BZV55C SERIES N0200 REV.A

BZV55C-SERIES
Green Products
Technical Data
Data Sheet N0200, Rev. A
BZV55C/ZMM55C-SERIES
ZENER DIODES
Zener Voltage: 2.4-180V Peak Pulse Power: 500mW
Features:
•
•
•
•
Low zener impedance
Low regulation factor
Glass passivated junction
High temperature soldering guaranteed: 260°C/10S at terminals
Mechanical Data:
•
•
•
•
Case: MINI MELF/DL-35 molded glass body
Terminals: Plated leads, solderable per MIL-STD 750, method 2026
Polarity: Color band denotes cathode end Mounting
Position: Any Weight: 0.002 ounce, 0.05 gram
Mechanical Dimensions: In mm/Inches
MINI MELF/DL-35
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BZV55C-SERIES
Green Products
Technical Data
Data Sheet N0200, Rev. A
Ordering Information:
Device
BZV55C/ZMM55C-SERIES
Package
MELF/ DL-35
(Pb-Free)
Shipping
2500pcs / reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification.
Maximum Ratings @TA=25°C unless otherwise specified
Parameter
Symbol
Value
Unit
Power Dissipation at Tamb=25°C(Note1)
PD
500
mW
Operating Junction Temperature
TJ
200
°C
Storage Temperature Range
TSTG
-65 to 200
°C
Typical Thermal resistance junction to
Ambient(Note 1)
RθJA
0.3
K/mW
VF
1.0
V
Zener Current see Table Characteristics
Forward Voltage
@ IF = 100mA
Notes: 1. Valid provided that device terminals are kept at ambient temperature.
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BZV55C-SERIES
Technical Data
Data Sheet N0200, Rev. A
Green Products
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BZV55C-SERIES
Technical Data
Data Sheet N0200, Rev. A
Green Products
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BZV55C-SERIES
Technical Data
Data Sheet N0200, Rev. A
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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