Package Information www.vishay.com Vishay Siliconix MICRO FOOT®: 6-Bump (1.5 mm x 1 mm, 0.5 mm Pitch, 0.250 mm Bump Height) S S S G e XXXX D s XXX D D s 6x Ø b1 s Mark on Backside of Die e e s E 6x Ø 0.24 to 0.26 (Note 3) Solder mask ~ Ø 0.25 C NOTE 5 b A2 B A1 A e A e K e Bump (Note 2) Recommended Land Pattern Notes (unless otherwise specified) 1. Six (6) solder bumps are 95.5/3.8/0.7 Sn/Ag/Cu. 2. Backside surface is coated with a Ti/Ni/Ag layer. 3. Non-solder mask defined copper landing pad. 4. Laser marks on the silicon die back. 5. “b1” is the diameter of the solderable substrate surface, defined by an opening in the solder resist layer solder mask defined. 6. • is the location of pin 1 DIM. MILLIMETERS INCHES MIN. NOM. MAX. MIN. NOM. MAX. A 0.510 0.575 0.590 0.0201 0.0226 0.0232 A1 0.220 0.250 0.280 0.0087 0.0098 0.0110 A2 0.290 0.300 0.310 0.0114 0.0118 0.0122 b 0.297 0.330 0.363 0.0116 0.0129 0.0143 b1 0.250 0.0098 e 0.500 0.0197 s 0.210 0.230 0.250 0.0082 0.0090 0.0098 D 0.920 0.960 1.000 0.0362 0.0378 0.0394 E 1.420 1.460 1.500 0.0559 0.0575 0.0591 K 0.028 0.065 0.102 0.0011 0.0025 0.0040 Note • Use millimeters as the primary measurement. ECN: T15-0140-Rev. A, 20-Apr-15 DWG: 6035 Revison: 20-Apr-15 Document Number: 69426 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000