V ishay I n t e rt e ch n o l o g y, I n c . I INNOVAT AND TEC O L OGY IFSC Series N HN Inductors O 19 62-2012 Inductors - Ultra-Low Profiles Down to 1.0 mm Low-Profile, High-Current Inductors Key Benefits • • • • • Ultra-low profiles down to 1.0 mm High maximum frequency to 5.0 MHz Inductance up to 47 µH Shielded construction Handles high transient current spikes without saturation End Products • • • • • Cellular phones LCD displays Hard disk drives (HDDs) Digital camcorders (DVCs ), Digital cameras (DSCs) PDA’s, etc. Resources • • • • • • Datasheet: IFSC-0806AZ-01 - www.vishay.com/doc?34291 Datasheet: IFSC-1008AB-01 - www.vishay.com/doc?34294 Datasheet: IFSC-1111AZ-01 - www.vishay.com/doc?34293 Datasheet: IFSC-1111AB-01 - www.vishay.com/doc?34292 Datasheet: IFSC-1515AH-01 - www.vishay.com/doc?34295 For technical questions contact [email protected] One of the World’s Largest Manufacturers of Discrete Semiconductors and Passive Components PRODUCT SHEET 1/2 VMN-PT0304-1201 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V ishay I n t e rt e ch n o l o g y, I n c . AND TEC I INNOVAT O L OGY IFSC Series N HN Inductors O 19 62-2012 Low-Profile, High-Current Inductors Inductors - Ultra-Low Profiles Down to 1.0 mm STANDARD ELECTRICAL SPECIFICATIONS L0 INDUCTANCE ± 20 % AT 100 kHz, 0.25 V, 0 A (μH) DCR DCR HEAT SATURATION TYP. MAX. RATING CURRENT 25 °C 25 °C CURRENT DC DC TYP. (MΩ)” IFSC-0806AZ-01 (MΩ) TYP. (A) (3) (A) (4) Vishay Dale IFSC-0806AZ-01 1.0 96 Low Profile, High1.5 Current Inductors 143 115 1.60 172 1.40 2.2 196 236 1.30 3.3FEATURES 247 297 1.05 • Shielded construction 4.7• Frequency range331 0.90 up to 5.0 MHz 398 high transient current spikes without 6.8• Handles 623 748 0.60 saturation 10.0• Compliant to RoHS 1108 1330 0.45 directive 2002/95/EC 22.0 2367 2840 0.30 APPLICATIONS STANDARD ELECTRICAL SPECIFICATIONS IFSC-1008AB-01 applications IFSC-1008AB-01 0.47• PDA/notebook/desktop/server 25 29 3.70 HEAT L INDUCTANCE DCR DCR RATING SATURATION Vishay Dale • High current POL converters ± 20 % AT 100 kHz, TYP. MAX. CURRENT CURRENT 1.0 37 43 2.60 0.25 V, 0 A 25 °C 25 °C DC TYP. DC TYP. • Low profile, high current power supplies Low Profile, High Current Inductors 63 (μH) (mΩ) (mΩ) (A) (A) 1.5• DC/DC 72systems 2.20 converters in distributed power 1.0 96 115 1.60 1.88 2.2• DC/DC converter for 80field programmable 90 gate array (FPGA) 1.85 FEATURES 1.5 143 172 1.40 1.63 140 155 1.45 • 3.3 Shielded construction 2.2 196 236 1.30 1.40 DIMENSIONS in inches [millimeters] • Frequency range up to 5.0 MHz 4.7 190 212 1.20 0.079 ± 0.008 3.3 247 297 1.05 1.00 • Handles high transient current spikes without [2.0 ± 0.2] saturation 4.7 331 398 0.90 0.85 6.0 260 288 1.10 • Compliant to RoHS directive 2002/95/EC 6.8 623 748 0.60 0.80 0.063 ± 0.008 6.8 325 370 1.00 [1.6 ± 0.2] APPLICATIONS STANDARD ELECTRICAL 10.0 1108 1330 SPECIFICATIONS 0.45 0.62 •10.0 PDA/notebook/desktop/server applications 360 410 0.75 L HEAT 22.0 2367 2840 RATING 0.30 SATURATION 0.43 INDUCTANCE DCR DCR • High current POL converters ± 20 % AT 100 kHz, TYP. MAX. CURRENT CURRENT 22.0 910 1050 0.50 25 °C 25 °C DC TYP. DC TYP. Notes 0.25 V, 0 A 0.024 ± 0.008 0.024 ± 0.008 • Low profile, high current power supplies [0.6 ± 0.2] [0.6 ± 0.2] (μH) is referenced (mΩ) to (mΩ) (A) (A) All test data 25 °C ambient 0.039 [1.0] • 1.0 Battery powered devices IFSC-1111AZ-01 55 68 2.00 Max. IFSC-1111AZ-01 Operating to + 125 °C3.90 0.47temperature 25 range 29- 55 °C 3.70 • DC/DC converters in distributed power systems DC current (A) that will cause an approximate ΔT of 40 °C 1.0 (A) that will 37cause 43L to drop 2.60 approximately 2.70 Vishay Dale 1.5 65 75 1.45 Typical Pad Layout DC current 30 % • DC/DC converter for field programmable gate array (FPGA) The part1.5 temperature63(ambient + temp. rise) should not exceed 0.102 [2.6] 72 2.20 2.30 125 °C under worst case operating conditions. Circuit design, 2.2 90 105 1.30 Profile, Current Inductors component trace 1.85 size and thickness, airflow DIMENSIONS in inches [millimeters] 2.2 placement, 80 PWB 90Low 2.15 High and other cooling provisions all affect the part temperature. Part 3.3 150 1.20 3.3 should be 140verified 155 in the 1.45 1.70 temperature end application. 0.039 130 [1.0] 4.7 190 212 1.20 1.50 FEATURES 4.7 170 200 1.00 6.0 260 288 1.10 1.35 • Shielded construction 230 0.90 [0.8] •6.8 Frequency range up to 0.031 5.0200 MHz 6.8 325 370 1.00 1.15 • Handles high transient current spikes without 10.0 360 410 0.75 0.85 10.0 300 340 0.80 saturation 22.0 910 1050 0.50 0.56 • Compliant to RoHS directive 2002/95/EC DESCRIPTION 15.0 500 570 0.65 Notes STANDARD ELECTRICAL SPECIFICATIONS ± 20 % All test data is referenced to 25 °CμH ambient IFSC-0806AZ-01 4.7 e3 APPLICATIONS ER 650 22.0 750 0.50 Operating + 125 °C L temperature range - 55 °C toHEAT MODEL INDUCTANCE VALUEΔT of INDUCTANCE TOLERANCE PACKAGE CODE applications JEDEC LEAD (Pb)-FREE STANDARD • PDA/notebook/desktop/server DC current (A) that will cause DCR an approximate 40 °C INDUCTANCE DCR SATURATION RATING IFSC-1111AB-01 (A) kHz, that willTYP. causeMAX. L to drop approximately 30 % ±DC 20 current % AT 100 CURRENT CURRENT 33.0 1000 1250 0.40 • High current POL converters The0.25 part V, temperature (ambient temp. should not 0A 25 °C 25+°C DC exceed TYP. DCrise) TYP. 125 °C(μH) under worst case Circuit Dale • Low profile, high current power supplies (mΩ) conditions. (mΩ) operating (A)design, (A) component placement, PWB trace size and thickness, airflow 47.0 1800 Vishay2050 0.35 GLOBAL PARTprovisions NUMBER and other cooling all affect the part temperature. Part • Battery powered devices 1.0 should be55 temperature verified68 in the end2.00 application. 1.50 • DC/DC converters in distributed power systems Low Profile, High Current Inductors 82 65C 75 0 1.45 I F1.5 IFSC-1111AB-01 S 8 0 1.35 6 A 2.2Z E R 4 R 7 98M 0 11.90 • DC/DC converter for field programmable gate array (FPGA) 2.2 90 105 1.30 1.10 3.3 PACKAGE 100 PRODUCT FAMILY SIZE INDUCTANCE 120 TOL. SERIES 1.70 3.3 130 150 1.20 0.90 FEATURES CODE VALUE DIMENSIONS in inches [millimeters] DESCRIPTION 4.7 130 156 1.40 4.7 170 200 1.00 0.75 • Shielded construction IFSC-1008AB-01 4.7 μH ± 20 % ER e3 • Frequency range up to 5.0 MHz 6.8 200 230 0.90 0.65 6.8 190 228 1.20 MODEL INDUCTANCE VALUE INDUCTANCE TOLERANCE PACKAGE CODE JEDEC LEAD (Pb)-FREE STANDARD • Handles high transient current spikes without 10.0 300 340 0.80 0.52 saturation Document Number: 34291 For technical [email protected] 15.0 500 570 0.65 0.40questions, contact: 10.0 280 336 www.vishay.com 1.00 • Compliant to RoHS directive 2002/95/EC Revision: 04-Oct-10 1 GLOBAL PART NUMBER 22.0 650 750 0.50 0.35 22.0 630 756 0.67 APPLICATIONS I F S C 1 00.40 0 8 A B E R 4 R 7 M 0 1 33.0 1000 1250 0.30 STANDARD ELECTRICAL SPECIFICATIONS • PDA/notebook/desktop/server applications 0.35 0.56 17 TOL. SERIES 22 5.40 L47.0IFSC-1515AH-01 PRODUCT FAMILY1800 2050 HEAT SIZE0.235 PACKAGE INDUCTANCE • High current POL converters INDUCTANCE DCR DCR RATING SATURATION CODE VALUE ± Notes 20 % AT 100 kHz, TYP. MAX. CURRENT CURRENT • Low high current power supplies 1.0profile,IFSC-1515AH-01 20 25 3.80 All test to°C 25 °CDC ambient 0.25 V, 0data A is referenced 25 °C 25 DC TYP. TYP. Operating • Battery powered devices (mΩ)- 55 °C (μH) temperature (mΩ) range (A)to + 125 °C (A) DC current (A) that will cause an approximate ΔT of 40 °C 1.2 30 3.60 Vishay 25 Dale Document Number: 34294 For technical questions, contact: [email protected] www.vishay.com • DC/DC converters in distributed power systems DC current (A) that82 will cause 98 L to drop 1.9 approximately 1.7 30 % Revision:2.2 23-Jul-10 1 The part temperature (ambient + temp. rise) should not exceed DC/DC converter for field programmable gate array (FPGA) 1253.3 °C under worst operating conditions. High Circuit 2.2 35 45 3.00 100case 120 1.5 design, Low 1.7 Profile, Current•Inductors component placement, PWB trace size and thickness, airflow and4.7 other cooling 130 provisions the part temperature. Part 156all affect1.4 1.2 temperature should be verified in the end application. 3.3 45 56 2.70 FEATURESDIMENSIONS in inches [millimeters] 6.8 190 228 1.2 1.0 4.7 70 90 2.20 10.0 280 336 1.0 0.8 22.0 630 756 0.67 0.55 6.8 90 115 1.90 DESCRIPTION Notes IFSC-1111AZ-01 4.7 μH ± 20 % ER All test data is referenced to 25 °C ambient 8.2PACKAGE 105 e3 132 1.40 Operating temperature INDUCTANCE range - 55 °C to + 125 °CINDUCTANCEAPPLICATIONS MODEL VALUE TOLERANCE CODE JEDEC LEAD (Pb)-FREE STANDARD STANDARD ELECTRICAL SPECIFICATIONS DC current (A) that will cause an approximate ΔT of 40 °C 10.0 135 170 1.30 DC current (A) that will cause L to drop approximately 30 % The part temperature (ambient + temp. rise) should not exceed 125 °C under PART worst case operating conditions. Circuit design, GLOBAL NUMBER 15.0 185 222 1.25 component placement, PWB trace size and thickness, airflow andI other cooling provisions F S C all affect 1 the part 1 temperature. 1 1 Part A Z E R 4 R temperature should be verified in the end application. 22.0 2507 M 03151 1.20 PRODUCT FAMILY SIZE PACKAGE INDUCTANCE TOL. SERIES DIMENSIONS in inches CODE[millimeters] VALUE 33.0 405 486 0.90 47.0 495 594 0.80 0 (3) (4) 0 (3) (1) (4) (2) (3) (4) 0 (5) 0.098 ± 0.008 [2.5 ± 0.2] 0.079 ± 0.008 [2.0 ± 0.2] 0.016 ± 0.008 0.016 ± 0.008 [0.4 ± 0.2] [0.4 ± 0.2] 0.047 [1.2] Max. (1) (2) Typical Pad Layout 0.102 [2.6] 0 (3) (4) (5) 0 (3) (4) 0.083 [2.1] 0.031 [0.8] 0.114 ± 0.008 [2.9 ± 0.2] 0.114 ± 0.008 [2.9 ± 0.2] 0.030 ± 0.008 0.030 ± 0.008 [0.75 ± 0.2] [0.75 ± 0.2] 0.039 ± 0.004 [1.0 ± 0.1] 0 Typical Pad Layout 0.118 [3.0] (1) (2) (3) (3) (4) (5) (4) 0 0.106 to 0.114 [2.7 to 2.9] 0.047 to 0.055 [1.2 to 1.4] • Shielded construction 0.114 ± 0.008 • Frequency range up to 5.0 MHz[2.9 ± 0.2] • Handles high transient current spikes without saturation 0.114 ± 0.008 • Compliant to RoHS 2002/95/EC [2.9 ±Directive 0.2] (1) (2) (3) • PDA/notebook/desktop/server applications (4) (5) L0 INDUCTANCE DCR ± 20 % AT 100 kHz, TYP. 0.25 V, 0 A 25 °C (μH) (mΩ) 0.56 17 22 5.40 5.50 1.0 20 25 3.80 3.80 1.2 25 30 3.60 3.60 2.2 35 45 3.00 3.00 3.3 45 56 2.70 4.7 70 90 2.20 6.8 90 115 1.90 132 1.40 170 1.30 Document Number: 34293 8.2 105 Revision: 04-Oct-10 Notes 10.0 135 • High current POL converters HEAT 0 DCR RATING SATURATION MAX. CURRENT CURRENT 25 °C DC TYP. DC TYP. (mΩ) (A) (4) (A) (3) 0.030 ± 0.008 0.030 ± 0.008 [0.75 ± 0.2] [0.75 ± 0.2] • Low profile, high current power supplies 0.047 ± 0.004 [1.2 ± 0.1] • Battery powered devices • DC/DC converters in distributed power systems Typical Pad Layout • DC/DC converter for field programmable gate array (FPGA) 0.118 [3.0] 2.40 0.150 ± 0.008 0.106 [3.8 ± 0.2] to 0.114 [2.7 to 2.9] 2.00 1.50 For technical questions,0.150 contact: ± 0.008 [email protected] 1.40 www.vishay.com 1 [3.8 ± 0.2] 1.30 0.047 to 0.055 [1.2 to 1.4] (1) All15.0test data 185 is222 1.25 1.00 25 °C ambient referenced to 22.0 250 315 1.20 0.83 0.039 ± 0.008 0.039 ± 0.008 (2) Operating [1.0 ± 0.2] [1.0 ± 0.2] 0.071+ ± 0.004 temperature range 125 °C 33.0 405 486 0.90 0.68 - 55 °C to [1.8 ± 0.1] DESCRIPTION 47.0 495 594 0.80 0.56 (3) DC current (A) that will cause an approximate ∆ TTypical of Pad 40Layout °C Notes IFSC-1111AB-01 4.7 μH ± 20 % ER[3.8] e3 0.150 (4)AllDC test data is referenced(A) to 25that °C ambient current will cause L0 to drop approximately 30 % Operating temperature range - 55 °C to + 125 °C INDUCTANCE MODEL INDUCTANCE VALUE TOLERANCE PACKAGE CODE JEDEC LEAD (Pb)-FREE STANDARD 1.88 1.63 1.40 1.00 0.85 0.80 0.62 0.43 3.90 2.70 2.30 2.15 1.70 1.50 1.35 1.15 0.85 0.56 1.50 1.35 1.10 0.90 0.75 0.65 0.52 0.40 0.35 0.30 0.235 1.70 1.50 1.20 1.00 0.80 0.55 5.50 3.80 3.60 3.00 2.40 2.00 1.50 1.40 1.30 1.00 0.83 0.68 0.56 Dimensions in inches (millimeters) Typical Pad Layout 0.102 [2.6] 0.079 ± 0.008 [2.0 ± 0.2] 0.063 ± 0.008 [1.6 ± 0.2] 0.039 [1.0] 0.024 ± 0.008 0.024 ± 0.008 [0.6 ± 0.2] [0.6 ± 0.2] 0.039 [1.0] Max. 0.031 [0.8] Typical Pad Layout 0.102 [2.6] 0.098 ± 0.008 [2.5 ± 0.2] 0.079 ± 0.008 [2.0 ± 0.2] 0.083 [2.1] 0.016 ± 0.008 0.016 ± 0.008 [0.4 ± 0.2] [0.4 ± 0.2] 0.047 [1.2] Max. 0.031 [0.8] Typical Pad Layout 0.118 [3.0] 0.114 ± 0.008 [2.9 ± 0.2] 0.114 ± 0.008 [2.9 ± 0.2] 0.106 to 0.114 [2.7 to 2.9] 0.047 to 0.055 [1.2 to 1.4] 0.030 ± 0.008 0.030 ± 0.008 [0.75 ± 0.2] [0.75 ± 0.2] 0.039 ± 0.004 [1.0 ± 0.1] Typical Pad Layout 0.118 [3.0] 0.114 ± 0.008 [2.9 ± 0.2] 0.114 ± 0.008 [2.9 ± 0.2] 0.106 to 0.114 [2.7 to 2.9] 0.047 to 0.055 [1.2 to 1.4] 0.030 ± 0.008 0.030 ± 0.008 [0.75 ± 0.2] [0.75 ± 0.2] 0.047 ± 0.004 [1.2 ± 0.1] Typical Pad Layout 0.150 [3.8] 0.150 ± 0.008 [3.8 ± 0.2] 0.150 ± 0.008 [3.8 ± 0.2] 0.071 ± 0.004 [1.8 ± 0.1] 0.150 [3.8] 0.039 ± 0.008 0.039 ± 0.008 [1.0 ± 0.2] [1.0 ± 0.2] 0.071 [1.8] (5) The part temperature (ambient + temp. rise) should not exceed 125 °C under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. (1) (2) (3) (4) (5) DC current (A) that will cause an approximate ΔT of 40 °C DC current (A) that will cause L0 to drop approximately 30 % The part temperature (ambient + temp. rise) should not exceed 125 °C under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow 0.150 [3.8] PRODUCT SHEET GLOBAL NUMBER and PART other cooling provisions all affect the part temperature. Part F S C 1 1 1 1 2/2 0.071 [1.8] temperature should be verified in the end application. I A B E R 4 R 7 M 0 VMN-PT0304-1201 1 DESCRIPTION PRODUCT FAMILY IFSC-1515AH-01 SIZE ± 20 % 3.3 μH ER PACKAGE INDUCTANCE e3 TOL. SERIES CODE VALUE This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 GLOBAL PART NUMBER Document Number: 34292 For technical questions, contact: [email protected] www.vishay.com MODEL Revision: 04-Oct-10 I F INDUCTANCE VALUE S C 1 5 INDUCTANCE TOLERANCE 1 5 A H PACKAGE CODE E R 3 JEDEC LEAD (Pb)-FREE STANDARD R 3 M 0 1 1