IDT 8735AK-21LF

ICS8735-21
700MHz, DIFFERENTIAL-TO-3.3V LVPECL
ZERO DELAY CLOCK GENERATOR
Features
•
One differential 3.3V LVPECL output pair
One differential feedback output pair
•
•
Differential CLK/nCLK input pair
•
•
•
•
Output frequency range: 31.25MHz to 700MHz
•
Programmable dividers allow for the following output-to-input
frequency ratios: 8:1, 4:1, 2:1, 1:1, 1:2, 1:4, 1:8
•
•
•
•
•
Cycle-to-cycle jitter: 25ps (maximum)
CLK/nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL
Input frequency range: 31.25MHz to 700MHz
VCO range: 250MHz to 700MHz
External feedback for “zero delay” clock regeneration
with configurable frequencies
Static phase offset: 50ps ± 100ps
Full 3.3V supply voltage
0°C to 70°C ambient operating temperature
Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
Pin Assignments
CLK
nCLK
MR
VCC
nFB_IN
FB_IN
SEL2
VEE
nQFB
QFB
Block Diagram
nc
PLL
FB_IN Pulldown
nFB_IN Pullup
8:1, 4:1, 2:1, 1:1,
1:2, 1:4, 1:8
nc
QFB
nQFB
nc
1
nc
SEL1
SEL0
VCC
PLL_SEL
VCCA
SEL3
VCCO
Q
nQ
ICS8735-21
20-Lead SOIC
7.5mm x 12.8mm x 2.3mm package body
M Package
Top View
VEE
CLK Pulldown
nCLK Pullup
0
20
19
18
17
16
15
14
13
12
11
SEL3
÷1, ÷2, ÷4, ÷8,
÷16, ÷32, ÷64
Q
nQ
1
2
3
4
5
6
7
8
9
10
VCCA
PLL_SEL Pullup
VCC
The ICS8735-21 is a highly versatile 1:1 DifferentialICS
to-3.3V LVPECL clock generator and a member of
HiPerClockS™
the HiPerClockS™family of High Performance Clock
Solutions from IDT. The CLK, nCLK pair can accept
most standard differential input levels. The
ICS8735-21 has a fully integrated PLL and can be configured as
zero delay buffer, multiplier or divider, and has an output frequency
range of 31.25MHz to 700MHz. The reference divider, feedback
divider and output divider are each programmable, thereby
allowing for the following output-to-input frequency ratios: 8:1, 4:1,
2:1, 1:1, 1:2, 1:4, 1:8. The external feedback allows the device to
achieve “zero delay” between the input clock and the output
clocks. The PLL_SEL pin can be used to bypass the PLL for
system test and debug purposes. In bypass mode, the reference
clock is routed around the PLL and into the internal output
dividers.
PLL_SEL
General Description
32 31 30 29 28 27 26 25
SEL0
SEL1
nc
nc
SEL0 Pulldown
CLK
SEL1 Pulldown
nCLK
1
24
ICS8735-21
23
32-Lead VFQFN
3
22
5mm x 5mm x 0.925mm
4
21
package body
5
20
K Package
6
19
Top View
2
VCCO
nc
Q
nQ
QFB
nQFB
7
18
nc
MR
8
17
VCCO
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
1
nc
nc
VEE
SEL2
FB_IN
10 11 12 13 14 15 16
nFB_IN
MR Pulldown
9
nc
nc
SEL3 Pulldown
VCC
SEL2 Pulldown
ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Table 1. Pin Descriptions
Name
CLK
Type
Input
Pulldown
Description
Non-inverting differential clock input.
nCLK
Input
Pullup
Inverting differential clock input.
nFB_IN
Input
Pullup
Inverting differential feedback input to phase detector for regenerating clocks with “zero delay.”
FB_IN
Input
Pulldown
Non-inverted differential feedback input to phase detector for regenerating clocks with
“zero delay.”
MR
Input
Pulldown
Active HIGH Master Reset. When logic HIGH, the internal dividers are reset causing the true
output Q to go low and the inverted output nQ to go high. When logic LOW, the internal
dividers and the outputs are enabled. LVCMOS / LVTTL interface levels.
SEL0, SEL1,
SEL2, SEL3
Input
Pulldown
Determines output divider values in Table 3. LVCMOS / LVTTL interface levels.
PLL_SEL
Input
Pullup
PLL select. Selects between the PLL and reference clock as the input to the dividers.
When LOW, selects reference clock. When HIGH, selects PLL.
LVCMOS/LVTTL interface levels.
nQ, Q
Output
Differential output pair. LVPECL interface levels.
nQFB, QFB
Output
Differential feedback output pair. LVPECL interface levels.
VEE
Power
Negative supply pin.
VCC
Power
Core supply pins.
VCCA
Power
Analog supply pin.
VCCO
Power
Output supply pin.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Symbol
Parameter
Test Conditions
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
kΩ
RPULLDOWN
Input Pulldown Resistor
51
kΩ
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
2
Minimum
Typical
Maximum
Units
ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Function Tables
Table 3A. Control Input Function Table
Inputs
Outputs
PLL_SEL = 1
PLL Enable Mode
SEL3
SEL2
SEL1
SEL0
Reference Frequency Range (MHz)*
Q/nQ, QFB/nQFB
0
0
0
0
250 - 700
÷1
0
0
0
1
125 - 350
÷1
0
0
1
0
62.5 - 175
÷1
0
0
1
1
31.25 - 87.5
÷1
0
1
0
0
250 - 700
÷2
0
1
0
1
125 - 350
÷2
0
1
1
0
62.5 - 175
÷2
0
1
1
1
250 - 700
÷4
1
0
0
0
125 - 350
÷4
1
0
0
1
250 - 700
÷8
1
0
1
0
125 - 350
x2
1
0
1
1
62.5 - 175
x2
1
1
0
0
31.25 - 87.5
x2
1
1
0
1
62.5 - 175
x4
1
1
1
0
31.25 - 87.5
x4
1
1
1
1
31.25 - 87.5
x8
*NOTE: VCO frequency range for all configurations above is 250MHz to 700MHz.
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
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ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Table 3B. PLL Bypass Function Table
Inputs
Outputs
PLL_SEL = 0
PLL Bypass Mode
SEL3
SEL2
SEL1
SEL0
Q/nQ, QFB/nQFB
0z
0
0
0
÷4
0
0
0
1
÷4
0
0
1
0
÷4
0
0
1
1
÷8
0
1
0
0
÷8
0
1
0
1
÷8
0
1
1
0
÷16
0
1
1
1
÷16
1
0
0
0
÷32
1
0
0
1
÷64
1
0
1
0
÷2
1
0
1
1
÷2
1
1
0
0
÷4
1
1
0
1
÷1
1
1
1
0
÷2
1
1
1
1
÷1
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
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ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
Item
Rating
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5V
Outputs, IO
Continuos Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
20 Lead SOIC
32 Lead VFQFN
46.2°C/W (0 lfpm)
37.0°C/W (0 mps)
Storage Temperature, TSTG
-65°C to 150°C
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VCC = VCCA = VCCO = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
VCC
Test Conditions
Minimum
Typical
Maximum
Units
Core Supply Voltage
3.135
3.3
3.465
V
VCCA
Analog Supply Voltage
3.135
3.3
3.465
V
VCCO
Output Supply Voltage
3.135
3.3
3.465
V
IEE
Power Supply Current
150
mA
ICCA
Analog Supply Current
15
mA
Table 4B. LVCMOS/LVTTL DC Characteristics, VCC = VCCA = VCCO = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input High Current
IIL
Input Low Current
Test Conditions
Minimum
Typical
Maximum
Units
2
VCC + 0.3
V
-0.3
0.8
V
SEL[0:3], MR
VCC = VIN = 3.465V
150
µA
PLL_SEL
VCC = VIN = 3.465V
5
µA
SEL[0:3], MR
VCC = 3.465V, VIN = 0V
-5
µA
PLL_SEL
VCC = 3.465V, VIN = 0V
-150
µA
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
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ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Table 4C. Differential DC Characteristics, VCC = VCCA = VCCO = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
IIH
Input High Current
IIL
Test Conditions
Minimum
Typical
Maximum
Units
CLK, FB_IN
VCC = VIN = 3.465V
150
µA
nCLK, nFB_IN
VCC = VIN = 3.465V
5
µA
CLK, FB_IN
VCC = 3.465V,
VIN = 0V
-5
µA
nCLK, nFB_IN
VCC = 3.465V,
VIN = 0V
-150
µA
Input Low Current
VPP
Peak-to-Peak Voltage; NOTE 1
VCMR
Common Mode Input Voltage; NOTE 1, 2
0.15
1.3
V
VEE + 0.5
VCC – 0.85
V
NOTE 1: VIL should not be less than -0.3V.
NOTE 2: Common mode input voltage is defined as VIH.
Table 4D. LVPECL DC Characteristics, VCC = VCCA = VCCO = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
Test Conditions
VOH
Output High Voltage; NOTE 1
VOL
Output Low Voltage; NOTE 1
VSWING
Peak-to-Peak Output Voltage Swing
Minimum
Typical
Maximum
Units
VCCO – 1.4
VCCO – 0.9
V
VCCO – 2.0
VCCO – 1.7
V
0.6
1.0
V
NOTE 1: Outputs terminated with 50Ω to VCCO – 2V.
Table 5. Input Frequency Characteristics, VCC = VCCA = VCCO = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
fIN
Input Frequency
Test Conditions
Minimum
PLL_SEL = 1
31.25
Typical
Maximum
Units
700
MHz
700
MHz
CLK, nCLK
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
PLL_SEL = 0
6
ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
AC Electrical Characteristics
Table 6. AC Characteristics, VCC = VCCA = VCCO = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Parameter Symbol
fMAX
Output Frequency
tPD
Propagation Delay; NOTE 1
tsk(o)
Output Skew; NOTE 2, 3
tsk(Ø)
Static Phase Offset; NOTE 3, 4
tjit(cc)
Test Conditions
PLL_SEL = 0V, f ≤ 700MHz
Minimum
Typical
3.0
PLL_SEL = 0V
Maximum
Units
700
MHz
4.2
ns
20
ps
150
ps
Cycle-to-Cycle Jitter; NOTE 3, 5
25
ps
tjit(θ)
Phase Jitter; NOTE 3, 5, 6
±50
ps
tL
PLL Lock Time
tR / tF
Output Rise/Fall Time; NOTE 7
odc
Output Duty Cycle
PLL_SEL = 3.3V
20% to 80% @ 50MHz
-50
50
1
ms
300
700
ps
47
53
%
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the output differential
cross points.
NOTE 3: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 4: Defined as the time difference between the input reference clock and the averaged feedback input signal across all conditions,
when the PLL is locked and the input reference frequency is stable.
NOTE 5: Characterized at VCO frequency of 622MHz.
NOTE 6: Phase jitter is dependent on the input source used.
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
7
ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Parameter Measurement Information
2V
VCC
VCC,
VCCA,
VCCO
Qx
SCOPE
nCLK
V
V
Cross Points
PP
CMR
CLK
LVPECL
nQx
VEE
VEE
1.3V± 0.165V
Differential Input Level
3.3V Output Load AC Test Circuit
nCLK
VOH
nQx
CLK
VOL
Qx
nFB_IN
VOH
FB_IN
VOL
Qy
➤
➤ t(Ø)
nQy
tsk(o)
Output Skew
Phase Jitter and Static Phase Offset
nQ, nQFB
80%
80%
VSW I N G
Q, QFB
➤
tcycle n
➤
tcycle n+1
Clock
Outputs
➤
➤
tjit(cc) = |tcycle n – tcycle n+1|
1000 Cycles
Cycle-to-Cycle Jitter
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
20%
20%
tR
tF
Output Rise/Fall Time
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ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Parameter Measurement Information, continued
nQ, nQFB
nCLK
Q, QFB
t PW
CLK
t
PERIOD
nQ, nQFB
odc =
t PW
x 100%
Q, QFB
t PERIOD
tPD
Output Duty Cycle/Pulse Width/Period
Propagation Delay
Application Information
Recommendations for Unused Input and Output Pins
Inputs:
Outputs:
LVCMOS Control Pins
LVPECL Outputs
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
All unused LVPECL outputs can be left floating. We recommend
that there is no trace attached. Both sides of the differential output
pair should either be left floating or terminated.
CLK/nCLK Inputs
For applications not requiring the use of the differential input, both
CLK and nCLK can be left floating. Though not required, but for
additional protection, a 1kΩ resistor can be tied from CLK to
ground.
FB_IN/nFB_IN Inputs
For applications not requiring the use of the differential input, both
FB_IN and nFB_IN can be left floating. Though not required, but for
additional protection, a 1kΩ resistor can be tied from FB_IN to
ground.
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
9
ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Power Supply Filtering Technique
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The ICS8735-21 provides
separate power supplies to isolate any high switching noise from
the outputs to the internal PLL. VCC, VCCA and VCCO should be
individually connected to the power supply plane through vias, and
0.01µF bypass capacitors should be used for each pin. Figure 1
illustrates this for a generic VCC pin and also shows that VCCA
requires that an additional 10Ω resistor along with a 10µF bypass
capacitor be connected to the VCCA pin. The 10Ω resistor can also
be replaced by a ferrite bead.
3.3V
VCC
.01µF
10Ω
.01µF
10µF
VCCA
Figure 1. Power Supply Filtering
Wiring the Differential Input to Accept Single Ended Levels
Figure 2 shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF = VCC/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio of
R1 and R2 might need to be adjusted to position the V_REF in the
center of the input voltage swing. For example, if the input clock
swing is only 2.5V and VCC = 3.3V, V_REF should be 1.25V and
R2/R1 = 0.609.
VCC
R1
1K
Single Ended Clock Input
CLK
V_REF
nCLK
C1
0.1u
R2
1K
Figure 2. Single-Ended Signal Driving Differential Input
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
10
ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Differential Clock Input Interface
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL
and other differential signals. Both VSWING and VOH must meet the
VPP and VCMR input requirements. Figures 3A to 3F show interface
examples for the HiPerClockS CLK/nCLK input driven by the most
common driver types. The input interfaces suggested here are
examples only. Please consult with the vendor of the driver
component to confirm the driver termination requirements. For
example, in Figure 3A, the input termination applies for IDT
HiPerClockS open emitter LVHSTL drivers. If you are using an
LVHSTL driver from another vendor, use their termination
recommendation.
3.3V
3.3V
3.3V
1.8V
Zo = 50Ω
Zo = 50Ω
CLK
CLK
Zo = 50Ω
nCLK
Zo = 50Ω
nCLK
HiPerClockS
Input
LVHSTL
R1
50
IDT
HiPerClockS
LVHSTL Driver
HiPerClockS
Input
LVPECL
R2
50
R1
50
R2
50
R2
50
Figure 3A. HiPerClockS CLK/nCLK Input
Driven by an IDT Open Emitter
HiPerClockS LVHSTL Driver
Figure 3B. HiPerClockS CLK/nCLK Input
Driven by a 3.3V LVPECL Driver
3.3V
3.3V
3.3V
R3
125
3.3V
R4
125
3.3V
Zo = 50Ω
Zo = 50Ω
CLK
CLK
R1
100
Zo = 50Ω
nCLK
HiPerClockS
Input
LVPECL
R1
84
R2
84
Figure 3C. HiPerClockS CLK/nCLK Input
Driven by a 3.3V LVPECL Driver
2.5V
nCLK
Zo = 50Ω
Receiver
LVDS
Figure 3D. HiPerClockS CLK/nCLK Input
Driven by a 3.3V LVDS Driver
2.5V
3.3V
3.3V
2.5V
*R3
33
R3
120
Zo = 50Ω
R4
120
Zo = 60Ω
CLK
CLK
Zo = 50Ω
Zo = 60Ω
nCLK
nCLK
HCSL
*R4
33
R1
50
R2
50
HiPerClockS
Input
HiPerClockS
SSTL
R1
120
R2
120
*Optional – R3 and R4 can be 0Ω
Figure 3F. HiPerClockS CLK/nCLK Input
Driven by a 2.5V SSTL Driver
Figure 3E. HiPerClockS CLK/nCLK Input
Driven by a 3.3V HCSL Driver
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
11
ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Termination for 3.3V LVPECL Outputs
The clock layout topology shown below is a typical termination for
LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
transmission lines. Matched impedance techniques should be
used to maximize operating frequency and minimize signal
distortion. Figures 4A and 4B show two different layouts which are
recommended only as guidelines. Other suitable clock layouts may
exist and it would be recommended that the board designers
simulate to guarantee compatibility across all printed circuit and
clock component process variations.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must be
used for functionality. These outputs are designed to drive 50Ω
3.3V
Zo = 50Ω
125Ω
FOUT
125Ω
FIN
Zo = 50Ω
Zo = 50Ω
50Ω
RTT =
1
Z
((VOH + VOL) / (VCC – 2)) – 2 o
FOUT
50Ω
VCC - 2V
Zo = 50Ω
RTT
84Ω
Figure 4A. 3.3V LVPECL Output Termination
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
FIN
84Ω
Figure 4B. 3.3V LVPECL Output Termination
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ICS8735AM-21 REV. A JULY 31, 2008
ICS8735-21
700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
Schematic Example
Figure 5 shows a schematic example of the ICS8735-21. In this
example, the input is driven by an HCSL driver. The zero delay
buffer is configured to operate at 155.52MHz input and 77.75MHz
output. The logic control pins are configured as follows:
SEL [3:0] = 0101; PLL_SEL = 1
The decoupling capacitors should be physically located near the
power pin. For ICS8735-21.
3.3V
R7
Zo = 50 Ohm
U1
(155.5 MHz)
1
2
3
4
5
6
7
8
9
10
VCC
Zo = 50 Ohm
SEL2
HCSL
R8
50
R9
50
VCC
VCCA
CLK
nCLK
MR
VCCI
nFB_IN
FB_IN
SEL2
VEE
nQFB
QFB
nc
SEL1
SEL0
VCCI
PLL_SEL
VCCA
SEL3
VCCO
Q
nQ
20
19
18
17
16
15
14
13
12
11
C11
0.01u
SEL1
SEL0
VCC
PLL_SEL
VCCA
SEL3
VCC
10
C16
10u
Zo = 50 Ohm
+
Zo = 50 Ohm
VCC
RU3
1K
R1
50
RU4
1K
RU5
SP
RU6
1K
RD4
SP
RD5
1K
RD6
SP
ICS8735-21
-
(77.75 MHz)
RU7
SP
PLL_SEL
SEL0
SEL1
SEL2
SEL3
RD3
SP
R2
50
RD7
1K
SP = Space (i.e. not intstalled)
LVPECL_input
R4
50
R3
50
Bypass capacitors located
near the power pins
(U1-4) VCC
VCC=3.3V
C1
0.1uF
SEL[3:0] = 0101,
Divide by 2
(U1-17)
C2
0.1uF
R5
50
R6
50
(U1-13)
C3
0.1uF
Figure 5. ICS8735-21 LVPECL Buffer Schematic Example
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VFQFN EPAD Thermal Release Path
In order to maximize both the removal of heat from the package
and the electrical performance, a land pattern must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in Figure 6. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended to
determine the minimum number needed. Maximum thermal and
electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as many
vias connected to ground as possible. It is also recommended that
the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz
copper via barrel plating. This is desirable to avoid any solder
wicking inside the via during the soldering process which may
result in voids in solder between the exposed pad/slug and the
thermal land. Precautions should be taken to eliminate any solder
voids between the exposed heat slug and the land pattern. Note:
These recommendations are to be used as a guideline only. For
further information, please refer to the Application Note on the
Surface Mount Assembly of Amkor’s Thermally/Electrically
Enhance Leadfame Base Package, Amkor Technology.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias. The
vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are
PIN
PIN PAD
SOLDER
EXPOSED HEAT SLUG
GROUND PLANE
THERMAL VIA
SOLDER
LAND PATTERN
(GROUND PAD)
PIN
PIN PAD
Figure 6. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale
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Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8735-21.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8735-21 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
Power (core)MAX = VCC_MAX * ICC_MAX = 3.465V * 150mA = 519.8mW
•
Power (outputs)MAX = 30mW/Loaded output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power_MAX = (3.465V, with all outputs switching) = 519.8mW + 60mW = 579.8mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 83.2°C/W per Table 7A below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.580W * 83.2°C/W = 118.3°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 7A. Thermal Resistance θJA for 20 Lead SOIC, Forced Convection
θJA vs. Air Flow
Linear Feet per Minute
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
83.2°C/W
65.7°C/W
57.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
46.2°C/W
39.7°C/W
36.8°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
Table 7B. Thermal Resistance θJA for 32 Lead VFQFN, Forced Convection
θJA by Velocity
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
IDT™ / ICS™ 3.3V LVPECL ZERO DELAY CLOCK GENERATOR
0
1
2.5
37.0°C/W
32.4°C/W
29.0°C/W
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700MHZ, DIFFERENTIAL-TO-3.3V LVPECL ZERO DELAY CLOCK GENERATOR
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 7.
VCCO
Q1
VOUT
RL
50Ω
VCCO - 2V
Figure 7. LVPECL Driver Circuit and Termination
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination voltage
of VCCO – 2V.
•
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.9V
(VCCO_MAX – VOH_MAX) = 0.9V
•
For logic low, VOUT = VOL_MAX = VCCO_MAX – 1.7V
(VCCO_MAX – VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOH_MAX) = [(2V – (VCCO_MAX – VOH_MAX))/RL] * (VCCO_MAX – VOH_MAX) =
[(2V – 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(VOL_MAX – (VCCO_MAX – 2V))/RL] * (VCCO_MAX – VOL_MAX) = [(2V – (VCCO_MAX – VOL_MAX))/RL] * (VCCO_MAX – VOL_MAX) =
[(2V – 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
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Reliability Information
Table 8A. θJA vs. Air Flow Table for a 20 Lead TSSOP
θJA vs. Air Flow
Linear Feet per Minute
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
83.2°C/W
65.7°C/W
57.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
46.2°C/W
39.7°C/W
36.8°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
Table 8B. θJA vs. Air Flow Table for a 32 Lead VFQFN, Forced Convection
θJA by Velocity
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
37.0°C/W
32.4°C/W
29.0°C/W
Transistor Count
The transistor count for ICS8735-21 is: 2969
Package Outline and Package Dimensions
Package Outline - M Suffix for 20 Lead SOIC
Table 9A. Package Dimensions for 20 Lead SOIC
300 Millimeters
All Dimensions in Millimeters
Symbol
Minimum
Maximum
N
20
A
2.65
A1
0.10
A2
2.05
2.55
B
0.33
0.51
C
0.18
0.32
D
12.60
13.00
E
7.40
7.60
e
1.27 Basic
H
10.00
10.65
h
0.25
0.75
L
0.40
1.27
α
0°
7°
Reference Document: JEDEC Publication 95, MS-013, MS-119
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Package Outline - K Suffix for 32 Lead VFQFN
(Ref.)
S eating Plan e
N &N
Even
(N -1)x e
(R ef.)
A1
Ind ex Area
A3
N
L
N
e (Ty p.)
2 If N & N
1
Anvil
Singula tion
are Even
2
OR
E2
(N -1)x e
(Re f.)
E2
2
To p View
b
A
(Ref.)
D
Chamfer 4x
0.6 x 0.6 max
OPTIONAL
e
D2
2
N &N
Odd
0. 08
C
Th er mal
Ba se
D2
C
The following package mechanical drawing is a generic drawing that applies to any pin count VFQFN package. This drawing is not
intended to convey the actual pin count or pin layout of this device. The pin count and pinout are shown on the front page. The package
dimensions are in Table 9B below.
Table 9B. Package Dimensions for 32 Lead VFQFN
JEDEC Variation: VHHD-2/-4
All Dimensions in Millimeters
Symbol
Minimum
Nominal
Maximum
N
32
A
0.80
1.00
A1
0
0.05
A3
0.25 Ref.
b
0.18
0.25
0.30
8
ND & NE
D&E
5.00 Basic
D2 & E2
3.0
3.3
e
0.50 Basic
L
0.30
0.40
0.50
Reference Document: JEDEC Publication 95, MO-220
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Ordering Information
Table 10. Ordering Information
Part/Order Number
8735AM-21
8735AM-21T
8735AM-21LF
8735AM-21LFT
8735AK-21LF
8735AK-21LFT
Marking
ICS8735AM-21
ICS8735AM-21
ICS8735AM-21LF
ICS8735AM-21LF
ICS8735A21L
ICS8735A21L
Package
20 Lead SOIC
20 Lead SOIC
“Lead-Free” 20 Lead SOIC
“Lead-Free” 20 Lead SOIC
“Lead-Free” 32 Lead VFQFN
“Lead-Free” 32 Lead VFQFN
Shipping Packaging
Tube
1000 Tape & Reel
Tube
1000 Tape & Reel
Tray
2500 Tape & Reel
Temperature
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for
the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements
are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any
IDT product for use in life support devices or critical medical instruments.
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Contact Information:
www.IDT.com
www.IDT.com
Sales
Technical Support
800-345-7015 (inside USA)
+408-284-8200 (outside USA)
Fax: 408-284-2775
www.IDT.com/go/contactIDT
[email protected]
+480-763-2056
Corporate Headquarters
Integrated Device Technology, Inc.
6024 Silver Creek Valley Road
San Jose, CA 95138
United States
800-345-7015 (inside USA)
+408-284-8200 (outside USA)
© 2008 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their respective owners.
Printed in USA