conditions are the recommended values that guarantee the normal operations of LSI.
The electrical ratings are guaranteed when the device is used within the recommended operating conditions and
under the conditions stated for each item.
Printed Circuit Board Ground Lines should be set up with Consideration for Common Impedance
Take Appropriate Measures against Static Electricity
 Containers for semiconductor materials should have anti-static protection or be made of conductive material.
 After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
 Work platforms, tools, and instruments should be properly grounded.
 Working personnel should be grounded with resistance of 250 kΩ to 1MΩ in series between body and ground.
Do not apply Negative Voltages
The use of negative voltages below -0.3V may cause the parasitic transistor to be activated on LSI lines, which can
cause malfunctions.
13. Ordering Information
Table 15. Ordering Information
Part number
MB39C811QN
Package
40-pin plastic QFN (LCC-40P-M63)
14. Marking
Figure 17. Marking
MB 3 9 C 8 1 1
E2
INDEX
Document Number: 002-08401 Rev *A
Lead free mark
Page 26 of 36
MB39C811
15.
Product Labels
Figure 18. Inner Box Label [Q-Pack Label (4 × 8.5 inch)]
Ordering Part Number
(P)+Part No.
Quantity
Mark lot information
Label spec
: Conformable JEDEC
Barcode form : Code 39
Document Number: 002-08401 Rev *A
Page 27 of 36
MB39C811
Figure 19. Al(Aluminum) bag label [2-in-1 label (4 × 8.5 inch)]
Ordering Part Number
(P)+Part No.
Mark lot information
Quantity
Caution
JEDEC MSL, if available.
Document Number: 002-08401 Rev *A
Page 28 of 36
MB39C811
Figure 20. Reel label [Reel label (4 × 2.5 inch)]
Ordering Part Number
(P)+Part No.
Mark lot information
Quantity
Figure 21. Reel label [Dry pack & Reel label (4 × 2.5 inch)]
Document Number: 002-08401 Rev *A
Page 29 of 36
MB39C811
Figure 22. Outer box label [Shopping label (4 × 8.5 inch)]
Quantity
Ordering Part Number : (1P)+Part No.
16. Recommended Mounting Conditions
Table 16. Recommended Mounting Conditions
Items
Method
IR(Infrared Reflow) / Convection
Times
3 times in succession
Floor life
Floor life
condition
Contents
Before unpacking
Please use within 2 years after production.
From unpacking to reflow
Within 7 days
In case over period of floor
life[1]
Baking with 125°C+/-3°C for 24hrs+2hrs/-0hrs is required. Then
please use within 7 days. (Please remember baking is up to 2 times)
Between 5°C and 30°C and also below 70%RH required.
(It is preferred lower humidity in the required temp range.)
[1]: Concerning the Tape & Reel product, please transfer product to heatproof tray and so on when you perform
baking.Also please prevent lead deforming and ESD damage during baking process.
Document Number: 002-08401 Rev *A
Page 30 of 36
MB39C811
Figure 23. Recommended Mounting Conditions
Supplier Tp ≥ Tc
User Tp ≤ Tc
Tc
Tc -5°C
Supplier tp
User tp
Te m p e r a t u r e
Tp
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
TL
Tsmax
tp
Tc -5°C
tL
Preheat Area
Tsmin
ts
25
Time 25°C to Peak
Time
Table 17. Recommended Mounting Conditions(J-STD-020D)
(Temperature on the top of the package body is measured.)
TL to TP: Ramp Up Rate
260°C Max.
3°C/s Max.
TS: Preheat & Soak
150 to 200°C, 60 to 120s
TP - tP: Peak Temperature
260°C Down, within 30s
TL – tL: Liquidous Temperature
217°C, 60 to 150s
TP to TL: Ramp Down Rate
6°C/s Max.
Time 25°C to Peak
8min Max.
Document Number: 002-08401 Rev *A
Page 31 of 36
MB39C811
17. PackageDimensions
4 0 - p in p la s t i c Q F N
L e a d p i t ch
0 .5 0 m m
Pa c k a g e w i d t h ×
p a ck a g e l e n g t h
6 .0 0 m m × 6 .0 0 m m
S e a lin g m e th o d
P la stic m o ld
M o u n tin g h e ig ht
0 .9 0 m m M A X
W e ig h t
0.10 g
( L C C -4 0 P - M 6 3 )
4 0 -p i n p l as ti c Q F N
(L C C - 4 0 P -M 6 3 )
6.00±0.10
(.236±.004)
INDEX AREA
4.50±0.10
(.177±.004)
6.00±0.10
(.236±.004)
0.25±0.05
(.010±.002)
4.50±0.10
(.177±.004)
0.45
(.017)
1PIN INDEX
R0.20(R.008)
0.50(.020)
(TYP)
0.40±0.05
(.016±.002)
0.035 +-00..003155 (.0014+-..00000164 )
(0.20(.008))
0.85±0.05
(.033±.002)
C
20 1 3 FU JITS U S E M IC O N D U C TO R L IM ITE D H M b C 4 0 -6 3S c-1-1
Document Number: 002-08401 Rev *A
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Page 32 of 36
MB39C811
18. Major Changes
Spansion Publication Number: MB39C811_DS405-00013….
Page
Section
Preliminary 0.1 [June 14, 2013]
Revision 1.0 [November 18, 2013]
6
4.Pin Assignments
7
5.Pin Descriptions
9
7.Absolute Maximum Rating
10
8.RecommendedOperatingConditions
11
9.1.DC Characteristics
18
11.Example
22
14.OrderingInformation
23
15.Marking
24
16.Product Label
25
17.RecommendedMountingConditions
Revision 2.0 [August 29, 2014]
9. Electrical Characteristics
11
Table 9-1 DC characteristics
11. Typical Application Circuits
18
Figure 11-3 Voltage doubler rectification circuit
for vibration harvester
19 to 21
12. Application Notes
22 to 26
13. Typical Characteristics
27
14. Layout for Printed Circuit Board
30 to 32
18. Product Label
Revision 3.0
7
5. Pin Descriptions
8
6. Block Diagram
11
9. Electrical Characteristics
9.1 DC characteristics
15
10. Function
10.3 Function descriptions
Document Number: 002-08401 Rev *A
Change Results
Initial release
Changed Pin8 PGND to N.C.
Changed Pin8 PGND to N.C.
Added Max in Power dissipation
Added Figure [Power dissipation]
Changed VIN pin input slew rate
Added VIN pin , Input current
AddedAC pin input current
Deleted Added VIN pin , Input current
Deleted AC pin input current
Changed values in "Input voltage range"
Deleted Input slew rate
Added "IOUT=1mA" in "Preset output voltage" and changed values
Changed "over current protection" to "peak switching current" and values
Changed "Output current" to "Maximum output current" and values
Changed values in "UVLO release voltage"
Changed values in "UVLO detection voltage"
Added new
Added "Table 14-2 EVB OrderingInformation"
Added new
Added new
Added new
Deleted Input voltage range
Added the explanation of the voltage doubler rectification circuit
Added the “12. Application Notes”
Updated the “13. Typical Characteristics”
Added the “14. Layout for Printed Circuit Board”
Changed the “18. Product Label”
Added descriptions for all N.C. pins in “Table 5-1 Pin descriptions”
“Non connection pin”→“Non connection pin (Leavethis pin open)”
Wiring correction in “Figure 6-1 Block diagram”
Deleted the wire connections between DCGND1, DCGND2 pins and each
bridge rectifier, then added the internal GNDs.
Addedconditions and notes for output power-good detection voltage in
“Table 9-1 DC characteristics”
“To preset voltage ratio”→“To preset voltage ratio VVOUT ≥ 3.3V (*2)”
Addedconditions and notes in “Table 10-3 Output power-good signal output
(OPGOOD)”
“≥ VOPGH ”→“≥ VOPGH (VVOUT ≥ 3.3V) (*1)”
Page 33 of 36
MB39C811
Page
Section
17
11. Typical Application Circuits
17
11. Typical Application Circuits
18
11. Typical Application Circuits
Change Results
Wiring correction in “Figure 11-1 Application circuit for photovoltaic energy
harvester”
Deleted the wire connections between DCGND1 pin and the bridge
rectifier, then added the internal GND.
Wiring correction in “Figure 11-2 Application circuit for vibration energy
harvester”
Deleted the wire connections between DCGND2 pin and the bridge
rectifier, then added the internal GND.
Wiring correction in “Figure 11-3 Voltage doubler rectification circuit for
vibration harvester”
Deleted the wire connections between DCGND1 pin and the bridge
rectifier, then added the internal GND.
Added the “Table 12-1 Manufactures of recommended inductors”
19, 20
12. Application Notes
Added the “Table 12-2 Manufactures of photovoltaic harvesters”
Added the “Table 12-3 Manufactures of vibration harvesters”
Added the “Table 12-4 Manufactures of capacitors”
23 to 28
13. Typical Characteristics
Inserted the data of 22μH and 10μH together into “Figure 13-1 Typical
characteristics of DC/DC conveter”.
Inserted the data of 22μH and 10μH together into “Figure 13-4 Switching
waveforms of DC/DC converter”.
Replaced the line regulation datas of 22μH in “Figure 13-1 Typical
characteristics of DC/DC conveter”
23, 24
13. Typical Characteristics
31
16. Ordering Information
Replaced the load regulation datas of 22μH in “Figure 13-1”
Added the line and load regulation data of 10μH in “Figure 13-1”.
Deleted “Table 16-2 EVB Ordering information”
NOTE: Please see “Document History” about later revised information.
Document Number: 002-08401 Rev *A
Page 34 of 36
MB39C811
Document History
Document Title: MB39C811 Ultra Low Power Buck PMIC Solar/Vibrations Energy Harvesting
Document Number: 002-08401
Revision
ECN
Orig. of
Change
Submission
Date
**

TAOA
12/05/2014
*A
5124887
TAOA
02/22/2016 Updated to Cypress template
Document Number: 002-08401 Rev *A
Description of Change
Migrated to Cypress and assigned document number 002-08401.
No change to document contents or format.
Page 35 of 36
MB39C811
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© Cypress Semiconductor Corporation 2014-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress").
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Document Number: 002-08401 Rev *A
Page 36 of 36