V I S H AY I N T E R T E C H N O L O G Y, I N C . I INNOVAT AND TEC O L OGY LPS1100 N HN Power Thick Film Resistor O 19 62-2012 Resistors - High Power up to 1100 W High-Power Thick Film Resistor Heatsink Mounting KEY BENEFITS • • • • • • • High power up to 1100 W at 25 °C on heatsink Small size and low profile, 57 mm x 60 mm Non inductive: < 0.1 µH High dielectric strength up to 12 kVRMS Low weight: 79 g High temperature up to 200 °C Compliant to RoHS Directive 2011/65/EU APPLICATIONS • • • • Industrial (windmills) Transportation (trains) Medical (x-ray tables) HEV/EV (battery management) RESOURCES • Datasheet: LPS1100 - http://www.vishay.com/doc?50059 • Application Note - http://www.vishay.com/doc?52025 • For technical questions contact [email protected] One of the World’s Largest Manufacturers of Discrete Semiconductors and Passive Components PRODUCT SHEET 1/2 VMN-PT0311-1202 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Thick Film Technology FEATURES V I S H AY I N T E R T E C H N O L O G Y, I N C . • LPS high power: 1100 W AND TEC I INNOVAT LPS1100 • Easy mounting N O L OGY • Non inductive O HN Power Thick Film Resistor • Wide resistance range: 1 to 1.3 k E24 series 19 • Low thermal radiation of the case 62-2012 • Compliant to RoHS Directive 2002/95/EC High-Power Thick Film Resistor Heatsink Mounting DIMENSIONS in millimeters Resistors - High Power up to 1100 W 25.8 ± 1 LPS 1100 I5U 5 % V2 60 25.2 21.2 15.2 36 64.7 2 x M4 useful depth: 8 2 x Ø 4.2 Ø 20 13.6 34 57 Notes • Tolerances unless stated: ± 0.2 mm • Power dissipation is 1100 W by using a water cooled heatsink at Twater = 15 °C of Rth = 0.059 °C/W (25 °C to the nearest point of the resistor onto heatsink) and Rth contact estimated at 0.07 °C/W. MECHANICAL SPECIFICATIONS Mechanical Protection Insulated case and resin for potting UL 94 V-0 ELECTRICAL SPECIFICATIONS Resistive Element Thick film Tolerances End Connections Screws M4 Power Rating and Thermal Resistance Tightening Torque Connections 2 Nm Tightening Torque Heatsink 2 Nm Maximum Torque 2.5 Nm Weight 79 g ± 10 % ± 1 % to ± 10 % 1100 W at + 25 °C On heatsink Rth(j-c): 0.039 °C/W Temperature Coefficient (- 55 °C to + 200 °C), IEC 60115-1 ENVIRONMENTAL SPECIFICATIONS Dielectric Strength IEC 60115-1, 1 min, 10 mA max. Temperature Range - 55 °C to + 200 °C Insulation Climatic Category 55/200/56 Inductance www.vishay.com 1 to 1.3 k Resistance Range ± 150 ppm/°C 7 kVRMS or 12 kVRMS LPS 1100 104 M Vishay Sfernice 0.1 μH PERFORMANCE TESTS 13-Feb-12 Revision: CONDITIONS REQUIREMENTS Document Number: 50059 1 IEC 60115-1: 2 x Pr/10 s for heatsink with For technical questions, contact: [email protected] Rth(h-a) 0.26 °C/W (maximum power: 700 W) (0.25THIS % + 0.05 ) Momentary Overload IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN± AND THIS DOCUMENT DOCUMENT °C/W 1.6 x Pr/1 s for heatsink with 0.26 °C/W th(h-a) ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET>R FORTH AT0.059 www.vishay.com/doc?91000 (maximum power: 1800 W) Rapid Temperature Change Revision 13-Feb-12 Load Life AEC-Q200 conditions: IEC 60115-1/IEC 60068-2-14, Test Na 50 cycles (- 55 °C to + 200 °C) ± (0.5 % + 0.05 ) for all the ohmic values 1000 cycles (- 55 °C to + 200 °C) ± (5 % + 0.05 ) for R < 38 U ± (0.5 % + 0.05 ) for R 38 U AEC-Q200 conditions: IEC 60115-1 1000 h (90/30) Pr ± (5 % + 0.05 ) for R < 38 U ± (0.5 % + 0.05 ) for R 38 U AEC-Q200 conditions: IEC 60115-1, 1000 h RH 85 %/85 °C ± (0.5 % + 0.05 ) Mechanical Shock AEC-Q200 conditions: MIL-STD-202 method 213 condition D (100 g’s/6 ms 3.75 m/s) ± (1 % + 0.05 ) Vibration AEC-Q200 conditions: MIL-STD-202 method 204 condition D (5 g, 20 min 10/2000 Hz) ± (1 % + 0.05 ) AEC-Q200 conditions: IEC 60115-1 (55/200/56) ± (1 % + 0.05 ) Humidity (Steady State) Climatic Sequence RECOMMENDATIONS FOR MOUNTING ONTO A HEATSINK PRODUCT SHEET 2/2 • Surfaces in contact must be carefully cleaned. VMN-PT0311-1202 • The heatsink must have an acceptable flatness: From 0.05 mm to 0.1 mm/100 mm. • Roughness of the TO heatsink must be around 6.3 μm. InPRODUCTS order to improve thermal conductivity, surfaces in contact (ceramic, TO THIS DOCUMENT IS SUBJECT CHANGE WITHOUT NOTICE. THE DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT heatsink) should coated with a silicone grease (type SI 340 from Blue Star Silicones). Thermal film (type Q-pad II from SPECIFIC DISCLAIMERS, SET be FORTH AT www.vishay.com/doc?91000 Berquist) is also possible, easier and faster to install than grease but with a lower efficiency for the power dissipation.