INTERSIL HFA1114IB

HFA1114
®
DUCT
E PRO PRODUCT
T
E
L
O
OBS
I TU TE
SUBST 112
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IB
H F A1
POSS
850MHz Video Cable Driving Buffer
September 2004
Features
Description
• Access to Summing Node Allows Circuit Customization
The HFA1114 is a closed loop Buffer featuring user
programmable gain and ultra high speed performance.
Manufactured on Intersil’ proprietary complementary bipolar
UHF-1 process, the HFA1114 offers a wide -3dB bandwidth
of 850MHz, very fast slew rate, excellent gain flatness, low
distortion and high output current.
• User Programmable For Closed-Loop Gains of +1, -1
or +2 Without Use of External Resistors
• Wide -3dB Bandwidth . . . . . . . . . . . . . . . . . . . . 850MHz
• Very Fast Slew Rate . . . . . . . . . . . . . . . . . . . . 2400V/µs
• Fast Settling Time (0.1%) . . . . . . . . . . . . . . . . . . . 11ns
• High Output Current . . . . . . . . . . . . . . . . . . . . . . . 60mA
• Excellent Gain Accuracy . . . . . . . . . . . . . . . . . . 0.99V/V
• Overdrive Recovery . . . . . . . . . . . . . . . . . . . . . . . <10ns
• Standard Operational Amplifier Pinout
Applications
• RF/IF Processors
A unique feature of the pinout allows the user to select a
voltage gain of +1, -1, or +2, without the use of any external
components. Gain selection is accomplished via connections
to the inputs, as described in the “Application Information”
section. The result is a more flexible product, fewer part types
in inventory, and more efficient use of board space.
Compatibility with existing op amp pinouts provides flexibility
to upgrade low gain amplifiers, while decreasing component
count. Unlike most buffers, the standard pinout provides an
upgrade path should a higher closed loop gain be needed at
a future date.
For applications requiring a standard buffer pinout, please
refer to the HFA1110 datasheet.
• Driving Flash A/D Converters
• High Speed Communications
Part # Information
• Impedance Transformation
• Line Driving
PART NUMBER
(BRAND)
• Video Switching and Routing
TEMP. RANGE
(oC)
HFA1114IB
(H1114I)
• Radar Systems
• Medical Imaging Systems
HFA11XXEVAL
Pinout
-40 to 85
PKG.
NO.
PACKAGE
8 Ld SOIC
M8.15
DIP Evaluation Board for High Speed
Op Amps
Pin Descriptions
HFA1114 (SOIC)
TOP VIEW
NC
1
NAME
PIN
NUMBER
NC
1, 8
No Connection
DESCRIPTION
300
8
NC
-IN
2
Inverting Input
-
7
V+
+IN
3
Non-Inverting Input
300
-IN
2
+
+IN
3
6
OUT
V-
4
Negative Supply
V-
4
5
SN
SN
5
Summing Node
OUT
6
Output
V+
7
Positive Supply
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Copyright © Intersil Americas Inc. 2002., 2004All Rights Reserved
1
FN3151.5
HFA1114
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSUPPLY
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
170
Maximum Junction Temperature (Die) . . . . . . . . . . . . . . . . . . . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications VSUPPLY = ±5V, AV = +1, RL = 100Ω, Unless Otherwise Specified
TEST
CONDITIONS
TEMP.
(oC)
MIN
TYP
MAX
UNITS
25
-
8
25
mV
Full
-
-
35
mV
Output Offset Voltage Drift
Full
-
10
-
µV/oC
PSRR
25
39
45
-
dB
Full
35
-
-
dB
PARAMETER
INPUT CHARACTERISTICS
Output Offset Voltage
Input Noise Voltage
100kHz
25
-
9
-
nV/√Hz
Non-Inverting Input Noise Current
100kHz
25
-
37
-
pA/√Hz
25
-
25
40
µA
Full
-
-
65
µA
Non-Inverting Input Resistance
25
25
50
-
kΩ
Inverting Input Resistance
25
240
300
360
Ω
25
-
2
-
pF
Full
±2.5
±2.8
-
V
25
0.980
0.990
1.02
V/V
Full
0.975
-
1.025
V/V
25
1.96
1.98
2.04
V/V
Full
1.95
-
2.05
V/V
AV = +2, ±2V Full Scale
25
-
0.02
-
%
AV = -1
25
±3.0
±3.3
-
V
Full
±2.5
±3.0
-
V
25, 85
50
60
-
mA
-40oC
35
50
-
mA
25
-
0.3
-
Ω
Non-Inverting Input Bias Current
Input Capacitance
Either Input
Input Common Mode Range
TRANSFER CHARACTERISTICS
Gain
AV = +1, VIN = +2V
AV = +2, VIN = +1V
DC Non-Linearity
OUTPUT CHARACTERISTICS
Output Voltage
Output Current
Closed Loop Output Impedance
AV = -1, RL = 50Ω
AV = +2, DC
2
HFA1114
Electrical Specifications VSUPPLY = ±5V, AV = +1, RL = 100Ω, Unless Otherwise Specified (Continued)
TEST
CONDITIONS
TEMP.
(oC)
MIN
TYP
MAX
UNITS
Supply Voltage Range
Full
±4.5
-
±5.5
V
Supply Current
25
-
21
26
mA
Full
-
-
33
mA
AV = -1
25
-
800
-
MHz
AV = +1
25
-
850
-
MHz
AV = +2
25
-
550
-
MHz
AV = -1
25
-
2400
-
V/µs
AV = +1
25
-
1500
-
V/µs
AV = +2
25
-
1900
-
V/µs
Full Power BW
5VP-P, AV = +2
25
-
220
-
MHz
Gain Flatness
To 30MHz, AV = +2
25
-
±0.015
-
dB
Gain Flatness
To 100MHz, AV = +2
25
-
±0.07
-
dB
2nd Harmonic Distortion
50MHz, VOUT = 2VP-P
25
-
-53
-
dBc
3rd Harmonic Distortion
50MHz, VOUT = 2VP-P
25
-
-68
-
dBc
3rd Order Intercept
100MHz, AV = +2
25
-
28
-
dBm
1dB Compression
100MHz, AV = +2
25
-
19
-
dBm
Rise Time (VOUT = 0.5V Step)
AV = +2
25
-
700
-
ps
AV = +1
25
-
480
-
ps
Overshoot
VOUT = 0.5V Step, AV = +2
25
-
6
-
%
0.1% Settling Time
VOUT = 2V to 0V
25
-
11
-
ns
0.05% Settling Time
VOUT = 2V to 0V
25
-
15
-
ns
25
-
8.5
-
ns
AV = +1, 3.58MHz, RL = 150Ω
25
-
0.03
-
%
AV = +2, 3.58MHz, RL = 150Ω
25
-
0.02
-
%
AV = +1, 3.58MHz, RL = 150Ω
25
-
0.05
-
Degrees
AV = +2, 3.58MHz, RL = 150Ω
25
-
0.04
-
Degrees
PARAMETER
POWER SUPPLY CHARACTERISTICS
AC CHARACTERISTICS
-3dB Bandwidth (VOUT = 0.2VP-P)
Slew Rate (VOUT = 5VP-P)
Overdrive Recovery Time
Differential Gain
Differential Phase
3
HFA1114
Application Information
Figure 1 details starting points for the selection of this resistor. The points on the curve indicate the RS and CL combinations for the optimum bandwidth, stability, and settling time,
but experimental fine tuning is recommended. Picking a
point above or to the right of the curve yields an overdamped
response, while points below or left of the curve indicate
areas of underdamped performance.
Closed Loop Gain Selection
The HFA1114 features a novel design which allows the user
to select from three closed loop gains, without any external
components. The result is a more flexible product, fewer part
types in inventory, and more efficient use of board space.
This “buffer” operates in closed loop gains of -1, +1, or +2, and
gain selection is accomplished via connections to the ±inputs.
Applying the input signal to +IN and floating -IN selects a gain
of +1, while grounding -IN selects a gain of +2. A gain of -1 is
obtained by applying the input signal to -IN with +IN grounded.
RS and CL form a low pass network at the output, thus
limiting system bandwidth well below the amplifier bandwidth of 850MHz. By decreasing RS as CLincreases (as
illustrated in the curves), the maximum bandwidth is
obtained without sacrificing stability. Even so, bandwidth
does decrease as you move to the right along the curve.
For example, at AV = +1, RS = 50Ω , CL = 30pF, the overall bandwidth is limited to 300MHz, and bandwidth drops
to 100MHz at AV = +1, RS = 5Ω , CL = 340pF.
The table below summarizes these connections:
CONNECTIONS
GAIN
(ACL)
+INPUT (PIN 3)
-INPUT (PIN 2)
-1
GND
Input
+1
Input
NC (Floating)
+2
Input
GND
RS (Ω)
PC Board Layout
The frequency response of this amplifier depends greatly on
the amount of care taken in designing the PC board. The
use of low inductance components such as chip resistors and chip capacitors is strongly recommended,
while a solid ground plane is a must!
50
45
40
35
30
25
20
15
10
5
0
AV = +1
AV = +2
0
40
80
120 160 200 240 280 320
LOAD CAPACITANCE (pF)
360 400
FIGURE 1. RECOMMENDED SERIES OUTPUT RESISTOR vs
LOAD CAPACITANCE
Attention should be given to decoupling the power supplies.
A large value (10µF) tantalum in parallel with a small value
(0.1µF) chip capacitor works well in most cases.
Evaluation Board
Terminated microstrip signal lines are recommended at the input
and output of the device. Capacitance directly on the output must
be minimized, or isolated as discussed in the next section.
The performance of the HFA1114 may be evaluated using
the HFA11XX Evaluation Board, slightly modified as follows:
2. Remove the 500Ω feedback resistor (R2), and leave the
connection open.
For unity gain applications, care must also be taken to minimize
the capacitance to ground seen by the amplifier’s inverting
input. At higher frequencies this capacitance will tend to short
the -INPUT to GND, resulting in a closed loop gain which
increases with frequency. This will cause excessive high
frequency peaking and potentially other problems as well.
3. a. For AV = +1 evaluation, remove the 500Ω gain setting
resistor (R1), and leave pin 2 floating.
b. For AV = +2, replace the 500Ω gain setting resistor with
a 0Ω resistor to GND.
An example of a good high frequency layout is the Evaluation
Board shown in Figure 2.
4. Isolate Pin 5 from the stray board capacitance to minimize
peaking and overshoot.
The layout and modified schematic of the board are shown in
Figure 2.
Driving Capacitive Loads
Capacitive loads, such as an A/D input, or an improperly
terminated transmission line will degrade the amplifier’s phase
margin resulting in frequency response peaking and possible oscillations. In most cases, the oscillation can be avoided by placing a
resistor (RS) in series with the output prior to the capacitance.
∞ (AV = +1)
or 0Ω (AV = +2)
10µF
Note: The SOIC version may be evaluated in the DIP board by
using a SOIC-to-DIP adapter such as Aries Electronics Part
Number 08-350000-10.
TOP LAYOUT
VH
VH
R1
1
8
50Ω
2
7
IN
To order evaluation boards (part number HFA11XXEVAL),
please contact your local sales office.
0.1µF
10µF
1
+5V
50Ω
3
6
4
5
-5V
GND
0.1µF
+IN
OUT
X
GND
OUT V+
VL VGND
VL
FIGURE 2. EVALUATION BOARD SCHEMATIC AND LAYOUT
4
BOTTOM LAYOUT
HFA1114
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
63 mils x 44 mils x 19 mils
1600µm x 1130µm x 483µm
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
TRANSISTOR COUNT:
METALLIZATION:
52
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
SUBSTRATE POTENTIAL (Powered Up):
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1114
NC
+IN
V-
-IN
NC
NC
SN
V+
OUT
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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