8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User's Guide

8-Pin SOIC/MSOP/TSSOP/DIP
Evaluation Board
User’s Guide
© 2005 Microchip Technology Inc.
DS51544A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance and WiperLock are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS51544A-page ii
© 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 1
Chapter 1. Product Overview ........................................................................................ 5
1.1 Introduction ..................................................................................................... 5
1.2 What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board? .................... 5
1.3 What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit Includes ...... 5
Chapter 2. Installation and Operation .......................................................................... 7
2.1 Introduction ..................................................................................................... 7
2.2 Features ......................................................................................................... 7
2.3 Getting Started ............................................................................................... 8
2.4 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Description .................... 12
Appendix A. Schematic and Layouts ......................................................................... 19
A.1 Introduction .................................................................................................. 19
A.2 Schematics and PCB Layout ....................................................................... 19
Appendix B. Bill of Materials (BOM)........................................................................... 27
Appendix C. Microchip Analog and Interface Device Compatability ...................... 29
C.1 Introduction .................................................................................................. 29
Appendix D. Rev. 1 PCB Errata................................................................................... 35
D.1 Introduction .................................................................................................. 35
D.2 Rev 1 PCB Issues ........................................................................................ 35
Worldwide Sales and Service .................................................................................... 38
© 2005 Microchip Technology Inc.
DS51544A-page iii
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
NOTES:
DS51544A-page iv
© 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE on-line help.
Select the Help menu, and then Topics to open a list of available on-line help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Items discussed in this chapter
include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation
Board. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the 8-Pin
SOIC/MSOP/TSSOP/DIP Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get
started with this evaluation board.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the 8-Pin
SOIC/MSOP/TSSOP/DIP Evaluation Board.
• Appendix C. “Microchip Analog and Interface Device Compatibility” –
Documents the Microchip Analog & Interface devices that are footprint
compatable with this PCB.
• Appendix D. “Rev. 1 PCB Errata” – Describes the PCB Errata for the Revision 1
board.
© 2005 Microchip Technology Inc.
DS51544A-page 1
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Represents
Referenced books
Emphasized text
Examples
MPLAB® IDE User’s Guide
...is the only compiler...
RECOMMENDED READING
This blank PCB is generic and can be used with any Microchip device that is offered in
one of the following 8-pin packages:
•
•
•
•
SOIC
DIP
MSOP
TSSOP
For more information regarding devices available in these 8-pin packages, please refer
to the Microchip web site at www.microchip.com.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
DS51544A-page 2
© 2005 Microchip Technology Inc.
Preface
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
In addition, there is a Development Systems Information Line which lists the latest versions of Microchip's development systems software products. This line also provides
information on how customers can receive currently available upgrade kits.
The Development Systems Information Line numbers are:
1-800-755-2345 – United States and most of Canada
1-480-792-7302 – Other International Locations
DOCUMENT REVISION HISTORY
Revision A (March 2005)
• Initial Release of this Document.
© 2005 Microchip Technology Inc.
DS51544A-page 3
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
NOTES:
DS51544A-page 4
© 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation
Board and covers the following topics:
• What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board?
• What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board kit includes
1.2
WHAT IS THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD?
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board allows the system designer to
quickly evaluate the operation of Microchip Technology’s devices in any of the following
8-pin packages:
•
•
•
•
SOIC
DIP
MSOP
TSSOP
Some of the Microchip family of devices that can be evaluated in the PCB include:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.3
A/D Converters (ADCs) (ADCs)
Battery Chargers
Comparators
D/A Converters (DACs) (DACs)
DC-to-DC Converters
Digital Potentiometers (Digi-Pots)
Fan Controllers
Integrated Devices
Interface Devices
Linear Regulators
Operational Amplifiers (Op Amps)
Power MOSFET Drivers
Programmable Gain Amplifiers (PGAs)s (PGAs)
Switching Regulators
Temperature Sensors
Voltage Supervisors and Voltage Detectors
PICmicro® Microcontrollers
WHAT THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD KIT
INCLUDES
This 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit includes:
• Three 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCBs
• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide (DS51544)
(Electronic version on CD)
© 2005 Microchip Technology Inc.
DS51544A-page 5
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
NOTES:
DS51544A-page 6
© 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER’S GUIDE
Chapter 2. Installation and Operation
2.1
INTRODUCTION
This blank Printed Circuit Board (PCB) allows any 8-pin device in the following four
package types to be installed:
1.
2.
3.
4.
SOIC-8
PDIP-8
MSOP-8
TSSOP-8
This board is generic so that any device may be installed. Refer to the device data
sheet, however, for suitability of device evaluation.
As well as the device, other desired passive components (resistors and capacitors) and
connection posts may be installed. This allows the board to evaluate a minimum
configuration for the device. Also, this allows the device to be easily jumpered into an
existing system.
2.2
FEATURES
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has the following features:
• Connection terminals may be either through-hole or surface-mount
• Four 8-pin package footprints supported:
- SOIC
- DIP
- MSOP
- TSSOP
• Footprints for optional passive components for:
- Power supply filtering
- Device bypass capacitor
- Output filtering
- Output pull-up resistor
- Output pull-down resistor
- Output loading resistor
- Output series resistor
- Up to four additional passive components
• Silk-screen area to write specifics of implemented circuit (on back of PCB), such
as TC1232 4.75V, (to indicate that the device is the TC1232 with the 4.75V trip
point)
• PICmicro® MCU Baseline Flash Microcontroller Programmer (BFMP) Header
• Can be used for SOIC-8, MSOP-8, TSSOP-8 to DIP-8 converter
© 2005 Microchip Technology Inc.
DS51544A-page 7
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
2.3
GETTING STARTED
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board is a blank PCB that allows the
user to configure the circuit to the exact requirements. The passive components use
the surface-mount 805 package layout.
This evaluation board supports the following Microchip device families:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
A/D Converters (ADCs) (ADCs)
Battery Chargers
Comparators
D/A Converters (DACs) (DACs)
DC-to-DC Converters
Digital Potentiometers (Digi-Pots)
Fan Controllers
Integrated Devices
Interface Devices
Linear Regulators
Operational Amplifiers (Op Amps)
Power MOSFET Drivers
Programmable Gain Amplifiers (PGAs)s (PGAs)
Switching Regulators
Temperature Sensors
Voltage Supervisors and Voltage Detectors
PICmicro Microcontrollers
Figure 2-1 shows the evaluation board circuit. Pin “n” of each device (U1, U2, U3 and
U4) are tied together. These pins are then connected with pad “n” of the PCB (through
a circuit). This circuit allows each pin to individually have any of the following: a pull-up
resistor, a pull-down resistor, an in-line resistor and/or a loading/filtering capacitor.
Device-filtering capacitors are available (C2 and C3), as well as a power supply filtering
capacitor (C1).
There may be cases where some additonal passive components are desired for the
evaluation circuit. The PCB has four 805 footprints that are not connected (labled P1,
P2, P3 and P4) and can easily be jumpered into the desired circuit.
DS51544A-page 8
© 2005 Microchip Technology Inc.
Installation and Operation
(3)
PAD1 R1A*
R2A*
R2H*
R3A*
R3H*
C1H*
C1A*
(3)
PAD2 R1B*
R2B*
R2G*
R3B*
R3G*
C1B*
1
8
2
7
3
6
4
R2C*
(3)
PAD3 R1C*
UX
5
R2F*
R3F*
R3C*
R3E*
C2 (2)
C1D*
To power plane
C1 (2)
To ground plane
VDD
VSS
VDD
C3 (2)
FIGURE 2-1:
R1E* (3) PAD5
C1E*
VSS
P1 (1)
TP11
TP13
TP12
P2 (1)
TP14
P3 (1)
TP15
TP17
*
Note 1:
2:
3:
PAD6
R2E*
R3D*
VSS
R1F* (3)
C1F*
R2D*
VDD
R1G* (3) PAD7
C1G*
C1C*
(3)
PAD4 R1D*
R1H* (3) PAD8
TP16
P4 (1)
TP18
Optional components, circuit-dependent.
Can be any passive component (R, C, ...) that fits onto a 805 surface-mount footprint.
Optional power/device filtering capacitors.
When installing this component, ensure to cut the trace between the two pads of the device.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Circuit.
© 2005 Microchip Technology Inc.
DS51544A-page 9
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
2.3.1
The Hardware
Figure 2-2 shows the layout of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.
This is a small four-layer board (1.5" x 2" (38.1 mm x 50.8 mm)). There are ten
connection points/pads that can use either through-hole or surface-mount connector
posts.
The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS
is connected to the PCB ground plane. All the passive components that are connected
to VDD or VSS are connected to either the power plane or ground plane.
The eight remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to
pin 1).
Each pad has four passive components associated with them: a pull-up resistor, a
pull-down resistor, an in-line resistor and a filtering/load capacitor. The pull-up resistor
is always R2X, the pull-down resistor is R3X, the in-line resistor is R1X and the
filtering/load capacitor is C1X. The “X” is an alpha character that corresponds to a
particular pad (A to H). As an example, Pad 5’s pull-up resistor is R2E.
The green area of Figure 2-2 shows the silk-screen on the bottom layer of the PCB.
This is where the details of the implemented circuit can be written.
Capacitor C1 is the power supply filtering capacitor.
Capacitors C2 and C3 are bypass capacitors that may be required to be installed,
depending on the device selected and the system requirements (such as the noise
present on the power supply). Table 2-1 describes the components.
A 6-pin header interface is available that supports the PICmicro MCU Baseline Flash
Microcontroller Programmer (BFMP) interface. For additional information, refer to
Section 2.4.5 “Baseline Flash Microcontroller Programmer (BFMP) Interface
(Header J1)”.
FIGURE 2-2:
DS51544A-page 10
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout.
© 2005 Microchip Technology Inc.
Installation and Operation
TABLE 2-1:
OPTIONAL PASSIVE COMPONENTS
Device
C1
Comment
Power supply bypass capacitor
C2, C3
Device Filtering capacitor
C1A, C1B C1C, C1D, C1E, C1F, C1G, C1H
Output filter capacitor
R1A, R1B, R1C, R1D, R1E, R1F, R1G, R1H
In-line resistance of device output
R2A, R2B, R2C, R2D, R2E, R2F, R2G, R2H
Pull-up resistor
R3A, R3B, R3C, R3D, R3E, R3F, R3G, R3H
Pull-down resistor
P1, P2, P3, P4
Optional Passive Components
© 2005 Microchip Technology Inc.
DS51544A-page 11
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
2.4
8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD DESCRIPTION
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCB is designed to be flexible
in the type of device evaluation that can be implemented.
The following sections describe each element of this evaluation board in further detail.
Refer to Figure 2-3.
2.4.1
Power and Ground
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has a VDD Pad and a VSS pad.
These pads can have connection posts installed that allows easy connection to the
power (VDD) and ground (VSS) planes. The layout allows either through-hole or
surface-mount connectors.
The power and ground planes are connected to the appropriate passive components
on the PCB (such as power plane to R2X and ground plane to R3X and C1X).
2.4.2
PCB PADs
For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will
have some power pins (VDD) and some ground pins (VSS). To ease connections on the
PCB, vias to the power and ground plane have been installed close to each PCB pad.
This allows any pad to be connected to the power or ground plane, so when power is
connected to the VDD and VSS pads, the power is connected to the appropriate device
pin.
Jumpering to VSS
FIGURE 2-3:
Jumpering to VDD
Jumpering the PCB pad to either VDD or VSS.
Revision 1 of this PCB has an issue that these vias are not connected to the desired
power and ground planes (they are open). For additional information, refer to
Appendix D. “Rev. 1 PCB Errata”.
DS51544A-page 12
© 2005 Microchip Technology Inc.
Installation and Operation
2.4.3
Passive Components (R1X, R2X, R3X, C1X, R1, R2, C1, C2, C3,
P1, P2, P3 and P4)
The footprints for these components are present to allow maximum flexibility in the use
of this PCB to evaluate a wide range of SOT-23-3 devices. The purpose of these
components may vary depending on the device under evaluation and how it is to be
used in the desired circuit. Refer to the device data sheet for the recommended
components that should be used when evaluating that device.
• Component R1X allows an in-line resistor that can be installed between the
device pin and the PCB pad. This may be required when interfacing this PCB to
other circuits
• Component R2X allows a pull-up resistor to be installed for the device pin
• Component R3X allows a pull-down resistor to be installed for the device pin
• Component C1X allows a capacitive load/filter to be installed for the device pin
• Component C1 allows a power supply filtering capacitor to be installed
• Components C2 and C3 allows a device filtering capacitor to be installed
• Components P1, P2, P3, and P4 are not connected and give a footprint (805
surface-mount) for a passive component (resistor, capacitor, etc.) to be installed
and jumpered into the PCB circuit. This allows for the evaluation of some simple
device circuits to be implemented on this PCB
2.4.4
Installing Resistor R1X
Resistor R1X is shorted by default. Therefore, if resistor R1X is to be installed, the trace
across the component must be cut before it is installed (see Figure 2-4).
While evaluating a device, it may be desireable to see the signals on both sides of this
resistor. A test point is available so that both signals may be monitored. This test point
is the avenue between components R3X and C1X (see Figure 2-4).
This trace must be cut
before resistor R1X can be installed
Test point
FIGURE 2-4:
© 2005 Microchip Technology Inc.
Test point when resistor R1X is installed.
DS51544A-page 13
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
2.4.5
Baseline Flash Microcontroller Programmer (BFMP) Interface
(Header J1)
The BFMP interface allows a PICmicro MCU device to be programmed with
programmers that support this interface, such as the BFMP programmer (part number
PG164101).
The PCB supports two device pinouts. The default pinout already has the traces
connected to the appropriate PICmicro MCU pins. The optional pinout requires three
PCB traces to be cut and then three connections to be made (see Figure 2-5).
TABLE 2-2:
BFMP HEADER SIGNALS AND PICMICRO MCU PINS
Pin Number
BFMP
Header
Signal
Default
Pinout
Optional
Pinout (1)
Comment
CLK
6
4
ICSP™ Clock
DT
7
5
ICSP Data
VPP
4
8
Note 1:
Requires PCB traces to be cut and then jumpered.
Required “Cuts” and “Jumpers” for Optional
PICmicro® MCU pinout
FIGURE 2-5:
BFMP Header and Connections
Top-Layer Traces
FIGURE 2-6:
DS51544A-page 14
Bottom-Layer Traces
PCB Traces (Top and Bottom Layers).
© 2005 Microchip Technology Inc.
Installation and Operation
2.4.6
The PCB as a SOIC-8, MSOP-8, or TSSOP-8 to DIP-8 Socket
Converter
There may be occasions when it is desireable to convert the footprint of the device to
that of a DIP package. This allows the device to be installed into an exsisting DIP
socket. Two 1x4 row pins need to be installed into the PCB’s DIP footprint when the
device is installed into the appropriate package footprint.
This allows the PCB to convert the SOIC-8, MSOP-8 or TSSOP-8 footprints to a
300-mil DIP-8 footprint.
2.4.7
Evaluating a Voltage Supervisor or Voltage Detector Device
2.4.7.1
VOLTAGE SUPERVISORS
The following voltage supervisor is supported by this evaluation board.
TABLE 2-3:
Device
8-PIN VOLTAGE SUPERVISOR
SOIC
DIP
MSOP
TSSOP
Yes
Yes
—
—
TC1232
2.4.7.2
Comment
TESTING THE VOLTAGE SUPERVISORS TRIP POINT OPERATION
When evaluating a voltage supervisor/voltage detector device, a minimum set of test
equipment should be available. Table 2-4 shows the recommended test equipment.
TABLE 2-4:
TEST EQUIPMENT
Hardware
Connect to:
Comment
Variable Power
Supply
VDD, VSS
This allows the voltage to the SOT23 Evaluation Board
to be varied so the device output can be monitored.
Arbitrary Waveform
Generator
VDD, VSS
This is similar to a variable power supply, but allows programmability into the input signal that the device will be
subjected to. This also allows a particular waveform to
be repeated (such as a 60 Hz sine wave that varies from
1V to 5V).
Digital Multi-Meter
(D.M.M.)
VOUT (1)
Used to indicate the output state (low or high) of the
voltage supervisor/voltage detector.
Oscilloscope
VOUT (1)
Allows the device conditions and response to be evaluated due to the ability to capture this information. This is
useful for faster signals and cases where small spikes
need to be detected.
Test Light (LED)
VOUT (1)
Used to visually indicate the output state (low or high) of
the voltage supervisor/voltage detector. Ensure that the
current requirements of this LED can be supplied by the
device’s output pin.
Note 1:
© 2005 Microchip Technology Inc.
The pad connection to connect to the VOUT or RST pin will be dependent on the
device and the footprint option used.
DS51544A-page 15
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
A typical system that would be used to evaluate the voltage supervisor/voltage detector
device is shown in Figure 2-7. This also shows an example input and output waveform
for a voltage supervisor/voltage detector device.
SOT-23-5/6 Evaluation Board PCB
PCB
Pad
R2
Variable
Power
Supply
or
Arbitrary
Waveform
Generator
Voltage
Supervisor
or
Voltage
Detector
Oscilloscope
R1
C1
R3
Test Point
Arbitrary Waveform
Generator
Output
Test
Point or
VOUT
Device VDD out of valid operating range.
Output voltage may be indeterminate.
FIGURE 2-7:
DS51544A-page 16
Evaluation System.
© 2005 Microchip Technology Inc.
Installation and Operation
2.4.8
Example Op Amp Circuits
This section shows how the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board could be
used to evaluate op amp circuits. The first circuit is for the MCP601 and is shown in
Figure 2-8. Figure 2-9 shows which components on the PCB would be installed and
how the “unconnected” passive components would be jumpered into the circuit.
The second circuit is for the MCP6021 and is shown in Figure 2-10. Figure 2-11 shows
which components on the PCB would be installed and how the “unconnected” passive
components would be jumpered into the circuit.
C (P1)
R1C
R2
C1C
R2 is connected to pad 2
(not installed on PCB)
FIGURE 2-8:
3 + 7
2 –
4
Op Amp Circuit #1 (MCP601).
PAD1
PAD8
PAD2
PAD7
External
to PCB
Trace is cut,
resistor is installed
R2
1
8
2
7
3
6
4
PAD3
6
U1
5
R1C
PAD6
C1C
P1
PAD4
R1D
To power plane
VDD
PAD5
C2
VSS
VDD
C1
To ground plane
VSS
FIGURE 2-9:
PCB Connections for Op Amp Circuit #1 (MCP601).
© 2005 Microchip Technology Inc.
DS51544A-page 17
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
R1C
3 + 7
2 –
4
R3C
R (P1)
R1B
FIGURE 2-10:
6
Op Amp Circuit #2 (MCP6021).
PAD1
PAD8
Trace is cut,
resistor is installed
PAD2
R1B*
PAD7
Trace is cut,
resistor is installed
1
8
2
7
3
6
4
PAD3
R1C*
5
U1
R3C*
PAD6
P1
PAD4
PAD5
C2
To power plane
VDD
VSS
VDD
C1
To ground plane
VSS
FIGURE 2-11:
DS51544A-page 18
PCB Op Amp Circuit #2 (MCP6021).
© 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the schematics and layouts for the 8-Pin
SOIC/MSOP/TSSOP/DIP Evaluation Board. Diagrams included in this appendix:
•
•
•
•
•
•
•
A.2
Board Schematic - Digital Circuitry
Board – Top Layer + Bottom Layer + Silk-Screen
Board – Top Layer + Silk-Screen
Board – Bottom Layer
Board – Power Plane
Board – Ground Plane
Board – Component Layer
SCHEMATICS AND PCB LAYOUT
Figure A-3 shows the schematic of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation
Board.
Figure A-2 shows the layout for the top layer of the 8-Pin SOIC/MSOP/TSSOP/DIP
Evaluation Board. The layer order is shown in Figure A-1.
Top Layer
Ground Layer
Power Layer
Bottom Layer
FIGURE A-1:
© 2005 Microchip Technology Inc.
Layer Order.
DS51544A-page 19
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
FIGURE A-2:
DS51544A-page 20
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Schematic.
© 2005 Microchip Technology Inc.
Schematic and Layouts
FIGURE A-3:
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout – Top
Layer + Bottom Layer + Silk-Screen.
© 2005 Microchip Technology Inc.
DS51544A-page 21
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
FIGURE A-4:
DS51544A-page 22
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Top Layer + Silk-Screen.
© 2005 Microchip Technology Inc.
Schematic and Layouts
FIGURE A-5:
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Bottom Layer.
© 2005 Microchip Technology Inc.
DS51544A-page 23
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
FIGURE A-6:
DS51544A-page 24
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Power Plane
© 2005 Microchip Technology Inc.
Schematic and Layouts
FIGURE A-7:
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Ground Plane.
© 2005 Microchip Technology Inc.
DS51544A-page 25
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
FIGURE A-8:
DS51544A-page 26
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Component Layer.
© 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER’S GUIDE
Appendix B. Bill of Materials (BOM)
TABLE B-1:
Qty
BILL OF MATERIALS
Reference
Description
1
PCB 103-00050
SOT23 Evaluation Board PCB
0
U1
SOIC-8 Device
0
U2
MSOP-8 Device
0
U3
DIP-8 Device
0
U4
TSSOP-8 Device
0
C1, C2, C3
0
0
0
0
0
0
0
0
Device Power Supply Bypass Capacitor
Surface-mount (805 package)
(Optional - Application-dependent)
C1A, C1B, C1C,
Output Filer Capacitor
C1D, C1E, C1F,
Surface-mount (805 package)
C1G, C1H
(Optional - Application-dependent)
Output inline resistor
R1A, R1B, R1C,
R1D, R1E, R1F,
Surface-mount (805 package)
R1G, R1H
(Optional - Application-dependent)
R2A, R2B, R2C,
Output Pull-up resistor
R2D, R2E, R2F,
Surface-mount (805 package)
R2G, R2H
(Optional - Application-dependent)
R3A, R3B, R3C,
Output Pull-down resistor
R3D, R3E, R3F,
Surface-mount (805 package)
R3G, R3H
(Optional - Application-dependent)
P1, P2, P3, P4
Passive component (not connected) that can be
“blue wired” into the desired circuit. The device
layout supports the 805 package.
(Optional - Application-dependent)
J1
BFMP Header (6-pin, 100 mil spacing)
PAD1, PAD2, PAD3, Through-hole connector(s) for PAD1, PAD2,
PAD4, PAD5, PAD6, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, VDD,
VSS
PAD7, PAD8,
VDD, VSS
PAD1, PAD2, PAD3, Surface-mount connector(s) for PAD1, PAD2,
PAD4, PAD5, PAD6, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, VDD,
PAD7, PAD8,
VSS
VDD, VSS
© 2005 Microchip Technology Inc.
Manufacturer
Part Number
Microchip
Technology Inc.
Microchip
Technology Inc.
Microchip
Technology Inc.
Microchip
Technology Inc.
Microchip
Technology Inc.
—
103-00060
User-specified
User-specified
User-specified
User-specified
User-specified
—
User-specified
—
User-specified
—
User-specified
—
User-specified
—
Keystone
Electronics®
—
5012
Keystone
Electronics®
5016
DS51544A-page 27
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
NOTES:
DS51544A-page 28
© 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER’S GUIDE
Appendix C. Microchip Analog and Interface Device
Compatibility
C.1
INTRODUCTION
This appendix documents the Michrochip Analog and Interface devices that are footprint compatible with this PCB.
The Analog and Interface devices currently fall into the following catagories:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
A/D Converters (ADCs) (ADCs)
Battery Chargers
Comparators
D/A Converters (DACs) (DACs)
DC-to-DC Converters
Digital Potentiometers (Digi-Pots)
Fan Controllers
Integrated Devices
Interface Devices
Linear Regulators
Operational Amplifiers (Op Amps)
Power MOSFET Drivers
Programmable Gain Amplifiers (PGAs)s (PGAs)
Switching Regulators
Temperature Sensors
Voltage Supervisors and Voltage Detectors
Table C-1 shows the Michrochip Analog and Interface devices that are currently
supported. As new devices become available, this PCB may be able to support them.
Please check the device data sheet to verify if the device is available in one of the
package types supported by this PCB.
© 2005 Microchip Technology Inc.
DS51544A-page 29
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
TABLE C-1:
Device
ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY
SOIC
DIP
MSOP
TSSOP
Comment
Voltage Supervisors and Voltage Detectors
TC1232
Yes
Yes
—
—
Digital Potentiometer
MCP4021
Yes
—
Yes
—
MCP41010
Yes
Yes
—
—
MCP41050
Yes
Yes
—
—
MCP41100
Yes
Yes
—
—
Switching Regulator
MCP1601
—
—
Yes
—
MCP1612
—
—
Yes
—
MCP1630
—
—
Yes
—
MCP1650
—
—
Yes
—
MCP1651
—
—
Yes
—
MCP1652
—
—
Yes
—
—
DC-to-DC Converters
MCP1252
—
—
Yes
MCP1253
—
—
Yes
—
Yes
Yes
—
—
TC682
TC962
Yes
Yes
—
—
TC1044S
Yes
Yes
—
—
TC1121
Yes
Yes
Yes
—
TC1142
—
—
Yes
—
TC7660
Yes
Yes
—
—
TC7660B
Yes
Yes
—
—
TC7660H
Yes
Yes
—
—
TC7660S
Yes
Yes
—
—
TCM680
Yes
Yes
—
—
Linear Regulators
MCP1726
Yes
—
—
—
TC1107
Yes
—
Yes
—
TC1173
Yes
—
Yes
—
TC1174
Yes
—
Yes
—
TC1263
Yes
—
—
—
TC1265
Yes
—
—
—
TC1266
Yes
—
Yes
—
TC1268
Yes
—
—
—
TC1269
—
—
Yes
—
TC1300
—
—
Yes
—
TC1301A
—
—
Yes
—
TC1301B
—
—
Yes
—
TC1302A
—
—
Yes
—
TC1302B
—
—
Yes
—
—
—
Yes
—
TC1306
Note 1:
2:
DS51544A-page 30
Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet
for recommended value.
Installation of PCB capacitor C1 recommended. See data sheet for recommended
value.
© 2005 Microchip Technology Inc.
Microchip Analog and Interface Device Compatibility
TABLE C-1:
Device
ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY
SOIC
DIP
MSOP
TSSOP
Comment
Operational Amplifiers (Op Amps)
MCP601
Yes
Yes
—
Yes
Note 2
MCP602
Yes
Yes
—
Yes
Note 2
Note 2
MCP603
Yes
Yes
—
Yes
MCP606
Yes
Yes
—
Yes
MCP607
Yes
Yes
—
Yes
MCP608
Yes
Yes
—
Yes
MCP616
Yes
Yes
Yes
—
MCP617
Yes
Yes
Yes
—
MCP618
Yes
Yes
Yes
—
MCP6001
Yes
Yes
Yes
—
MCP6004
Yes
Yes
Yes
—
MCP6021
Yes
Yes
—
Yes
Note 2
MCP6022
Yes
Yes
—
Yes
Note 2
Note 2
MCP6023
Yes
Yes
—
Yes
MCP6041
Yes
Yes
Yes
—
MCP6042
Yes
Yes
Yes
—
MCP6043
Yes
Yes
Yes
—
MCP6141
Yes
Yes
Yes
—
MCP6142
Yes
Yes
Yes
—
MCP6143
Yes
Yes
Yes
—
MCP6231
Yes
Yes
Yes
—
MCP6232
Yes
Yes
Yes
—
MCP6241
Yes
Yes
Yes
—
MCP6242
Yes
Yes
Yes
—
MCP6271
Yes
Yes
Yes
—
Note 2
MCP6272
Yes
Yes
Yes
—
Note 2
MCP6273
Yes
Yes
Yes
—
Note 2
MCP6275
Yes
Yes
Yes
—
Note 2
MCP6281
Yes
Yes
Yes
—
Note 2
MCP6282
Yes
Yes
Yes
—
Note 2
MCP6283
Yes
Yes
Yes
—
Note 2
MCP6285
Yes
Yes
Yes
—
Note 2
MCP6291
Yes
Yes
Yes
—
Note 2
MCP6292
Yes
Yes
Yes
—
Note 2
MCP6293
Yes
Yes
Yes
—
Note 2
MCP6295
Yes
Yes
Yes
—
Note 2
TC913
—
Yes
—
—
TC1029
Yes
Yes
Yes
—
TC7650
—
Yes
—
—
—
Yes
—
—
TC7652
Note 1:
2:
© 2005 Microchip Technology Inc.
Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet
for recommended value.
Installation of PCB capacitor C1 recommended. See data sheet for recommended
value.
DS51544A-page 31
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
TABLE C-1:
Device
ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY
SOIC
DIP
MSOP
TSSOP
Comment
Programmable Gain Amplifiers (PGAs)
MCP6S21
Yes
Yes
Yes
—
Note 2
MCP6S22
Yes
Yes
Yes
—
Note 2
MCP6S91
Yes
Yes
Yes
—
Note 2
MCP6S92
Yes
Yes
Yes
—
Note 2
Power MOSFET Drivers
TC1410
Yes
Yes
Yes
—
TC1410N
Yes
Yes
Yes
—
TC1411
Yes
Yes
Yes
—
TC1411N
Yes
Yes
Yes
—
TC1426
Yes
Yes
—
—
TC1427
Yes
Yes
—
—
TC1428
Yes
Yes
—
—
TC4403
—
Yes
—
—
TC4426A
Yes
Yes
—
—
TC4427A
Yes
Yes
—
—
TC4428A
Yes
Yes
—
—
TC4426
Yes
Yes
Yes
—
TC4427
Yes
Yes
Yes
—
TC4428
Yes
Yes
Yes
—
TC426
Yes
Yes
—
—
TC427
Yes
Yes
—
—
TC428
Yes
Yes
—
—
TC4404
Yes
Yes
—
—
TC4405
Yes
Yes
—
—
TC1412
Yes
Yes
Yes
—
TC1412N
Yes
Yes
Yes
—
TC1413
Yes
Yes
Yes
—
TC1413N
Yes
Yes
Yes
—
TC4423
—
Yes
—
—
TC4424
—
Yes
—
—
TC4425
—
Yes
—
—
TC429
Yes
Yes
—
—
TC4420
Yes
Yes
—
—
TC4429
Yes
Yes
—
—
TC4421
—
Yes
—
—
TC4422
—
Yes
—
—
TC4626
—
Yes
—
—
TC4627
—
Yes
—
—
TC4431
Yes
Yes
—
—
Yes
Yes
—
—
TC4432
Note 1:
2:
DS51544A-page 32
Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet
for recommended value.
Installation of PCB capacitor C1 recommended. See data sheet for recommended
value.
© 2005 Microchip Technology Inc.
Microchip Analog and Interface Device Compatibility
TABLE C-1:
Device
ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY
SOIC
DIP
MSOP
TSSOP
MCP6541
Yes
Yes
Yes
—
MCP6542
Yes
Yes
Yes
—
MCP6543
Yes
Yes
Yes
—
MCP6546
Yes
Yes
Yes
—
MCP6547
Yes
Yes
Yes
—
Comment
Comparators
MCP6548
Yes
Yes
Yes
—
TC1025
Yes
Yes
Yes
—
TC1028
—
—
Yes
—
TC1031
—
—
Yes
—
TC1040
—
—
Yes
—
TC1041
Yes
—
Yes
—
A/D Converters (ADCs)
MCP3001
Yes
Yes
—
Yes
MCP3002
Yes
Yes
—
Yes
MCP3201
Yes
Yes
—
Yes
MCP3202
Yes
Yes
—
Yes
MCP3301
Yes
Yes
Yes
—
TC3400
Yes
Yes
—
—
D/A Converters (DACs)
MCP4821
Yes
Yes
Yes
—
MCP4822
Yes
Yes
Yes
—
MCP4921
Yes
Yes
Yes
—
TC1320
Yes
—
Yes
—
Yes
—
Yes
—
TC1321
Note 1:
2:
© 2005 Microchip Technology Inc.
Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet
for recommended value.
Installation of PCB capacitor C1 recommended. See data sheet for recommended
value.
DS51544A-page 33
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
TABLE C-1:
Device
ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY
SOIC
DIP
MSOP
TSSOP
Comment
Temperature Sensors
MCP9801
Yes
—
Yes
—
MCP9803
Yes
—
Yes
—
TC72
—
—
Yes
—
TCN75
Yes
—
Yes
—
TC620
Yes
Yes
—
—
TC621
Yes
Yes
—
—
TC622
Yes
Yes
—
—
TC623
Yes
Yes
—
—
TC624
Yes
Yes
—
—
Fan Controllers
TC642
Yes
Yes
Yes
—
TC642B
Yes
Yes
Yes
—
TC646
Yes
Yes
Yes
—
TC646B
Yes
Yes
Yes
—
TC647
Yes
Yes
Yes
—
TC647B
Yes
Yes
Yes
—
TC648
Yes
Yes
Yes
—
TC648B
Yes
Yes
Yes
—
TC649
Yes
Yes
Yes
—
TC649B
Yes
Yes
Yes
—
TC650
—
—
Yes
—
TC651
—
—
Yes
—
TC652
—
—
Yes
—
TC653
—
—
Yes
—
MCP7344
—
—
Yes
—
MCP73827
—
—
Yes
—
MCP73828
—
—
Yes
—
MCP73843
—
—
Yes
—
Yes
Yes
Yes
—
MCP201
Yes
Yes
—
—
MCP2122
Yes
Yes
—
—
Yes
Yes
—
—
Battery Chargers
Integrated Devices
TC1026C
Interface Devices
MCP2551
Note 1:
2:
DS51544A-page 34
Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet
for recommended value.
Installation of PCB capacitor C1 recommended. See data sheet for recommended
value.
© 2005 Microchip Technology Inc.
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USER’S GUIDE
Appendix D. Rev. 1 PCB Errata
D.1
INTRODUCTION
This appendix documents the issues with the Rev 1 PCB. The Rev 2 PCB fixes these
issues.
D.2
REV 1 PCB ISSUES
There are two issues with the Rev 1 PCB. These are:
1. VDD and VSS vias near each pad are No Connects (they should have been
connected to the appropriate power or ground plane). See Figure D-1 shows the
location of these vias that are No Connects. Figure D-3 shows alternate
connections that can be made.
2. The silk-screen on the bottom layer was not processed. This was anly intended
for indicating the circuit of the board. This can be done with a sticky label.
Figure D-2 shows how to determine the PCB revision.
Although these vias were intended to be connected to either the VDD or VSS plane (as indicated), they
are actually no connects. Rev 2 of the board addresses this.
FIGURE D-1:
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber - Top Layer + Silk-Screen.
© 2005 Microchip Technology Inc.
DS51544A-page 35
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
This indicates a Rev 1 PCB
FIGURE D-2:
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Revision Marking
(Gerber – Bottom Layer)
DS51544A-page 36
© 2005 Microchip Technology Inc.
Rev. 1 PCB Errata
Figure D-3 shows how the pad can be connected to either the VDD or VSS plane of the
PCB.
Jumpering to VSS
FIGURE D-3:
© 2005 Microchip Technology Inc.
Jumpering to VDD
Alternate Jumpering the PCB pad to either VSS or VDD.
DS51544A-page 37
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Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
England - Berkshire
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Taiwan - Hsinchu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Qingdao
Tel: 86-532-502-7355
Fax: 86-532-502-7205
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
03/01/05
DS51544A-page 38
© 2005 Microchip Technology Inc.
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