EPF8291SE LF

10/100Base-TX Interface Module
ELECTRONICS INC.
EPF8291SE-LF
Pb
• Robust construction allows for toughest soldering processes
• Guaranteed to operate with 8 mA DC bias
• Complies with or exceeds IEEE 802.3, 10/100Base-TX Standards
• Lead-Free
• Open Type (No-outside winding lead)
• Operating Temperature : -40°C to +85°C
• Wire Insulation Class : MW 83C
• 1500 Vrms Isolation for 1 min. or1800Vrms for 1 sec.
Electrical Parameters @ 25° C
OCL
Insertion
Loss
(dB Max.)
Return Loss
(dB Min.)
100 KHz, 0.1 Vrms
8 mA DC Bias
0.5-100
MHz
0.5-30
MHz
30-45
MHz
45-60
MHz
60-80
MHz
0.5-100
MHz
0.5-100
MHz
Pin16-14/Pin11-9
Xmit/Rcv
Xmit/Rcv
Xmit/Rcv
Xmit/Rcv
Xmit/Rcv
Xmit/Rcv
Xmit/Rcv
350 µH
-1.1/-1.1
-18/-18
-16/-16
-14/-14
-12/-12
-24/-24
-30/-30
•
CMRR
(dB Min.)
Crosstalk
(dB Min.)
Between Channels
DCMR
(dB Min.)
1-100
MHz
-35
Impedance : 100 Ω Xmit / 100 Ω Rcv • Rise Time : 3.0 nS Max. •
Package
Schematic
Transmit Channel
.490
(12.45)
.055
(1.40)
.050
(1.27)
.070
(1.78)
PCA
EPF8291SE-LF
Date Code
.270
(6.86)
.410
(10.41)
Solder
Pad Layout
TD+ 1
16 TX+
CT
15 CT
2
TD- 3
14 TX1CT : 1CT
Pin 1
I.D.
Receive Channel
.030
(.762)
.350
(8.89)
.010/.015
(.254/.381)
.200
(5.08)
RD+ 6
10 CT
CT 7
.008/.012
(.203/.305)
0°-8°
11 RX+
RD- 8
1CT : 1CT
9 RX-
.035
(.889)
.016/.022
(.406/.559)
.050
(1.27)
.380
(9.65)
Notes :
EPF8291SE-LF
1. Lead Finish
Hot Tin Dip (Sn) †
2. Peak Temperature Rating
245°C
3. Moisture Sensitive Levels
MSL = 1
TBD gram
4. Weight
5. Packaging Information
(Tube)
(Tape & Reel)
40 pieces/tube
650 pieces/13” reel
† Lead Material : Ni Barrier over Cu
Unless Otherwise Specified Dimensions are in Inches /mm ± .010 /.25
PCA ELECTRONICS, INC.
16799 SCHOENBORN ST.
NORTH HILLS, CA 91343
Product performance is limited to specified parameters. Data is subject to change without prior notice.
CSF8291SE -LF Rev.-
11/08/2013 HW
TEL: (818) 892-0761
FAX: (818) 894-5791
http://www.pca.com
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