MMBZ5221-5259B N0204 REV.A

MMBZ5221B-MMBZ5259B
Technical Data
Data Sheet N0204, Rev. A
Green Products
MMBZ5221B-MMBZ5259B ZENER DIODES
Features:
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Planar Die Construction
410mW Power Dissipation
General Purpose, Medium Current
Ideally Suited for Automated Assembly Processes
This is a Pb − Free Device
All SMC Parts are Traceable to the Wafer Lot
Additional testing can be offered upon request
Mechanical Data:
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Case: SOT-23, Molded Plastic
Terminals: Solder Leads Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Weight: 0.008 grams(approx.)
Mechanical Dimensions: In Inches/mm
SOT-23
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MMBZ5221B-MMBZ5259B
Technical Data
Data Sheet N0204, Rev. A
Green Products
Ordering Information:
Device
Package
SOT-23
(Pb-Free)
MMBZ5221B-MMBZ5259B
Shipping
3000pcs / reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification.
Maximum Ratings @TA=25°C unless otherwise specified
Parameter
Power Dissipation (Note 1)
Forward Voltage
@ IF = 10mA
Typical Thermal resistance junction to
Ambient Air (Note 1)
Operating Junction and Storage
Temperature Range
Symbol
Value
Unit
PD
410
mW
VF
1.0
V
RθJA
357
°C/W
TJ,TSTG
-55 to 150
°C
Notes: 1. Valid provided that device terminals are kept at ambient temperature.
2. Tested with pulses, Tp≤1.0ms.
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MMBZ5221B-MMBZ5259B
Technical Data
Data Sheet N0204, Rev. A
Green Products
• China - Germany - Korea - Singapore - United States •
• http://www.smc-diodes.com - sales@ smc-diodes.com •
MMBZ5221B-MMBZ5259B
Technical Data
Data Sheet N0204, Rev. A
Green Products
• China - Germany - Korea - Singapore - United States •
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MMBZ5221B-MMBZ5259B
Technical Data
Data Sheet N0204, Rev. A
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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