20-Pin TSSOP and SSOP Evaluation Board User's Guide

20-Pin TSSOP and SSOP
Evaluation Board
User’s Guide
© 2009 Microchip Technology Inc.
DS51875A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
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Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS51875A-page 2
© 2009 Microchip Technology Inc.
20-PIN TSSOP AND SSOP
EVALUATION BOARD
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 5
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 What is the 20-Pin TSSOP and SSOP Evaluation Board? ............................ 9
1.3 What the 20-Pin TSSOP and SSOP Evaluation Board Kit Includes .............. 9
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Features ....................................................................................................... 11
2.3 Getting Started ............................................................................................. 12
2.4 20-Pin TSSOP and SSOP Evaluation Board Description ............................ 18
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 27
A.2 Schematics and PCB Layout ....................................................................... 27
A.3 Board Schematic .......................................................................................... 28
A.4 Board Layout – Top Layer and Silk-Screen ................................................. 29
A.5 Board Layout – Bottom Layer ...................................................................... 30
A.6 Board Layout – Power Plane ....................................................................... 31
A.7 Board Layout – Ground Plane ..................................................................... 32
A.8 Board Layout – Top Components ................................................................ 33
A.9 Board Layout – Bottom Silk ......................................................................... 34
Appendix B. Bill Of Materials (BOM)
Worldwide Sales and Service .................................................................................... 36
© 2009 Microchip Technology Inc.
DS51875A-page 3
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
NOTES:
DS51875A-page 4
© 2009 Microchip Technology Inc.
20-PIN TSSOP AND SSOP
EVALUATION BOARD
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
20-Pin TSSOP and SSOP Evaluation Board. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
The Microchip Web Site
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the 20-Pin TSSOP and SSOP Evaluation Board.
The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the 20-Pin
TSSOP and SSOP Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get
started with this evaluation board.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the 20-Pin TSSOP and SSOP Evaluation Board.
• Appendix B. “Bill Of Materials (BOM)” – Lists the parts that can be installed
onto the 20-Pin TSSOP and SSOP Evaluation Board.
© 2009 Microchip Technology Inc.
DS51875A-page 5
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Represents
Referenced books
Emphasized text
Examples
MPLAB® IDE User’s Guide
...is the only compiler...
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision A (November 2009)
• Initial Release of this Document.
DS51875A-page 6
© 2009 Microchip Technology Inc.
20-PIN TSSOP AND SSOP
EVALUATION BOARD
USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the 20-Pin TSSOP and SSOP Evaluation Board
and covers the following topics:
• What is the 20-Pin TSSOP and SSOP Evaluation Board?
• What the 20-Pin TSSOP and SSOP Evaluation Board kit includes
1.2
WHAT IS THE 20-PIN TSSOP AND SSOP EVALUATION BOARD?
The 20-Pin TSSOP and SSOP Evaluation Board allows the system designer to quickly
evaluate the operation of Microchip Technology’s devices in any of the following 20-pin
packages:
• TSSOP
• SSOP
Some of the Microchip’s family of devices that can be evaluated in the PCB include:
•
•
•
•
•
•
1.3
Digital Potentiometers (Digi-Pots)
CAN
IrDA
Serial Peripherals
Switching Regulators
PICmicro® Microcontrollers
WHAT THE 20-PIN TSSOP AND SSOP EVALUATION BOARD KIT INCLUDES
This 20-Pin TSSOP and SSOP Evaluation Board Kit includes:
• Five 20-Pin TSSOP and SSOP Evaluation Boards - 102-00272
• Important Information sheet
© 2009 Microchip Technology Inc.
DS51875A-page 9
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
NOTES:
DS51875A-page 10
© 2009 Microchip Technology Inc.
20-PIN TSSOP AND SSOP
EVALUATION BOARD
USER’S GUIDE
Chapter 2. Installation and Operation
2.1
INTRODUCTION
This blank Printed Circuit Board allows 20-pin devices in the following four package
types to be installed:
1. TSSOP-20.
2. SSOP-20.
This board is generic so that any device may be installed. Refer to the device data
sheet, however, for suitability of device evaluation.
As well as the device, other desired passive components (resistors and capacitors) and
connection posts may be installed. This allows the board to evaluate a minimum
configuration for the device. Also, this allows the device to easily be jumpered into an
existing system.
The board also has a 6-pin interface (PICkit Serial, ICSP, BFMP,...) whose signals can
easily be jumpered to any of the device’s pins.
2.2
FEATURES
The 20-Pin TSSOP and SSOP Evaluation Board has the following features:
• Connection terminals may be either through-hole or surface-mount
• Three 20-pin package footprints supported:
- TSSOP
- SSOP
• Footprints for optional passive components (SMT 805 footprint) for:
- Power supply filtering
- Device bypass capacitor
- Output filtering
- Output pull-up resistor
- Output pull-down resistor
- Output loading resistor
• Silk-screen area to write specifics of implemented circuit (on back of PCB), such
as MCP4331 10 kΩ.
• PICkit Serial Analyzer / PICkit 2 Programming (ICSP) Header
© 2009 Microchip Technology Inc.
DS51875A-page 11
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
2.3
GETTING STARTED
The 20-Pin TSSOP and SSOP Evaluation Board is a blank PCB that allows the user to
configure the circuit to the exact requirements. The passive components use the
surface-mount 805 package layout.
This evaluation board supports the following Microchip device families:
•
•
•
•
•
•
Digital Potentiometers (Digi-Pots)
CAN
IrDA
Serial Peripherals
Switching Regulators
PICmicro® Microcontrollers
Figure 2-1 shows the evaluation board circuit. The pins on the 20-pin devices are tied
together pin n to pin n. Pad Pn is tied to pin n of the TSSOP device. The SSOP package
is on the bottom, so the pad Bn is tied to pin n of the SSOP device. The footprints for
the pull-up (RxU) and pull-down (RxD) devices are labeled in relation to the TSSOP
package, pin 1 is connected to R1U and R1D (which is connected to pin 20 of the
SSOP device on the bottom of the board).
This circuit allows each pin to individually have any of the following: a pull-up resistor,
a pull-down resistor (or a loading/filtering capacitor). Power supply filtering capacitors
are connected between the VDD and VSS pads (C1 and C2).
The circuit has a 6-pin header that can be used for PICkit Serial communication as well
as PIC ICSP. The signals of this header would need to be jumpered to the appropriate
device signal.
DS51875A-page 12
© 2009 Microchip Technology Inc.
Installation and Operation
TP1
TP2
DIP-20 (1)
TP9
PICkit Serial / ICSP
Interface
J1
NC
VDD
VSS
SDA
SCL
NC
NC
VDD
VSS
SDI
SCK
SDO
1
TP20
20
TP19
19
2
TP12
9
12
TP11
11
10
Requires blue
wire jumpering
to connect the
PICkit Interface
to the selected
device
TP10
R1U
TSSOP-20 (1)
VDD
20
2
19
9
12
10
11
VSS
TP1
R1D
1
C1
C2
R2U
TP2
R2D
TP19 TP20 SSOP-20 TP1 TP2
1
20
2
19
TP9 TP10
TP11 TP12
R19U
XTAL
9
12
VIA1
10
11
C3
VIA2
TP19
R19D
C4
R20U
TP20
PIC Circuitry (bottom of PCB)
R20D
NOTE1: The TSSOP14 device (Rheostat) will use the TSSOP-20 footprint, with not all pins connected.
FIGURE 2-1:
20-Pin TSSOP and SSOP Evaluation Board Circuit.
© 2009 Microchip Technology Inc.
DS51875A-page 13
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
2.3.1
The Hardware
Figure 2-2 and Figure 2-3 shows the component layout of the 20-Pin TSSOP and
SSOP Evaluation Board. This is a four-layer board (3.9" x 2.1" (99.06 mm x
53.34 mm)). There are twenty two connection points/pads that can use either
through-hole or surface-mount connector posts.
The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS
is connected to the PCB ground plane. All the passive components that are connected
to VDD or VSS are connected to either the power plane or ground plane.
The twenty remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to
pin 1).
Each pad has two passive components associated with them: a pull-up resistor and a
pull-down resistor. The pull-up resistor is always RXU and the pull-down resistor is
RXD. The “X” is a numeric value that corresponds to a particular pad (1 to 8). As an
example, Pad 5’s pull-up resistor is R5U. Capacitor C1 and C2 are the power supply
filtering capacitors. For whichever pin is the device’s VDD, the RxD component
footprint can be used for the device’s bypass capacitor. Table 2-1 describes the
components.
A 6-pin header interface is available that supports the PICkit Serial or the PICmicro
In-Circuit Serial Programming (ICSP) interface. For additional information, refer to
Section 2.4.5 “PICkit Serial or In-Circuit Serial Programming (ICSP) Interface
(Header J1)”.
DS51875A-page 14
© 2009 Microchip Technology Inc.
Installation and Operation
FIGURE 2-2:
© 2009 Microchip Technology Inc.
20-Pin TSSOP and SSOP Evaluation Board Layout (Top).
DS51875A-page 15
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
FIGURE 2-3:
DS51875A-page 16
20-Pin TSSOP and SSOP Evaluation Board Layout (Bottom).
© 2009 Microchip Technology Inc.
Installation and Operation
TABLE 2-1:
OPTIONAL COMPONENTS (2)
Component
Comment
C1, C2
Power supply bypass capacitors
C3, C4
PIC Crystal capacitors
R1U, R2U, R3U, R4U, R5U, R6U, R7U, R8U,
R9U, R10U, R11U, R12U, R13U, R14U, R15U,
R16U, R17U, R18U, R19U, R20U
Pull-up resistors
R1D, R2D, R3D, R4D, R5D, R6D, R7D, R8D,
R9D, R10D, R11D, R12D, R13D, R14D, R15D,
R16D, R17D, R18D, R19D, R20D
Pull-down resistors (1)
Y1
Can connect to either PIC’ main oscillator
or to the Timer oscillator circuit.
J1
PICkit Serial / ICSP header
Note 1:
2:
© 2009 Microchip Technology Inc.
Whichever pin is the device’s VDD pin, that corresponding RxD footprint can be
used for the device’s bypass capacitor. So if Pin 8 is the device’s VDD pin, then
install the bypass capacitor in the R8D footprint.
All passive components use the surface mount 805 footprint.
DS51875A-page 17
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
2.4
20-PIN TSSOP AND SSOP EVALUATION BOARD DESCRIPTION
The 20-Pin TSSOP and SSOP Evaluation Board PCB is designed to be flexible in the
type of device evaluation that can be implemented.
The following sections describe each element of this evaluation board in further detail.
2.4.1
Power and Ground
The 20-Pin TSSOP and SSOP Evaluation Board has a VDD pad and a VSS pad. These
pads can have connection posts installed that allows easy connection to the power
(VDD) and ground (VSS) planes. The layout allows either through-hole or surface-mount
connectors.
The power and ground planes are connected to the appropriate passive components
on the PCB (such as power plane to RXU and ground plane to RXD components).
2.4.2
PCB Pads
For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will
have some power pins (VDD) and some ground pins (VSS). To ease connections on the
PCB, vias to the power and ground plane have been installed close to each PCB pad.
This allows any pad to be connected to the power or ground plane, so when power is
connected to the VDD and VSS pads, the power is connected to the appropriate device
pin (see Figure 2-4).
Jumpering to VSS
or
Jumpering to VDD
or
0Ω
0Ω
FIGURE 2-4:
2.4.3
Connecting the PCB pad to either VDD or VSS.
Passive Components (RXU, RXD, C1, and C2)
The footprints for these components are present to allow maximum flexibility in the use
of this PCB to evaluate a wide range of devices. The purpose of these components may
vary depending on the device under evaluation and how it is to be used in the desired
circuit. Refer to the device data sheet for the recommended components that should
be used when evaluating that device.
• Component RXU allows a pull-up resistor to be installed for the device pin
• Component RXD allows a pull-down resistor or a a capacitive load/filter to be
installed for the device pin
• Component C1 and C2 allows power supply filtering capacitors to be installed
DS51875A-page 18
© 2009 Microchip Technology Inc.
Installation and Operation
2.4.4
Device Footprints
This section describes the characteristics of the component footprints so that you are
better able to determine if the desired component(s) are compatible with the board.
2.4.4.1
TSSOP-20
The 20-pin TSSOP footprint has been layed out for packages that have a typical pitch
of 0.65 mm (BSC), a maximum lead width of 0.30 mm, and a molded package width of
4.50 mm (BSC). Twenty-lead (or less, such as sixteen-lead and fourteen-lead) TSSOP
packages that meet these characteristics should be able to be used with this board.
2.4.4.2
SSOP-20
The 20-pin SSOP footprint has been layed out for packages that have a typical pitch of
0.65 mm (BSC), a maximum lead width of 0.38 mm, and a maximum molded package
width of 5.60 mm. Twenty-lead (or less) SSOP packages that meet these
characteristics should be able to be used with this board.
2.4.4.3
DIP-20
The 20-pin DIP footprint has been layed out for packages that have a typical pitch of
100 mil (BSC), a maximum lead width of 22 mil and a molded package width of 600 mil.
2.4.4.4
PASSIVE COMPONENTS
All passive components (RxU, RxD, and Cx) use a surface mount 805 footprint. Any
component that has a compatible footprint could be used with this board.
2.4.4.5
HEADER (1X6)
The header has a typical pitch of 100 mil (BSC). This header is designed to be
compatible with the PICkit Serial Analyzer and PICkit 2 Programmer.
© 2009 Microchip Technology Inc.
DS51875A-page 19
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
2.4.5
PICkit Serial or In-Circuit Serial Programming (ICSP) Interface
(Header J1)
Figure 2-5 shows the interface connection of Header J1. The VDD and VSS signals are
connected to the appropriate power or ground plane. The other 4 signals are open and
can be easily jumpered to any of the 20 P1 (B20) through P20 (B1) connection points.
The top layer silk screen indicates the common PICkit Serial signal names, while the
bottom layer silk screen indicates the ICSP signal names.
Top-Layer Traces (PICkit Serial)
Bottom-Layer Traces (ICSP)
Ground Plane
Power Plane
FIGURE 2-5:
DS51875A-page 20
PICkit Serial / ICSP Interface Connections.
© 2009 Microchip Technology Inc.
Installation and Operation
2.4.5.1
PICKIT SERIAL INTERFACE
Table 2-2 shows the pin number assignment for the different signals for each of the
supported interface protocols (SPI, I2C,...).
TABLE 2-2:
PICKIT SERIAL HEADER SIGNALS
PICkit Serial Header Signal
Pin
Number
SPI
I2C
USART
Microwire
LIN
1
CS
—
TX
CS
TX
2
VDD
VDD
VDD
VDD
—
3
VSS
VSS
VSS
VSS
VSS
4
SDI
SDA
—
SDI
CS/WAKE
5
SCK
SCL
—
SCK
FAULT/TXE
6
SDO
—
RX
SDO
RX
2.4.5.2
Comments
ICSP INTERFACE
The ICSP interface allows a PICmicro MCU device to be programmed with
programmers that support this interface, such as the PICkit 2 programmer (part number
PG164120). Table 2-3 shows the pin number assignment for the ICSP signals.
TABLE 2-3:
ICSP HEADER SIGNALS
Pin
Number
ICSP Signal
1
VPP
2
VDD
3
VSS
Comments
High Voltage Signal
4
PCD
ICSP™ Data
5
PCC
ICSP™ Clock
6
—
© 2009 Microchip Technology Inc.
DS51875A-page 21
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
2.4.6
Evaluating the MCP4361 Device (A Digital Potentiometer)
The MCP4361 is a Digital Potentiometer that is in a 20-lead TSSOP package with an
SPI serial interface. This allows the device to be communicated to by the PICkit Serial
Analyzer. For this to occur, the PICkit Serial Analyzer signals must be connected to the
correct MCP4018 signals. These connections are shown in Figure 2-7.
Other Digital Potentiometers that are supported by this evaluation board are shown in
Table 2-4.
MCP43X1 Quad Potentiometers
P3A
P3W
P3B
CS
SCK
SDI
VSS
P1B
P1W
P1A
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
12
12
11
P2A
P2W
P2B
VDD
SDO
RESET
WP
P0B
P0W
P0A
TSSOP
FIGURE 2-6:
MCP43X1 (MCP4361) Pin Out.
Required “Jumpers” for PICkit Serial operation.
Note: VDD, VSS are connected to
appropriate signal plane.
FIGURE 2-7:
MCP4361).
DS51875A-page 22
PICkit Serial / ICSP Header and Example Connections (for
© 2009 Microchip Technology Inc.
Installation and Operation
TABLE 2-4:
Device
SUPPORTED DIGITAL POTENTIOMETERS
TSSOP
SSOP
MCP4331
Yes
—
MCP4332
Yes
—
MCP4341
Yes
—
MCP4342
Yes
—
MCP4351
Yes
—
MCP4352
Yes
—
MCP4361
Yes
—
MCP4362
Yes
—
MCP4231
Yes
—
14-pin TSSOP
MCP4241
Yes
—
14-pin TSSOP
MCP4251
Yes
—
14-pin TSSOP
MCP4261
Yes
—
14-pin TSSOP
MCP4631
Yes
—
14-pin TSSOP
MCP4641
Yes
—
14-pin TSSOP
MCP4651
Yes
—
14-pin TSSOP
MCP4661
Yes
—
14-pin TSSOP
© 2009 Microchip Technology Inc.
Comment
DS51875A-page 23
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
2.4.7
Evaluating the PIC24F16KA101 Device
(nanoWatt XLP PIC Microcontroller)
The PIC24F16KA101 is a nanoWatt XLP PIC Microcontroller that is offered in a 20-lead
SSOP package. This device can be installed on the bottom side of the PCB. Figure 2-8
shows the PIC24F16KA101’s pin out, while Figure 2-9 shows an example connection
for the ICSP interface and the connection of the crystal circuit to the secondary
oscillator.
Other nanoWatt XLP PIC Microcontrollers that are supported by this evaluation board
are shown in Table 2-5.
PIC24F16KA101
MCLR/VPP/RA5
PGC2/AN0/VREF+/CN2/RA0
PGD2/AN1/VREF-/CN3/RA1
PGD1/AN2/C1IND/C2INB/U2TX/CN4/RB0
PGC1/AN3/C1INC/C2INA/U2RX/U2BCLK/CN5/RB1
U1RX/U1BCLK/CN6/RB2
OSCI/CLKI/AN4/C1INB/C2IND/CN30/RA2
OSCO/CLKO/AN5/C1INA/C2INC/CN29/RA3
PGD3/SOSCI/U2RTS/CN1/RB4
PGC3/SOSCO/T1CK/U2CTS/CN0/RA4
FIGURE 2-8:
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VDD
VSS
REFO/SS1/T2CK/T3CK/CN11/RB15
AN10/CVREF/RTCC/SDI1/OCFA/C1OUT/INT1/CN12/RB14
AN11/SDO1/CTPLS/CN13/RB13
AN12/HLVDIN/SCK1/CTED2/CN14/RB12
OC1/IC1/C2OUT/INT2/CTED1/CN8/RA6
U1RTS/SDA1/CN21/RB9
U1CTS/SCL1/CN22/RB8
U1TX/INT0/CN23/RB7
PIC24F16KA101 Pin Out.
Capacitor value dependent on
crystal and oscillator mode selected.
“Jumpers” for ICSP operation.
Note: LVP signal is not connected and
VDD, VSS are connected to
appropriate signal plane.
FIGURE 2-9:
DS51875A-page 24
PIC ICSP Header Example Connections (for PIC24F16KA101).
© 2009 Microchip Technology Inc.
Installation and Operation
TABLE 2-5:
Device
SUPPORTED NANOWATT XLP PIC MICROCONTROLLERS
TSSOP
SSOP
PIC24F16KA101
—
Yes
PIC24F08KA101
—
Yes
PIC24F04KA201
—
Yes
PIC18F13K22
—
Yes
PIC18F13K50
—
Yes
PIC18F14K22
—
Yes
PIC18F14K50
—
Yes
© 2009 Microchip Technology Inc.
Comment
DS51875A-page 25
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
NOTES:
DS51875A-page 26
© 2009 Microchip Technology Inc.
20-PIN TSSOP AND SSOP
EVALUATION BOARD
USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the schematic and layouts for the 20-Pin TSSOP and SSOP
Evaluation Board. Diagrams included in this appendix:
•
•
•
•
•
•
•
A.2
Board Schematic
Board Layout – Top Layer and Silk-Screen
Board Layout – Bottom Layer
Board Layout – Power Plane
Board Layout – Ground Plane
Board Layout – Top Components
Board Layout – Bottom Silk
SCHEMATICS AND PCB LAYOUT
Section A.3 “Board Schematic” shows the schematic of the 20-Pin TSSOP and
SSOP Evaluation Board.
Section A.4 “Board Layout – Top Layer and Silk-Screen” shows the layout for the
top layer of the 20-Pin TSSOP and SSOP Evaluation Board. The layer order is shown
in Figure A-1.
Top Layer
Ground Layer
Power Layer
Bottom Layer
FIGURE A-1:
© 2009 Microchip Technology Inc.
Layer Order.
DS51875A-page 27
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
BOARD SCHEMATIC
M
A.3
DS51875A-page 28
© 2009 Microchip Technology Inc.
Schematic and Layouts
A.4
BOARD LAYOUT – TOP LAYER AND SILK-SCREEN
© 2009 Microchip Technology Inc.
DS51875A-page 29
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
A.5
BOARD LAYOUT – BOTTOM LAYER
DS51875A-page 30
© 2009 Microchip Technology Inc.
Schematic and Layouts
A.6
BOARD LAYOUT – POWER PLANE
© 2009 Microchip Technology Inc.
DS51875A-page 31
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
A.7
BOARD LAYOUT – GROUND PLANE
DS51875A-page 32
© 2009 Microchip Technology Inc.
Schematic and Layouts
A.8
BOARD LAYOUT – TOP COMPONENTS
© 2009 Microchip Technology Inc.
DS51875A-page 33
20-Pin TSSOP and SSOP Evaluation Board User’s Guide
A.9
BOARD LAYOUT – BOTTOM SILK
DS51875A-page 34
© 2009 Microchip Technology Inc.
20-PIN TSSOP AND SSOP
EVALUATION BOARD
USER’S GUIDE
Appendix B. Bill Of Materials (BOM)
TABLE B-1:
Qty
5
Note:
BILL OF MATERIALS
Reference
Description
RoHS Compliant Bare PCB, 20-pin TSSOP
and SSOP Evaluation Board
No Assembly required on this PCB.
PCB
© 2009 Microchip Technology Inc.
Manufacturer
Part Number
Microchip Technology Inc.
102-00272
DS51875A-page 35
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03/26/09
DS51875A-page 36
© 2009 Microchip Technology Inc.
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