14-Pin SOIC/DIP/TSSOP Evaluation Board User's Guide

14-Pin SOIC/DIP/TSSOP
Evaluation Board
User’s Guide
© 2006 Microchip Technology Inc.
DS51597A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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RELATED TO THE INFORMATION, INCLUDING BUT NOT
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and Zena are trademarks of Microchip Technology
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS51597A-page ii
© 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP
EVALUATION BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 1
Chapter 1. Product Overview ........................................................................................ 5
1.1 Introduction ..................................................................................................... 5
1.2 What is the 14-Pin SOIC/DIP/TSSOP Evaluation Board? .............................. 5
1.3 What the 14-Pin SOIC/DIP/TSSOP Evaluation Board Kit Includes ................ 5
Chapter 2. Installation and Operation .......................................................................... 7
2.1 Introduction ..................................................................................................... 7
2.2 Features ......................................................................................................... 7
2.3 Getting Started ............................................................................................... 8
2.4 14-Pin SOIC/DIP/TSSOP Evaluation Board Description .............................. 13
Appendix A. Schematic and Layouts ......................................................................... 17
A.1 Introduction .................................................................................................. 17
A.2 Schematics and PCB Layout ....................................................................... 17
Appendix B. Bill Of Materials (BOM) .......................................................................... 27
Appendix C. Microchip Analog and Interface Device Compatibility ....................... 29
C.1 Introduction .................................................................................................. 29
Worldwide Sales and Service .................................................................................... 32
© 2006 Microchip Technology Inc.
DS51597A-page iii
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
NOTES:
DS51597A-page iv
© 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP
EVALUATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
14-Pin SOIC/DIP/TSSOP Evaluation Board. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the 14-Pin SOIC/DIP/TSSOP Evaluation Board.
The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the 14-Pin
SOIC/DIP/TSSOP Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get
started with this evaluation board.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the 14-Pin SOIC/DIP/TSSOP Evaluation Board.
• Appendix B. “Bill Of Materials (BOM)” – Lists the parts that can be installed
onto the 14-Pin SOIC/DIP/TSSOP Evaluation Board.
• Appendix C. “Microchip Analog and Interface Device Compatibility” –
Documents the Microchip Analog & Interface devices that are footprint compatible
with this PCB.
© 2006 Microchip Technology Inc.
DS51597A-page 1
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Represents
Referenced books
Emphasized text
Examples
MPLAB® IDE User’s Guide
...is the only compiler...
RECOMMENDED READING
This blank PCB is generic and can be used with any Microchip device that is offered in
one of the following 14-pin packages:
• SOIC
• DIP
• TSSOP
For more information regarding devices available in these 14-pin packages, please
refer to the Microchip web site at www.microchip.com.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
DS51597A-page 2
© 2006 Microchip Technology Inc.
Preface
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision A (January 2006)
• Initial Release of this Document.
© 2006 Microchip Technology Inc.
DS51597A-page 3
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
NOTES:
DS51597A-page 4
© 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP
EVALUATION BOARD USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the 14-Pin SOIC/DIP/TSSOP Evaluation Board
and covers the following topics:
• What is the 14-Pin SOIC/DIP/TSSOP Evaluation Board?
• What the 14-Pin SOIC/DIP/TSSOP Evaluation Board kit includes
1.2
WHAT IS THE 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD?
The 14-Pin SOIC/DIP/TSSOP Evaluation Board allows the system designer to quickly
evaluate the operation of Microchip Technology’s devices in any of the following 14-pin
packages:
• SOIC
• DIP
• TSSOP
Some of the Microchip’s family of devices that can be evaluated in the PCB include:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.3
A/D Converters (ADCs)
Battery Chargers
Comparators
D/A Converters (DACs)
DC-to-DC Converters
Digital Potentiometers (Digi-Pots)
Fan Controllers
Integrated Devices
Interface Devices
Linear Regulators
Operational Amplifiers (Op Amps)
Power MOSFET Drivers
Programmable Gain Amplifiers (PGAs)
Switching Regulators
Temperature Sensors
Voltage Supervisors and Voltage Detectors
PICmicro® Microcontrollers
WHAT THE 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD KIT INCLUDES
This 14-Pin SOIC/DIP/TSSOP Evaluation Board Kit includes:
• Five 14-Pin SOIC/DIP/TSSOP Evaluation Board Printed Circuit Boards (PCBs)
• 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
(Electronic version on CD)
© 2006 Microchip Technology Inc.
DS51597A-page 5
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
NOTES:
DS51597A-page 6
© 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP
EVALUATION BOARD USER’S GUIDE
Chapter 2. Installation and Operation
2.1
INTRODUCTION
This blank Printed Circuit Board allows any 14-pin device in the following four package
types to be installed:
1. SOIC-14
2. PDIP-14
3. TSSOP-14
This board is generic so that any device may be installed. Refer to the device data
sheet, however, for suitability of device evaluation.
As well as the device, other desired passive components (resistors and capacitors) and
connection posts may be installed. This allows the board to evaluate a minimum
configuration for the device. Also, this allows the device to easily be jumpered into an
existing system.
2.2
FEATURES
The 14-Pin SOIC/DIP/TSSOP Evaluation Board has the following features:
• Connection terminals may be either through-hole or surface-mount
• Three 14-pin package footprints supported:
- SOIC
- DIP
- TSSOP
• Footprints for optional passive components and other devices for:
- Power supply filtering
- Device bypass capacitor
- Output filtering
- Output pull-up resistor
- Output pull-down resistor
- Output loading resistor
- Output series resistor
- Up to four additional passive components
- Jumper Headers
- SOT-23-6
• Silk-screen area to write specifics of implemented circuit (on back of PCB), such
as MCP2120 (to indicate that the device is MCP2120)
• PICmicro® MCU Baseline Flash Microcontroller Programmer (BFMP) Header
• Can be used for SOIC-14, TSSOP-14 to DIP-14 converter
© 2006 Microchip Technology Inc.
DS51597A-page 7
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
2.3
GETTING STARTED
The 14-Pin SOIC/DIP/TSSOP Evaluation Board is a blank PCB that allows the user to
configure the circuit to the exact requirements. The passive components use the
surface-mount 805 package layout.
Figure 2-1 shows the evaluation board circuit. Pin “n” of each device (U1, U2 and U4)
is tied together. These pins are then connected with pad “n” of the PCB (through a
circuit). This circuit allows each pin to individually have any of the following: a pull-up
resistor, a pull-down resistor, an in-line resistor and/or a loading/filtering capacitor.
Device-filtering capacitors are available (C2 and C3), as well as a power supply filtering
capacitor (C1).
There may be cases where some additonal passive components are desired for the
evaluation circuit. The PCB has four 805 footprints that are not connected (labled P1,
P2, P3 and P4) and can easily be jumpered into the desired circuit.
DS51597A-page 8
© 2006 Microchip Technology Inc.
M
Installation and Operation
FIGURE 2-1:
14-Pin SOIC/DIP/TSSOP Evaluation Board Circuit (Page 1).
© 2006 Microchip Technology Inc.
DS51597A-page 9
M
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
FIGURE 2-2:
DS51597A-page 10
14-Pin SOIC/DIP/TSSOP Evaluation Board Circuit (Page 2)
© 2006 Microchip Technology Inc.
Installation and Operation
2.3.1
The Hardware
Figure 2-3 shows the layout of the 14-Pin SOIC/DIP/TSSOP Evaluation Board. This is
a small four-layer board (3.55" x 1.79" (9.02 mm x 4.55 mm)). There are sixteen
connection points/pads that can use either through-hole or surface-mount connector
posts.
The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS
is connected to the PCB ground plane. All the passive components that are connected
to VDD or VSS are connected to either the power plane or ground plane.
The fourteen remaining PCB pads correspond to the device pins (i.e.; pad 1 connects
to pin 1).
Each pad has four passive components associated with them: a pull-up resistor (R2x),
a pull-down resistor (R3x), an in-line resistor (R1x) and a filtering/load capacitor (C1x).
The “x” is an alpha character that corresponds to a particular pad (A to P). As an example, Pad 5’s pull-up resistor is R2E.
The green area of Figure 2-3 shows the silk-screen on the bottom layer of the PCB.
This is where the details of the implemented circuit can be written.
Capacitor C1 is the power supply filtering capacitor.
Capacitors C2 and C3 are bypass capacitors that may be required to be installed,
depending on the device selected and the system requirements (such as the noise
present on the power supply). Table 2-1 describes the components.
A 6-pin header interface is available that supports the PICmicro MCU Baseline Flash
Microcontroller Programmer (BFMP) interface. For additional information, refer to
Section 2.4.5 “Baseline Flash Microcontroller Programmer (BFMP) Interface
(Header J1)”.
FIGURE 2-3:
© 2006 Microchip Technology Inc.
14-Pin SOIC/DIP/TSSOP Evaluation Board Layout.
DS51597A-page 11
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
TABLE 2-1:
OPTIONAL PASSIVE COMPONENTS
Device
C2
DS51597A-page 12
Comment
Power supply bypass capacitor
C3, C4
Device filtering capacitor
C1A, C1B, C1C, C1D, C1E, C1F, C1G, C1H,
C1J, C1K, C1L, C1M, C1N, C1P
Output filter capacitor
R1A, R1B, R1C, R1D, R1E, R1F, R1G, R1H,
R1J, R1K, R1L, R1M, R1N, R1P
In-line resistance of device output
R2A, R2B, R2C, R2D, R2E, R2F, R2G, R2H,
R2J, R2K, R2L, R2M, R2N, R2P
Pull-up resistor
R3A, R3B, R3C, R3D, R3E, R3F, R3G, R3H,
R3J, R3K, R3L, R3M, R3N, R3P
Pull-down resistor
P1, P2, P3, P4, P5, P6, P7, P8
Optional passive components
U1
14-pin DIP footprint
U2
14-pin SOIC footprint
U3
6-pin SOT-23 footprint
U4
14-pin TSSOP footprint
H1
BFMP Header Interface
J1, J2
3-pin Header for jumper connections
J3, J4, J5, J6
2-pin Header for jumper connections
S1, S2
Switch footprint
© 2006 Microchip Technology Inc.
Installation and Operation
2.4
14-PIN SOIC/DIP/TSSOP EVALUATION BOARD DESCRIPTION
The 14-Pin SOIC/DIP/TSSOP Evaluation Board PCB is designed to be flexible in the
type of device evaluation that can be implemented.
The following sections describe each element of this evaluation board in further detail.
Refer to Figure 2-4.
2.4.1
Power and Ground
The 14-Pin SOIC/DIP/TSSOP Evaluation Board has a VDD pad and a VSS pad. These
pads can have connection posts installed that allow easy connection to the power
(VDD) and ground (VSS) planes. The layout allows either through-hole or
surface-mount connectors.
The power and ground planes are connected to the appropriate passive components
on the PCB (such as power plane to R2X and ground plane to R3X and C1X).
2.4.2
PCB PADs
For each package pin (pins 1 to 14), there is a PCB pad (pads 1 to 14). The device will
have some power pins (VDD) and some ground pins (VSS). To ease connections on
the PCB, vias to the power and ground plane have been installed close to each PCB
pad. This allows any pad to be connected to the power or ground plane, so when power
is connected to the VDD and VSS pads, the power is connected to the appropriate
device pin.
Jumpering to VSS
FIGURE 2-4:
© 2006 Microchip Technology Inc.
Jumpering to VDD
Jumpering the PCB pad to either VDD or VSS.
DS51597A-page 13
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
2.4.3
Passive Components (R1X, R2X, R3X, C1X, R1, R2, C1, C2, C3,
P1, P2, P3 and P4)
The footprints for these components are present to allow maximum flexibility in the use
of this PCB to evaluate a wide range of 14-pin SOIC, DIP and TSSOP devices. The
purpose of these components may vary depending on the device under evaluation and
how it is to be used in the desired circuit. Refer to the device data sheet for the
recommended components that should be used when evaluating that device.
• Component R1X allows an in-line resistor that can be installed between the
device pin and the PCB pad. This may be required when interfacing this PCB to
other circuits.
• Component R2X allows a pull-up resistor to be installed for the device pin.
• Component R3X allows a pull-down resistor to be installed for the device pin.
• Component C1X allows a capacitive load/filter to be installed for the device pin.
• Component C2 allows a power supply filtering capacitor to be installed.
• Components C3 and C4 allow a device filtering capacitor to be installed.
• Components P1, P2, P3, P4, P5, P6, P7 and P8 are not connected and give a
footprint (805 surface-mount) for a passive component (resistor, capacitor, etc.) to
be installed and jumpered into the PCB circuit. This allows for the evaluation of
some simple device circuits to be implemented on this PCB.
2.4.4
Installing Resistor R1X
Resistor R1X is shorted by default. Therefore, if resistor R1X is to be installed, the trace
across the component must be cut before it is installed (see Figure 2-5).
While evaluating a device, it may be desireable to see the signals on both sides of this
resistor. A test point is available so that both signals may be monitored. This test point
is the avenue between components R3x and C1x (see Figure 2-5).
Test point
This trace must be cut
before resistor R1X can be installed
FIGURE 2-5:
DS51597A-page 14
Test point when resistor R1X is installed.
© 2006 Microchip Technology Inc.
Installation and Operation
2.4.5
Baseline Flash Microcontroller Programmer (BFMP) Interface
(Header J1)
The BFMP interface allows a PICmicro MCU device to be programmed with
programmers that support this interface, such as the BFMP programmer (part number
PG164101).
TABLE 2-2:
BFMP HEADER SIGNALS AND PICMICRO MCU PINS
BFMP Header Signal
Name
Number
14-pin PICmicro® MCU
Comment
Pin Number
—
1
—
CLK
2
12
ICSP™ Clock
ICSP Data
DT
3
13
VSS
4
14
VDD
5
1
VPP
6
4
© 2006 Microchip Technology Inc.
ICSP Programming Voltage
DS51597A-page 15
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
2.4.6
The PCB as a SOIC-14 or TSSOP-14 to DIP-14 Socket Converter
There may be occasions when it is desirable to convert the footprint of the device to
that of a DIP package. This allows the device to be installed into an existing DIP socket.
Two 1x7 row pins need to be installed into the PCB’s DIP footprint when the device is
installed into the appropriate package footprint.
This allows the PCB to convert the SOIC-14 or TSSOP-14 footprints to a 300-mil
DIP-14 footprint.
2.4.7
Evaluating a Digital Potentiomenter Device
2.4.7.1
DIGITAL POTENTIOMENTER
The following digital potentiometers are supported by this evaluation board.
TABLE 2-3:
Device
DS51597A-page 16
14-PIN DIGITAL POTENTIOMETERS
SOIC
DIP
TSSOP
MCP42010
Yes
Yes
Yes
MCP42050
Yes
Yes
Yes
MCP42100
Yes
Yes
Yes
Comment
© 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP
EVALUATION BOARD USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the schematics and layouts for the 14-Pin SOIC/DIP/TSSOP
Evaluation Board. Diagrams included in this appendix:
•
•
•
•
•
•
•
A.2
Board Schematic - Digital Circuitry
Board – Top Layer + Bottom Layer + Silk-Screen
Board – Top Layer + Silk-Screen
Board – Bottom Layer
Board – Power Plane
Board – Ground Plane
Board – Component Layer
SCHEMATICS AND PCB LAYOUT
Figure A-4 shows the schematic of the 14-Pin SOIC/DIP/TSSOP Evaluation Board.
Figure A-2 shows the layout for the top layer of the 14-Pin SOIC/DIP/TSSOP
Evaluation Board. The layer order is shown in Figure A-1.
Top Layer
Ground Layer
Power Layer
Bottom Layer
FIGURE A-1:
© 2006 Microchip Technology Inc.
Layer Order.
DS51597A-page 17
M
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
FIGURE A-2:
DS51597A-page 18
Board Schematic - Digital Circuitry (Page 1).
© 2006 Microchip Technology Inc.
M
Schematic and Layouts
FIGURE A-3:
Board Schematic - Digital Circuitry (Page 2).
© 2006 Microchip Technology Inc.
DS51597A-page 19
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
FIGURE A-4:
DS51597A-page 20
Board Layout – Top Layer + Bottom Layer + Silk-Screen.
© 2006 Microchip Technology Inc.
Schematic and Layouts
FIGURE A-5:
Board Layout – Top Layer + Silk-Screen.
© 2006 Microchip Technology Inc.
DS51597A-page 21
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
FIGURE A-6:
DS51597A-page 22
Board Layout – Bottom Layer.
© 2006 Microchip Technology Inc.
Schematic and Layouts
FIGURE A-7:
Board Layout – Power Plane.
© 2006 Microchip Technology Inc.
DS51597A-page 23
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
FIGURE A-8:
DS51597A-page 24
Board Layout – Ground Plane.
© 2006 Microchip Technology Inc.
Schematic and Layouts
FIGURE A-9:
Board Layout – Component Layer.
© 2006 Microchip Technology Inc.
DS51597A-page 25
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
FIGURE A-10:
DS51597A-page 26
Board Layout – Bottom Silk.
© 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP
EVALUATION BOARD USER’S GUIDE
Appendix B. Bill Of Materials (BOM)
TABLE B-1:
Qty
BILL OF MATERIALS
Reference
Description
1
PCB 103-00094
SOT23 Evaluation Board PCB
0
U1
DIP-14 Device
0
U2
SOIC-14 Device
0
U3
SOT-23-6 Device
0
U4
TSSOP-14 Device
0
C2, C3, C4
0
0
Device Power Supply Bypass Capacitor
Surface-mount (805 package)
(Optional - Application-dependent)
C1A, C1B, C1C, C1D, Output Filer Capacitor
C1E, C1F, C1G, C1H, Surface-mount (805 package)
C1J, C1K, C1L, C1M, (Optional - Application-dependent)
C1N, C1P
R1A, R1B, R1C, R1D, Output inline resistor
R1E, R1F, R1G, R1H, Surface-mount (805 package)
R1J, R1K, R1L, R1M, (Optional - Application-dependent)
R1N, R1P
R2A, R2B, R2C, R2D, Output Pull-up resistor
R2E, R2F, R2G, R2H, Surface-mount (805 package)
R2J, R2K, R2L, R2M, (Optional - Application-dependent)
R2N, R2P
R3A, R3B, R3C, R3D, Output Pull-down resistor
R3E, R3F, R3G, R3H, Surface-mount (805 package)
R3J, R3K, R3L, R3M, (Optional - Application-dependent)
R3N, R3P
P1, P2, P3, P4, P5,
Passive component (not connected) that can
P6, P7, P8
be “blue wired” into the desired circuit. The
device layout supports the 805 package.
(Optional - Application-dependent)
H1
BFMP Header (6-pin, 100 mil spacing)
J1, J2
1x3 Jumper Stakes (male)
0
J3, J4, J5, J6
1x2 Jumper Stakes (male)
0
PAD1, PAD2, PAD3,
PAD4, PAD5, PAD6,
PAD7, PAD8, PAD9,
PAD10, PAD11,
PAD12, PAD13,
PAD14, VDD, VSS
Through-hole connectors
0
0
0
0
0
© 2006 Microchip Technology Inc.
Manufacturer
Part Number
Microchip
Technology Inc.
Microchip
Technology Inc.
Microchip
Technology Inc.
Microchip
Technology Inc.
Microchip
Technology Inc.
—
103-00094
User-specified
User-specified
User-specified
User-specified
User-specified
—
User-specified
—
User-specified
—
User-specified
—
User-specified
—
—
—
Jameco
ValuePro
Jameco
ValuePro
Keystone
Electronics®
—
7000-1x35G
7000-1x25G
5012
DS51597A-page 27
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
TABLE B-1:
Qty
0
0
BILL OF MATERIALS (CONTINUED)
Reference
PAD1, PAD2, PAD3,
PAD4, PAD5, PAD6,
PAD7, PAD8, PAD9,
PAD10, PAD11,
PAD12, PAD13,
PAD14, VDD, VSS
S1, S2
DS51597A-page 28
Description
Manufacturer
Part Number
Surface-mount connectors
Keystone
Electronics®
5016
Surface Mount Switch
Panasonic®
EVQ-PJS04K
© 2006 Microchip Technology Inc.
14-PIN SOIC/DIP/TSSOP
EVALUATION BOARD USER’S GUIDE
Appendix C. Microchip Analog and Interface Device
Compatibility
C.1
INTRODUCTION
This appendix documents the Microchip Analog and Interface devices that are footprint
compatible with the 14-Pin SOIC/DIP/TSSOP Evaluation Board.
The Analog and Interface devices currently fall into the following catagories:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
A/D Converters (ADCs)
Battery Chargers
Comparators
D/A Converters (DACs)
DC-to-DC Converters
Digital Potentiometers (Digi-Pots)
Fan Controllers
Integrated Devices
Interface Devices
Linear Regulators
Operational Amplifiers (Op Amps)
Power MOSFET Drivers
Programmable Gain Amplifiers (PGAs)
Switching Regulators
Temperature Sensors
Voltage Supervisors and Voltage Detectors
Table C-1 shows the Microchip Analog and Interface devices that are currently
supported. As new devices become available, this PCB may be able to support them.
Please check the device data sheet to verify if the device is available in one of the
package types supported by this PCB.
© 2006 Microchip Technology Inc.
DS51597A-page 29
14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide
TABLE C-1:
Device
ANALOG AND INTERFACE DEVICES
PCB COMPATIBILITY(1, 2)
SOIC
DIP
TSSOP
Comment
Digital Potentiometer
MCP42010
Yes
Yes
—
MCP42050
Yes
Yes
—
MCP42100
Yes
Yes
—
Operational Amplifiers (Op Amps)
MCP604
Yes
Yes
Yes
MCP609
Yes
Yes
Yes
MCP619
Yes
Yes
Yes
MCP6004
Yes
Yes
Yes
MCP6024
Yes
Yes
Yes
MCP6044
Yes
Yes
Yes
MCP6144
Yes
Yes
Yes
MCP6234
Yes
Yes
Yes
MCP6244
Yes
Yes
Yes
MCP6274
Yes
Yes
Yes
MCP6284
Yes
Yes
Yes
MCP6294
Yes
Yes
Yes
TC7650CPD
—
Yes
—
TC7652CPD
—
Yes
—
Programmable Gain Amplifiers (PGAs)
MCP6S26
Yes
Yes
Yes
MCP6544
Yes
Yes
Yes
MCP6549
Yes
Yes
Yes
Comparators
Voltage-to-Frequency
TC9400
Yes
Yes
—
TC9401
—
Yes
—
TC9402
—
Yes
—
Power MOSFET Drivers
TC4467
—
Yes
—
TC4468
—
Yes
—
TC4469
—
Yes
—
A/D Converters (ADCs)
MCP3004
Yes
Yes
Yes
MCP3204
Yes
Yes
Yes
MCP3302
Yes
Yes
Yes
—
Yes
—
Yes
Yes
Yes
—
—
Yes
TC520A
D/A Converters (DACs)
MCP4922
Battery Chargers
PS810
Note 1:
2:
DS51597A-page 30
Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet
for recommended value.
Installation of PCB capacitor C1 recommended. See data sheet for recommended
value.
© 2006 Microchip Technology Inc.
Microchip Analog and Interface Device Compatibility
TABLE C-1:
ANALOG AND INTERFACE DEVICES
PCB COMPATIBILITY(1, 2) (CONTINUED)
Device
SOIC
DIP
TSSOP
MCP2120
Yes
Yes
—
MCP25020
Yes
Yes
—
MCP25025
Yes
Yes
—
MCP25050
Yes
Yes
—
MCP25055
Yes
Yes
—
PIC16F505
Yes
Yes
Yes
PIC16F630
Yes
Yes
Yes
PIC16F636
Yes
Yes
Yes
PIC16F676
Yes
Yes
Yes
PIC16F684
Yes
Yes
Yes
PIC16F688
Yes
Yes
Yes
Comment
Interface Devices
®
PICmicro MCU’s
Voltage Supervisors and Voltage Detectors
None
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Switching Regulator
None
—
DC-to-DC Converters
None
Linear Regulators
None
Voltage References
None
Temperature Sensors
None
Fan Controllers
None
Integrated Devices
None
PWM Controllers
None
Note 1:
2:
© 2006 Microchip Technology Inc.
Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet
for recommended value.
Installation of PCB capacitor C1 recommended. See data sheet for recommended
value.
DS51597A-page 31
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10/31/05
DS51597A-page 32
© 2006 Microchip Technology Inc.
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