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LXDC2UR series
Micro DC-DC converter
1. Features
2
 Low EMI noise and small footprint (5.75mm ) using inductor-embedded ferrite substrate
 Up to 90% high efficiency using synchronous rectifier technology at 6MHz operation
 PFM/PWM automatic mode switching function for high efficiency operation
over full current range
 PWM forced mode for low ripple noise operation
 Wide input voltage range : 2.7~5.5V
 Maximum Load Current: 600mA.
 Fixed output voltage: 1.2V, 1.5V, 1.8V, 3.0V, 3.3V
 Internal soft start, 120 μs start-up time
 Current over load and thermal shutdown protection
2. Description
The LXDC2UR series is a low power step-down DC-DC converter, which is suitable for a space-limited or a
noise-sensitive application. The device utilizes an inductor-embedded ferrite substrate, and the substrate
eliminates radiated EMI noise and conduction noise efficiently.
By just putting this device, it can be used as a high performance LDO replacement. Its low noise feature and easy
to assembly feature assures reliable power supply quality.
The device works in PFM mode at light load and it extends the battery life by reducing quiescent current. At
heavy load, its control mode changes to PWM mode automatically and it keeps high efficiency using synchronous
rectifying technology. If only heavy load current operation is needed, PWM forced mode is available. In PWM
forced mode, ripple noise is reduced. In shutdown mode, the current consumption is up to 1uA.
3. Typical Application Circuit
LCDC2UR
VBAT
Vin
Vout
Output Voltage
(1.2, 1.5, 1.8, 3.0, 3.3V/
up to 600mA)
Enable
EN
Mode
Operation mode select
GND
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February 2016
LXDC2UR series
Micro DC-DC converter
4. Mechanical details
4-1 Outline
TOP VIEW
BOTTOM VIEW
IC
Capacitor
a
(C0.15)
W
e
L
SIDE VIEW
e
1
2
3
8
9
4
7
6
5
c
b
d
d
c
Substrate
T
Unit: mm
Mark
Dimension
L
2.5 +/- 0.2
W
2.3 +/- 0.2
T
1.2 MAX
a
0.45 +/- 0.1
b
0.35 +/- 0.1
c
0.325 +/- 0.1
d
0.375 +/- 0.1
e
0.25 +/- 0.2
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February 2016
LXDC2UR series
Micro DC-DC converter
4-2. Pin Function
Pin
Symbol
I/O
1
Mode
Input
2,6,9
GND
-
3,4
Vout
Output
5
EN
Description
This is the operation mode select pin. This pin must not be left
floating and must be terminated.
Mode=H: Low-noise mode enabled, fixed frequency PWM
operation is forced.
Mode=L: This device is operating in pulse frequency modulation
mode (PFM) at light load currents, and in regulated frequency
pulse width mode (PWM) at high-load currents.
Ground pin
Input
Regulated voltage output pin.
Apply output load between this pin and GND.
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in shutdown mode.
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be terminated.
EN=H: Device ON,
7,8
Vin
Input
EN=L: Device OFF
Vin pin supplies current to the LXDC2UR internal regulator.
4-3. Functional Block Diagram
EN Mode
Vin
Current
Sense
UVLO
Clock
Soft Start
Switching
Controller
Cin
OCP
EA
Thermal
Shutdown
Embedded L
Gate
Driver
Vout
Cout
Control IC
LXDC2UR
GND
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February 2016
LXDC2UR series
Micro DC-DC converter
5. Ordering Information
Part number
Output Voltage
Device Specific Feature
MOQ
LXDC2UR12A-118
1.2V
Standard Type
T/R, 3000pcs/R
LXDC2UR15A-119
1.5V
Standard Type
T/R, 3000pcs/R
LXDC2UR18A-120
1.8V
Standard Type
T/R, 3000pcs/R
LXDC2UR30A-143
3.0V
Standard Type
T/R, 3000pcs/R
LXDC2UR33A-122
3.3V
Standard Type
T/R, 3000pcs/R
6. Electrical Specification
6-1
Absolute maximum ratings
Parameter
Input voltage
Operating temperature
Operating IC temperature
Storage temperature
symbol
rating
Unit
Vin, EN, Mode
6.3
V
Ta
-40 to +85
o
-40 to +125
o
-40 to +85
o
TIC
TSTO
C
C
C
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February 2016
LXDC2UR series
Micro DC-DC converter
6-2
Electrical characteristics (Ta=25℃)
Parameter
Symbol
Input voltage
Vin
UVLO voltage
UVLO
Input leak current
lin-off
Operating quiescent
current
Iin-on
Condition
Min.
Typ.
Max.
Vout ≦1.8V
2.7
-
5.5
Vout ≧3.0V
3.6
-
5.5
-
2.05
2.1
V
-
0.1
2
uA
-
37
60
Vin=3.6V,
EN=Mode=0V
Vin=EN=3.6V,
Mode=0V
Output voltage
accuracy
Load current range
Vout
Vin-Vout>0.6V
Vrpl
uA
LXDC2UR30A-143
-
60
80
LXDC2UR12A-118
1.176
1.20
1.224
LXDC2UR15A-119
1.47
1.50
1.53
LXDC2UR18A-120
1.764
1.80
1.836
LXDC2UR30A-143
2.94
3.00
3.06
LXDC2UR33A-122
3.234
3.30
3.366
LXDC2UR33A-122
0
Iout=300mA,
Ripple voltage
LXDC2UR15A-119
Iout
Vin=3.6V,
BW=100MHz
V
LXDC2UR12A-118
LXDC2UR18A-120
Vin=EN=5.0V
Mode=0V
Unit
600
V
mA
LXDC2UR12A-118
LXDC2UR15A-119
LXDC2UR18A-120
LXDC2UR30A-143
-
15
mV
Vin=5.0V,
Iout=300mA,
LXDC2UR33A-122
BW=100MHz
Efficiency
EFF
Vin=3.6V,
Iout=300mA
Vin=5.0V,
Iout=300A
LXDC2UR12A-118
82
-
LXDC2UR15A-119
85
-
LXDC2UR18A-120
86
-
LXDC2UR30A-143
93
-
LXDC2UR33A-122
91
-
%
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February 2016
LXDC2UR series
Micro DC-DC converter
Parameter
EN control voltage
Mode control voltage
SW Frequency
Symbol
Condition
VENH
ON; Enable
VENL
OFF; Disable
VMODH
High; PWM forced mode
VMODL
Low; Automatic PFM/PWM mode
Fosc
Iout=300mA, PWM mode
Min.
Typ.
Max.
1.4
-
Vin
0
-
0.4
1.4
-
Vin
0
-
0.4
5.0
6.0
7.0
Unit
V
V
MHz
LXDC2UR12A-118
15
LXDC2UR15A-119
Discharge resistor
Rds
Ω
LXDC2UR18A-120
LXDC2UR30A-143
110
LXDC2UR33A-122
LXDC2UR12A-118
Over current
protection
LXDC2UR15A-119
OCP
900
1200
mA
LXDC2UR18A-120
LXDC2UR30A-143
LXDC2UR33A-122
Start-up time
600
Ton
600
1200
120
1800
μs
(*)The above characteristics are tested using the test circuit on section 8.
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February 2016
LXDC2UR series
Micro DC-DC converter
6-3
Thermal and Current De-rating Information
The following figure shows the power dissipation and temperature rise characteristics example. These data are
measured on Murata’s evaluation board of this device at no air-flow condition.
Loss-ΔT Characteristics (Vin=3.6V, Vo=1.8V)
Io - Loss Characteristics (Vin=3.6V, Vo=1.8V)
35
30
200
25
150
ΔT [℃ ]
Power dissipation [mW]
250
100
20
15
10
50
5
0
0
0
100
200
300
400
500
600
0
Io [mA]
50
100
150
200
250
Power dissipation [mW]
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
o
especially be taken in applications where the device temperature exceeds 85 C.
o
The IC temperature of the device must be kept lower than the maximum rating of 125 C. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and lifetime are also depending on temperature and applied voltage stress. Higher
temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the
Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure
shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in
MLCC capacitor is not reversible but cumulative over time.
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February 2016
LXDC2UR series
Micro DC-DC converter
Capacitor B1 Life(Thousand Hours)
● LXDC2UR12A-118, LXDC2UR15A-119, LXDC2UR18A-120
Capacitor Case temperature(℃)
● LXDC2UR30A-143
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February 2016
LXDC2UR series
Micro DC-DC converter
●LXDC2UR33A-122
Capacitor B1 Life vs Capacitor Case temperature
Capacitor
B1 B1
Life(Thousand
Hours)
Capacitor
Life (Tousand Hours)
100000
Vin=5V
10000
1000
100
10
1
20
40
60
80
100
120
Capacitor
Case temperature(℃)
Temprature (oC )
Capacitor
Case
The following steps should be taken before the design fix of user’s set for a reliable operation.
o
1. The ambient temperature of the device should be kept below 85 C
2. The IC temperature should be measured on the worst condition of each application. The temperature must be
o
kept below 125 C. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be measured on the worst condition of each application. Considering the
above figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
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February 2016
LXDC2UR series
Micro DC-DC converter
7. Detailed Description
Mode selection
The MODE pin allows selecting the operating mode. If the MODE pin is pulled to logic low voltage (VMODL), the
converter operates automatic PFM and PWM mode. In this mode, the converter operates PFM mode at light load
current, and when the load current increase, the operating mode will change to PWM mode automatically. In this
mode, the converter can work in high efficiency over wide load current range. The transition current between PFM
and PWM is depend on Vin, Vout and other factors, but the ballpark threshold is about 70-150mA
If the MODE pin is pulled to logic high voltage (VMODH), the device operates in PWM forced mode. In this mode,
the converter operates in PWM mode even at light load current. The advantage of this mode is that the converter
operates with a fixed frequency that allows simple filtering of switching frequency. In this mode, the efficiency is
lower compared to the PFM mode at light load current.
PFM mode at light load
PWM mode at heavy load
Nominal output voltage
UVLO (Under Voltage Lock Out)
The input voltage (Vin) must reach or exceed the UVLO voltage (2.05Vtyp) before the device begins the start up
sequence even when EN pin is kept high. UVLO function keeps away of an unstable operation at low Vin range
Soft Start
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because
of the function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal
soft-start time is 120 μsec.
Enable
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin
must be terminated to logic high and must not left floating.
Pulling the EN pin to logic low forces the device shutdown. The shutdown quiescent current is 0.1 μA (typ).
Discharge Function
LXDC2UR series can actively discharge the internal output capacitor (Cout) when it turns off. The discharge time
depends on external output capacitance. LXDC2UR series do not need external capacitors, but if you use
external output capacitor its discharge time will become longer.
Over Current Protection
LXDC2UR series integrates a current limit function to protect internal components against heavy load or short
circuits. When over current event is removed, the device returns to the normal operation automatically.
Thermal Shutdown
o
As soon as the internal IC’s junction temperature exceeds 140 C (typ), the device goes into thermal shutdown.
The device returns to its normal operation when the Internal IC’s junction temperature again falls below
o
130 C(typ).
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February 2016
LXDC2UR series
Micro DC-DC converter
8. Test Circuit
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February 2016
LXDC2UR series
Micro DC-DC converter
9.Reliability Tests
No.
1
2
3
Items
Vibration
Resistance
Result
(NG)
18
G
(0)
Frequency : 10~2000 Hz
2
Acceleration : 196 m/s
Direction : X,Y,Z 3 axis
Period
: 2 h on each direction
Total 6 h.
Solder specimens on the testing jig
(glass epoxy boards) shown in
appended Fig.2 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection : 1.6mm
Solder specimens onto test jig shown
below. Apply pushing force at 0.5mm/s
until electrode pads are peeled off or
ceramics are broken. Pushing force is
applied to longitudinal direction.
18
G
(0)
Pushing Direction
18
G
(0)
18
G
(0)
18
G
(0)
Test Methods
Appearance :
No severe damages
Solder specimens on the testing jig
(glass fluorine boards) shown in
appended Fig.1 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
Deflection
Soldering strength
(Push Strength)
QTY
Specifications
9.8 N Minimum
Specimen
4
5
Solderability of
Termination
Resistance to
Soldering Heat
(Reflow)
75%
of
the
terminations is to be
soldered evenly and
continuously.
Appearance
No severe damages
Electrical
specifications
Satisfy
specifications listed
in paragraph 6-2.
Jig
Immerse specimens first an ethanol
solution of rosin, then in a Pb free
solder solution for 3±0.5 sec. at
245±5 °C.
Preheat
: 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
Preheat Temperature : 150-180 °C
Preheat Period
: 90+/-30 sec.
High Temperature
: 220 °C
High Temp. Period
: 20sec.
Peak Temperature
: 260+5/-0 °C
Specimens are soldered twice with
the above condition, and then kept in
room condition for 24 h before
measurements.
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February 2016
LXDC2UR series
Micro DC-DC converter
No.
6
7
8
9
Items
Specifications
Test Methods
High Temp.
Exposure
Temperature:85±2 ℃
Period:1000+48/-0 h
Room Condition:2~24h
Temperature
Cycle
Condition:100 cycles in the following
table
Humidity
(Steady State)
Appearance
No severe damages
Electrical
specifications
Satisfy
specifications listed
in paragraph 6-2.
Low Temp.
Exposure
Step
Temp(°C)
Time(min)
1
Min.
Operating
Temp.+0/-3
30±3
2
Max.
Operating
Temp.+3/-0
30±3
Temperature:85±2 ℃
Humidity:80~90%RH
Period:1000+48/-0 h
Room Condition:2~24h
Temperature:-40±2 ℃
Period:1000+48/-0 h
Room Condition:2~24h
QTY
Result
(NG)
18
G
(0)
18
G
(0)
18
G
(0)
18
G
(0)
10
ESD(Machine
Model)
C:200pF、R:0Ω
TEST Voltage :+/-100V
Number of electric discharges:1
5
G
(0)
ESD(Human
Body Model)
C:100pF、R:1500Ω
TEST Voltage :+/-1000V
Number of electric discharges:1
5
G
(0)
11
13
February 2016
LXDC2UR series
Micro DC-DC converter
Fig.1
Land Pattern
(C0.15)
a
b
3
2
1
4
9
8
5
6
7
c
d
d
c
Unit: mm
Mark
Dimension
a
0.45
b
0.35
c
0.325
d
0.375
・Reference purpose only.
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February 2016
LXDC2UR series
Micro DC-DC converter
Fig.2
Testing board
100
Unit:mm
40
■: Land pattern is same as figure1
Glass-fluorine board t=1.6mm
Copper thickness over 35 mm
Mounted situation
Unit:mm
チップ
Device
45
45
Test method
Unit:mm
20
50
R230
deflection
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February 2016
LXDC2UR series
Micro DC-DC converter
10. Measurement Data
Micro DC-DC Converter evaluation board (P2LX0006A)
Measurement setup
The enable switch has three states (ON, OFF and Open).
1. When it is toggled to “ON” side, the device starts operation.
2. When it is toggled to “OFF” side, the device stop operation and keep shut down status.
3. When it is set to open, the EN pin floats and an external voltage can be applied to the EN terminal pin on the
EVB. If you don’t apply an external voltage to EN pin, the enable switch should not to be set to the middle
position.
The mode switch has three states (PWM, PFM/PWM and Open).
1. When it is toggled to “PWM” side, the device operates PWM forced mode.
2. When it is toggled to “PFM/PWM” side, the device operates PFM/PWM automatic mode.
3. When it is set to open, the mode pin floats and an external voltage can be applied to the Mode terminal pin on
the EVB. If you don’t apply an external voltage to Mode pin, the mode switch should not to be set to the
middle position.
※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables.
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February 2016
LXDC2UR series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
(Ta=25℃)
Efficiency
・Vin=3.6V, Vout=1.5V
90
90
85
85
80
80
EFF [%]
EFF [%]
・Vin=3.6V, Vout=1.2V
75
75
70
70
65
65
60
60
1
10
100
1
1,000
10
・Vin=3.6V, Vout=1.8V
1,000
100
1000
・Vin=3.6V, Vout=3.0V
100
90
95
85
90
EFF [%]
80
EFF [%]
100
Iout [mA]
Iout [mA]
75
70
85
80
75
70
65
65
60
60
1
10
100
1
1,000
10
Iout [mA]
Iout [mA]
・Vin=5.0V, Vout=3.3V
100
95
EFF [%]
90
85
80
75
70
65
60
1
10
100
1,000
Iout [mA]
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February 2016
LXDC2UR series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
(Ta=25℃)
Load Regulation
・Vin=3.6V, Vout=1.5V
1.224
1.530
1.212
1.515
Vout [V]
Vout [V]
・Vin=3.6V, Vout=1.2V
1.200
1.500
1.485
1.188
1.470
1.176
0
100
200
300
400
500
600
0
100
200
Iout [mA]
・Vin=3.6V, Vout=1.8V
400
500
600
400
500
600
・Vin=3.6V, Vout=3.0V
1.836
3.06
1.818
3.03
Vout [V]
Vout [V]
300
Iout [mA]
1.800
3
2.97
1.782
2.94
1.764
0
100
200
300
400
500
0
600
100
200
300
Iout [mA]
Iout [mA]
・Vin=5.0V, Vout=3.3V
3.366
Vout [V]
3.333
3.300
3.267
3.234
0
100
200
300
400
500
600
Iout [mA]
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February 2016
LXDC2UR series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
(Ta=25℃)
Output Ripple-Noise
・Vin=3.6V, Vout=1.5V, BW : 150MHz
60
60
50
50
40
40
Vrpl [mVpp]
Vrpl [mVpp]
・Vin=3.6V, Vout=1.2V , BW : 150MHz
30
20
30
20
10
10
0
0
0
100
200
300
400
500
0
600
100
200
・Vin=3.6V, Vout=1.8V, BW : 150MHz
400
500
600
500
600
・Vin=3.6V, Vout=3.0V, BW : 150MHz
60
60
50
50
40
40
Vrpl [mVpp]
Vrpl [mVpp]
300
Iout [mA]
Iout [mA]
30
20
30
20
10
10
0
0
0
100
200
300
400
500
0
600
100
200
300
400
Iout [mA]
Iout [mA]
・Vin=5.0V, Vout=3.3V, BW : 150MHz
60
Vrpl [mVpp]
50
40
30
20
10
0
0
100
200
300
400
500
600
Iout [mA]
19
February 2016
LXDC2UR series
Micro DC-DC converter
Typical Measurement Data (reference purpose only)
(Ta=25℃)
Load Transient Response
・Vin=3.6V, Vout=1.2V, Mode : PFM/PWM
20mV/div
20mV
-20mV
ΔIo=600mA
・Vin=3.6V, Vout=1.2V, Mode : PWM forced
20mV/div
5mV
-20mV
ΔIo=600mA
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February 2016
LXDC2UR series
Micro DC-DC converter
11. Tape and Reel Packing
1)Dimensions of Tape (Plastic tape)
Unit: mm
Feeding direction
2) Dimensions of Reel
Unit: mm
2±0.5
Φ60
Φ13±0.2
Φ180
(9.0)
13.0±1.4
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February 2016
LXDC2UR series
Micro DC-DC converter
3)Taping Diagrams
[1] Feeding Hole
:
As specified in (1)
[2] Hole for chip
:
As specified in (1)
[3] Cover tape
:
50um in thickness
[4] Base tape
:
As specified in (1)
[3]
[1]
[2]
[3]
[4]
Feeding Hole
Feeding Direction
Chip
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February 2016
LXDC2UR series
Micro DC-DC converter
4)Leader and Tail tape
A
B
Components
部品収納部
Symbol
C
Items
Ratings(mm)
A
No components at trailer
min 160
B
No components at leader
min 100
C
Whole leader
min 400
5)The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
6)Packaging unit: 3,000 pcs./ reel
7) Material: Base Tape
Reel
… Plastic
… Plastic
Antistatic coating for both base tape and reel
8)Peeling of force
0.7 N max.
0.1~1.0N
165 to 180 °
Cover
Tape
カバーテープ
ベーステープ
Base
Tape
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February 2016
LXDC2UR series
Micro DC-DC converter
NOTICE
1. Storage Conditions:
To avoid damaging the solderability of the external electrodes, be sure to observe the following points.
- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.
(Packing materials, In particular, may be deformed at the temperature over 40 °C.).
- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).
- Stored products should be used within 6 months of receipt. Solderability should be verified if this period
is exceeded
This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020).
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare ear hands. Doing so that may result in poor
solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions are shown for a reference puerpose only.
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.
When using underfill materials, be sure to check the mechanical characteristics in the actual set.
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Micro DC-DC converter
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully perform preheating :△T less than 130 °C.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent
products from damage. Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions (example)
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
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Micro DC-DC converter
5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment.
- Direct sunlight
- Water splashing place.
- Humid place where water condenses.
- In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
If static electricity is added to this product, degradation and destruction may be produced.
Please use it after consideration enough so that neither static electricity nor excess voltage is added at the
time of an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe
measures must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure
7. Input Voltage and Output Current limitation:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity range
won’t be achieved.
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LXDC2UR series
Micro DC-DC converter
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring
extremely high reliability following the application listed below, you should consult with the Murata staff in
advance.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
- Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option
and dealer-installed option.
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
! Note:
Please make sure that your product has been evaluated and confirmed against your specifications when
our product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance
notice.
This catalog is for reference only and not an official product specification document, therefore, please
review and approve our official product specification before ordering this product.
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February 2016