FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev K) Exposed Pad Variation BC 4.60 3.58 (.141) 4.90 – 5.10* (.193 – .201) 16 1514 13 12 11 SEE NOTE 5 6.60 ±0.10 4.50 ±0.10 0.48 (.019) REF 3.58 (.141) 2.94 (.116) 10 9 DETAIL B 6.40 2.94 (.252) (.116) BSC SEE NOTE 4 0.45 ±0.05 1.05 ±0.10 0.65 BSC 1 2 3 4 5 6 7 8 RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50* (.169 – .177) 0.09 – 0.20 (.0035 – .0079) 0.25 REF 0.50 – 0.75 (.020 – .030) NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS MILLIMETERS 2. DIMENSIONS ARE IN (INCHES) 3. DRAWING NOT TO SCALE 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT 1.10 (.0433) MAX 0° – 8° 0.65 (.0256) BSC 0.195 – 0.30 (.0077 – .0118) TYP 0.05 – 0.15 (.002 – .006) FE16 (BC) TSSOP REV K 1013 5. BOTTOM EXPOSED PADDLE MAY HAVE METAL PROTRUSION IN THIS AREA. THIS REGION MUST BE FREE OF ANY EXPOSED TRACES OR VIAS ON PCB LAYOUT *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 0.51 (.020) REF DETAIL B IS THE PART OF THE LEAD FRAME FEATURE FOR REFERENCE ONLY NO MEASUREMENT PURPOSE