Capabilities Brochure

V is h ay I n tertec h n o l o g y, I n c .
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Using Thin Film Technology
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PATTERN SUBSTRATES
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Resistors - Vishay Electro-Films
Application-Specific
Pattern Substrates
Vishay Electro-Films: Substrates and Pattern Substrates
Vishay Electro-Films is a leading-edge manufacturer of thin film passive components and
custom substrates. Vishay Electro-Films offers a wide variety of substrate choices – alumina,
aluminum nitride, beryllium oxide, quartz, silicon, ferrites, titanates, and many metallization
alternatives such as nichrome, tantalum nitride, titanium tungsten, copper, nickel, gold, and
aluminum to meet application-specific demands.
With its ability to integrate fine line patterns and multilayer structures into its manufacturing
processes, Vishay Electro-Films is able to produce simple to complex designs in a timely
manner. Vishay Electro-Films has one of the industry’s broadest line of thin film products, as
well as a rapid prototyping service.
Design
If your design is complete and you would like to send us your files, or if you would like us to
help you finalize your application design, please contact:
Resources
• For technical questions contact [email protected]
• Sales Contacts: http://www.vishay.com/doc?99914
One of the World’s Largest Manufacturers of
Discrete Semiconductors and Passive Components
Capabilities
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This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V is h ay I n tertec h n o l o g y, I n c .
AND TEC
I
INNOVAT
O L OGY
Using Thin Film Technology
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PATTERN SUBSTRATES
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62-2012
About Vishay Electro-Films
Electro-Films, founded in 1974, became the industry leader in custom thin film substrate production for the hybrid circuit
and microwave industries. Vishay Intertechnology, a leading global manufacturer of electronic components, acquired
Electro-Films in 2000. Since that time, Vishay has invested over $50 million to refurbish the physical plant and purchase
state-of-the-art processing equipment. The 57,000-square-foot facility contains 11,400 square feet of clean rooms,
including class 100 and class 1000 clean rooms. Vishay Electro-Films is an ISO 9001:2000-certified facility serving
commercial, medical, microwave, telecommunications, and defense industry manufacturers worldwide.
Resistors - Vishay Electro-Films
Features
• Rapid prototyping / full in-house capabilities
• Large-volume production
• Multiple substrate material options
• Complete thin film services
Substrate Characteristics
Material
Uses
Benefits
Standard Thickness*
MILS (mm)
Alumina (Al2O3)
Standard hybrid
Medium-power microwave
Most cost-effective choice
10, 15, 25
(0.25, 0.38, 0.63)
Silicon (Si)
DC circuit–medium/high power
Best choice for high-density
fine-line interconnects
15
(0.38)
Quartz (SiO2)
Microwave/millimeter-wave low
power/low shunt capacitance
Good for high-density patterns
Low loss tangent/low CTE
10, 20, 25
(0.25, 0.5, 0.63)
Aluminum Nitride (AlN)
High-power microwave
Deal CTE match to silicon devices
High thermal conductivity
20, 25, 50
(0.5, 0.63, 1.3)
Beryllium Oxide (BeO)
High-power DC/RF microwave
Highest thermal conductivity
15, 25
(0.38, 0.63)
Sapphire
Millimeter-wave/optical circuits
with special electrical or
mechanical requirements
Low loss tangent
Optical surface finish
Special
Titanates
RF/microwave with high Q
Dielectric properties
Special
Ferrites
Circulators/isolators
Magnetic sensitivity
Special
* Additional thicknesses available upon request.
Capabilities
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This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V is h ay I n tertec h n o l o g y, I n c .
AND TEC
I
INNOVAT
O L OGY
Using Thin Film Technology
N
HN
PATTERN SUBSTRATES
O
19
62-2012
Metallization Capabilities
Resistors - Vishay Electro-Films
Sputtered Materials
Material
Uses
Notes
Tantalum Nitride (Ta2N)
Resistor
10-250 ohms/square
Nichrome (NiCr)
Resistor
10-250 ohms/square
Chromium Oxide (Cermet)
Resistor
Up to 500 ohms/square
Chromium Silicon (CrSi)
Resistor
Up to 500 ohms/square
Titanium Tungsten (TiW)
Barrier/adhesion
500-1000 Angstrom typical thickness
Gold (Au)
Adhesion
4-12 micro-inches typical thickness
Palladium (Pd)
Adhesion
Solderable
Nickel (Ni)
Adhesion
Solderable
Gold/Tin (Au/Sn) (80/20)
Contact metallization
Eutectic die attach
Aluminum (Al)
Contact metallization
12,000 Angstrom typical thickness
Copper (Cu)
Contact metallization
500-1000 Angstrom typical thickness
Plated Materials
Material
Uses
Notes
Gold (Au)
Contact metallization
100 micro-inches typical thickness
Nickel (Ni)
Solderable
20-60 micro-inches typical thickness
Copper (Cu)
Thermal management
Thickness up to 0.005 inches
Dimensional Capabilities
Conductor line width
0.001 inches
Conductor line thickness
50 to 300 micro-inches standard, up to 5 mils custom
Line width tolerance
0.0001 inches at 150 micro-inches thickness
Through-hole minimum diameter
0.005 inches, dependent on substrate thickness
Metallized hole diameter to substrate thickness ratio
0.8 minimum
Through-hole tolerance: diameter and position
+/-0.002 inches
Front-to-back alignment
+/-0.002 inches
Process Capabilities
Custom CO2 laser shaping
Au or Cu filled vias (0.007 to 0.020 inches diameter)
Lange couples with polyimide or air bridges
Multilayer metal crossovers
Wraparound edge metallization
Two-sided metallization
Solder balls
High aspect ratio structures
Capabilities
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VMN-PL0011-1204
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V is h ay I n tertec h n o l o g y, I n c .
I
INNOVAT
AND TEC
O L OGY
19
62-2012
Resistors - Vishay Electro-Films
Using Thin Film Technology
N
HN
PATTERN SUBSTRATES
O
Capabilities
4/4
VMN-PL0011-1204
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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