SMP4050-12UTG N1737 REV.-

SMP4050-12UTG
Technical Data
Data Sheet N1737 Rev.-
Green Products
Description
The SMP4050 integrates low capacitance diodes with an additional zener diode to protect each I/O pin against
ESD and high surge events. This robust device can safely absorb up to 20A per IEC61000-4-5 (tp=8/20μs) without
performance degradation and a minimum ±30kV ESD per IEC61000-4-2 International Standard. Their low loading
capacitance also makes them ideal for protecting high speed signal pins.
Features
•
•
•
ESD protection in accordance with:
IEC 61000-4-2 (ESD) ±30kV (air), ±30kV (contact)
IEC 61000-4-5 (lightning) 20A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Low capacitance: 4.4pF typical per I/O
Low leakage current of 1μA (MAX) at 2.5V
Applications
•
•
•
•
•
LCD/PDP TVs
Desktops
Game Consoles
Set Top Boxes
Notebooks
Pinout
Functional Block Diagram
Note: Pinout diagrams above shown as device footprint on circuit board.
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SMP4050-12UTG
Technical Data
Data Sheet N1737 Rev.-
Green Products
Ordering Information:
Device
SMP4050-12UTG
Package
Min. Order
Qty.
μDFN-12
(Pb-Free)
3000
Absolute Maximum Ratings:
Parameter
Symbol
Value
Unit
Peak Pulse Current (tp=8/20μs)
IPP
20
A
Peak Pulse Power (tp=8/20μs)
PPK
300
W
Operating Junction Temperature
Range
TOP
-40 to + 85
°C
TSTOR
-50 to + 150
°C
Value
Unit
-65 to + 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature(Soldering 10s)
260
°C
Storage Temperature Range
Thermal Information:
Parameter
Storage Temperature Range
Electrical Characteristics: (TOP=25°C)
Characteristics
Reverse Stand-Off Voltage
Snap Back Voltage
Reverse Leakage Current
Clamping Voltage1
Symbol
VRWM
VSB
ILEAK
VC
ESD With stand Voltage1
Junction Capacitance1
Junction Capacitance1
VESD
CI/O-GND
CI/O-I/O
Condition
ISB=50mA
VR = 2.5V, I/O to ground
IPP = 1A, tp=8/20μs, Fwd
IPP = 10A, tp=8/20μs, Fwd
IPP = 20A, tp=8/20μs, Fwd
IEC61000-4-2 (Contact)
IEC61000-4-2 (Air)
VR = 0V, fSIG = 1MHz
VR = 0V, fSIG = 1MHz
Min.
2.0
±30
±30
-
Typ.
0.5
4.5
8.9
13.2
4.5
2.2
Note: 1. Parameter is guaranteed by design and/or device characterization.
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Max.
2.5
1.0
5.0
-
Units
V
V
μA
V
V
V
kV
kV
pF
pF
SMP4050-12UTG
Technical Data
Data Sheet N1737 Rev.-
Marking Diagram
Green Products
Part Name Information
SMP 4050 – 12 U T G
G= Green
PH12
T= Tape & Reel
Where PH12 is SMP4050-12UTG
PH12
= Part Name
Package
U = μDFN-12
Number of Channels
Series
Silicon Protection Array
Pulse Waveform
Insertion Loss (S21) I/O to GND
Clamping Voltage vs. IPP
Capacitance vs. Bias
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SMP4050-12UTG
Technical Data
Data Sheet N1737 Rev.-
Green Products
Mechanical Dimensions (In mm/Inches):
Symbol
A
A1
A2
b
b1
D
D2
E
e
e1
e2
L
L1
L2
μDFN-12
Millimeters
Inches
Min
Max
Min
Max
0.50
0.65
0.020
0.026
0.00
0.05
0.00
0.002
0.150 REF
0.006REF
0.15
0.25
0.006
0.010
0.10
0.30
0.004
0.012
3.40
3.60
0.134
0.142
2.70
0.106
2.40
2.60
0.095
0.103
0.50 BSC
0.020 BSC
0.60 BSC
0.024 BSC
1.10 BSC
0.044 BSC
0.30
0.40
0.012
0.016
0.90
1.10
0.036
0.044
0.70
0.90
0.028
0.036
Embossed Carrier Tape & Reel Specification μDFN-12
Symbol
Millimeters
Inches
Min
Max
Min
Max
A0
2.63
2.83
0.104
0.112
B0
3.63
3.83
0.143
0.151
D0
1.40
1.60
0.055
0.063
E
1.65
1.85
0.065
0.073
F
5.45
5.55
0.215
0.219
K0
0.85
1.05
0.033
0.041
P0
3.90
4.10
0.154
0.161
P1
3.90
4.10
0.154
0.161
P2
1.95
2.05
0.077
0.081
T
0.18
0.22
0.007
0.009
W
11.90
12.30
0.469
0.484
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SMP4050-12UTG
Technical Data
Data Sheet N1737 Rev.-
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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