INTERSIL ISL9491AERZ

ISL9491, ISL9491A
Features
These devices are designed for supplying power and
control signals from advanced satellite set-top box (STB)
modules to the low noise blocks (LNBs) of single antenna
ports. Each device consists of a current-mode boost
converter and a low-noise linear regulator along with the
circuitry required for tone injection and pin controllable
interface. The device makes the total LNB supply design
simple, efficient and compact with low external
component count.
• Single Chip Power Solution
- Operation for 1-Tuner/1-Dish Applications
• FAULT Signal
• DIRECTV SWM Compliant
• VSET Pin to Toggle between Vertical and Horizontal
Polarizations
• External Tone Input
• Internal Overcurrent and Over-Temperature
Protection
• Pb-Free (ROHs Compliant)
Applications
• LNB Power Supply and Control for Satellite Set-Top
Box
Pin Configuration
Ordering Information
FAULT
VCC
1
12 ILIMIT
PKG.
DWG. #
CS
2
11 TCAP
PGND
3
10 VSET1
-20 to +85 16 Ld QFN
L16.4x4
GATE
4
-20 to +85 16 Ld QFN
L16.4x4
PACKAGE
(Pb-free)
*Add “-T” suffix for tape and reel. Please refer to TB347 for
details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3
termination finish, which is RoHS compliant and compatible with
both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures
that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
October 13, 2009
FN6531.0
13
1
9
5
6
7
8
SGND
ISL9491AERZ* 94 91AERZ
14
VSENSE
94 91ERZ
TEMP.
RANGE
(°C)
15
VOUT
ISL9491ERZ*
PART
MARKING
16
BYPASS
PART
NUMBER
(Note)
VSW
ISL9491, ISL9491A
(16 LD QFN)
TOP VIEW
The external modulation input (EXTM) can accept a tone
modulated DiSEqC command and transfer it
symmetrically to the output to meet DiSEqC 1.x protocol.
An external DiSEqC tank circuit can also be implemented
to support DiSEqC 2.x.
EN
The final regulated output voltage is available at the
cathode of the back diode to support the operation of an
antenna port for a single tuner. The outputs can be set to
various voltage level for the desired polarization
reception by means of the logic presented to the VSET0
and VSET1 pins. An EN pin is to be driven high to enable
the outputs for the PWM and linear combination; setting
EN low disables the output, forcing a shutdown mode.
• 2.5V/3.3V/5V Logic Compatible
EXTM
The current-mode boost converters provide the linear
regulator with input voltage that is set to the voltage at
the VOUT pin plus a minimal drop to insure minimum
power dissipation across the internal LDO. This maintains
constant voltage drop across the linear pass element
while permitting adequate voltage range for tone
injection.
• Switch-Mode Power Converter for Lowest Dissipation
- Boost PWMs with >92% Efficiency
- Pin Controllable Enable and Output
VSET0
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2009. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL9491, ISL9491A
Single Output LNB Supply Voltage Regulator for
Satellite Set-Top Box Applications
ISL9491, ISL9491A
Functional Pin Description
SYMBOL
FUNCTION
VSW
Input of the linear post-regulator.
PGND
Dedicated ground for the output gate driver of respective PWM.
CS
Current sense input; connect the sense resistor RSC at this pin for desired peak overcurrent value for the boost
FET.
SGND
Small signal ground for the IC.
TCAP
Capacitor for setting rise and fall time of the output voltage. Typical value is 0.1µF.
BYPASS
Connect a bypass capacitor of 1µF for the internal 5V.
VCC
Main power supply to the chip.
GATE
This pin connects to the Gate of the Boost FET.
VOUT
Output voltage for the LNB meant to be connected to the anode of a back diode in series with the LNB output.
VSENSE
EXTM
VSET0,
VSET1
This pin provides for a sensing and pull-down function for the VLNB and is meant to be connected to the cathode
of the back diode.
This is an input for externally modulated DiSEqC tone signal, which is transferred symmetrically onto VLNB.
Output voltage selection pins.
EN
When this pin is low, the output is disabled in a low power standby state. Setting EN = 1 enables the output
voltage.
FAULT
This an open drain output to be pulled up to the logic high through a resistor. A low indicates that the output
voltage is out of regulation.
ILIMIT
The ILIMIT is used to set the value of the output current limit from the linear. A resistor from ILIMIT to GND
programs this limit.
2
FN6531.0
October 13, 2009
ISL9491, ISL9491A
Block Diagram
4
S
EN
VSET0
VSET1
DCL
PWM
LOGIC
GATE
Q
3
OLF
OVERCURRENT
PROTECTION
LOGIC SCHEME 1
COUNTER
15
9
10
OC1
CLK1
OSCILLATOR
PGND
THERMAL
SHUTDOWN
OTF
-
CS
+
2
ILIM1
CS
AMP
∑
SLOPE
COMPENSATION
BAND GAP
REF VOLTAGE
+
BGV
-
REF
VOLTAGE
ADJ1
VREF1
8
VSENSE
VCC
SGND
U AND L
FET
DRIVE
TONE
SHAPE/INJ
CKT
+
-
ON CHIP
LDO
UVLO
POR
SOFT-START
INT 5V
SOFT-START
EN
5
13
3
11
EXTM
1
VREF2
TCAP
7
12
VOUT
FAULT
6
VSW
BYPASS
14
ILIMIT
16
FN6531.0
October 13, 2009
Typical Application Schematic QFN
VIN
2
+
C36
56µF
RTN
0
L8
10µH
0
R16
0.100Ω
0
FAULT 13
14
VSET1
VSET0
SGND
8
VSENSE
0
R22
D12
B230A
C39
1µF
D11
B230A
DISEqC
FET On
0
VBYPASS
C34
100pF
VSW
15
5
R17
470Ω
7
1
2
3
6
5
4
0
R20 10kΩ
15Ω
L2
VLNB
220µH
C41
0.1µF
R19
3.3kΩ
C42
0.1µF
D10
1.5SMC22A
RTN
0
NOTES:
1. The output voltage level for the desired polarization reception can be selected by means of the logic presented to VSET0 and
VSET1 pins.
ISL9491, ISL9491A
TPC6002
Q1
R18
18Ω
VCC
FAULT
3.3/5V
R21 91.1kΩ
12
ILIMIT
C40
R23
U1
0.22µF
11
2
CS
TCAP
ISL9491ER, or
10KΩ
ISL9491AER
10
3
PGND
VSET1
9
4
VSET0
GATE
1
0
EN
C37
1µF
VOUT
0
6
4
0
EN
16
D9
B230A
C31
10µF
EXTM
1
EXTM
C35
100µF
BYPASS
+
FN6531.0
October 13, 2009
ISL9491, ISL9491A
Absolute Maximum Ratings
VCC (Input Voltage) . . . . . . . . .
VOUT, VSW . . . . . . . . . . . . . . . .
BYPASS . . . . . . . . . . . . . . . . . . .
EN, VSET0/1, EXTM (Logic Control
All Pins Referenced to Ground
Thermal Information
....
....
....
Pins)
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
8.0V to 18.0V
-0.3V to 24V
-0.3V to 5.5V
-0.3V to 5.5V
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
QFN Package (Notes 2, 3) . . . . . . .
47
9.5
Maximum Junction Temperature (Note 4) . . . . . . . +150°C
Maximum Storage Temperature Range . . . -40°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature. . . . . . . . . . . . . . . . . . . . . . . -20°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
3. For θJC, the "case temp" location is the center of the exposed metal pad on the package underside.
4. The device junction temperature should be kept below +150°C. Thermal shut-down circuitry turns off the device if junction
temperature exceeds +130°C typical.
Electrical Specifications
PARAMETER
VCC = 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at
TA = +25°C.
SYMBOL
MIN
TYP
MAX
UNITS
ISL9491
8
12
14
V
ISL9491A
8
10
11
V
EN = 1, Boost disconnected, and ext. 14.5V
supply on VSW when VOUT = 13.3V,
No Load
-
4
8
mA
Stop Threshold
Input voltage falling from above 8V
-
4.4
-
V
Start Threshold
Input voltage rising from 0V
-
4.9
-
V
EN = 1, VSET1 = 0, VSET0 = 0
12.8
13.3
13.6
V
EN = 1, VSET1 = 0, VSET0 = 1
17.7
18.3
18.7
V
EN = 1, VSET1 = 1, VSET0 = 0
13.8
14.3
14.6
V
EN = 1, VSET1 = 1, VSET0 = 1
19.4
20.0
20.4
V
EN = 1, VSET1 = 0, VSET0 = 0
10.5
11.0
11.3
V
EN = 1, VSET1 = 0, VSET0 = 1
14.5
15.0
15.3
V
EN = 1, VSET1 = 1, VSET0 = 0
11.5
12.0
12.3
V
EN = 1, VSET1 = 1, VSET0 = 1
15.5
16.0
16.3
V
DVO1,
DVO2
VIN = 8V to 14V; VO = 13.30V
-
4
40
mV
VIN = 8V to 14V; VO = 18.30V
-
4
60
mV
DVO1,
DVO2
IO = 0mA to 350mA, VOUT = 13.3V
-
125
180
mV
IO = 0mA to 500mA, VOUT = 13.3V
(Note 4)
-
190
260
mV
270
350
435
mA
860
mA
Operating Supply Voltage Range
Supply Current (Ivcc current)
IIN
TEST CONDITIONS
UNDERVOLTAGE LOCKOUT
Output Voltage, ISL9491
VO
Output Voltage, ISL9491A
VO
Line Regulation
Load Regulation
Output Overcurrent Threshold
IOCT
Internal Regulator Overcurrent
Clamp
IOCLMP
5
R at ILIMIT = 148k (Note 8)
Output Shorted to GND, RILIM = 0
FN6531.0
October 13, 2009
ISL9491, ISL9491A
Electrical Specifications
PARAMETER
VCC = 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at
TA = +25°C. (Continued)
SYMBOL
Dynamic Overload Protection
Off-Time
tOFF
Dynamic Overload Protection
On-Time
tON
TEST CONDITIONS
Output Shorted to GND (Note 6)
MIN
TYP
MAX
UNITS
-
900
-
ms
-
50
-
ms
TCAP Charging Current
TCAPC
TCAP Pin = 0V
-
22
-
µA
TCAP Discharging Current
TCAPD
TCAP Pin = 2V
-
21
-
µA
IOUT = 500mA, with a Schottky b/w Vsw
and VOUT (Note 4)
-
1.2
1.4
V
EN = 0; VOBK = 24V (Note 9)
-
2.0
3.0
mA
LINEAR REGULATOR
Drop-out Voltage
Output Backward Leakage Current
IBKLK
Output Undervoltage
(After Initial Power-up )
FAULT asserted for typical VOUT = 13.3V
-12
-
-1
%
Output Overvoltage
(After Initial Power-up)
FAULT asserted for typical VOUT = 13.3V
+1
-
+12
%
Asserted LOW
-
-
0.8
V
Asserted HIGH
2.5
-
-
V
Input Current
-
25
-
µA
EN, VSET, EXTM INPUT PINS (Note 5)
Tone Input Frequency
VOUT Tone Amplitude
VOUT Tone Rise (Note 10)
ISL9491
EXTM input
22
kHz
ISL9491A
EXTM input
44
kHz
ISL9491
EXTM input = 22kHz square wave
Vmax = 2.5V, Vmin = 0V, Duty = 50%,
400
650
900
mV
ISL9491A
EXTM input = 44kHz square wave
Vmax = 2.5V, Vmin = 0V, Duty = 50%
400
650
900
mV
ISL9491
EXTM input = 22kHz square wave
VHmax = 2.5V, VLmin = 0V, RL = 1k
5
10
15
µs
ISL9491A
EXTM input = 44kHz square wave
VHmax = 2.5V, VLmin = 0V, RL = 1k
4
6
8
µs
ISL9491
EXTM input = 22kHz square wave
VHmax = 2.5V, VLmin = 0V, Duty = 50%,
RL = 1k
5
10
15
µs
ISL9491A
EXTM input = 44kHz square wave
VHmax = 2.5V, VLmin = 0V, Duty = 50%,
RL = 1k
4
6
8
µs
380
445
510
mV
-
5
-
V
Maximum Duty Cycle
90
93
-
%
Minimum Pulse Width
-
20
-
ns
VOUT Tone Fall (Note 10)
CURRENT SENSE (CS PIN)
Overcurrent Threshold
VCS
BYPASS
Voltage at BYPASS pin
VBYPASS
(Note 7)
PWM
6
FN6531.0
October 13, 2009
ISL9491, ISL9491A
Electrical Specifications
PARAMETER
VCC = 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at
TA = +25°C. (Continued)
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
380
440
480
kHz
OSCILLATOR
Oscillator Frequency
Boost switching frequency
fsw
Thermal Shutdown
Temperature Shutdown Threshold
(Note 4)
-
130
-
°C
Temperature Shutdown Hysteresis
(Note 4)
-
20
-
°C
5. VSET, EXTM, EN pins have 200kΩ internal pull-down resistors.
6. In the Dynamic current limit mode, the output is ON for 50ms and OFF for 900ms but it remains continuously ON when
RILIM=0.
7. This pin is to connect a bypass capacitor in order to decouple the internal LDO and is not designed to source external circuits.
8. The value of the RLIMIT resistor will determine the overcurrent threshold at which the 50ms timer is activated.
9. This defines the back voltage applicable to the VSENSE pin. The VOUT pin will not support back bias and hence will need the
use of a back diode for protection.
Tone Waveform
EXTM
PIN
VOUT
PIN
22kHz
22kHz
EXTERNAL TONE
tr = 5/10µs TYPICAL
RETURNS TO NOMINAL VOUT ~1.5 PERIOD
AFTER THE LAST EXTM RISING EDGE
t_ISL9491~68µs / t_ISL9491A)~34µs
NOTES:
10. The tone rise and fall times are not shown due to resolution of graphics. It is 5/10µs typical.
11. The EXTM pins have input thresholds of Vil(max) = 0.8V and Vih(min) = 2.5V
FIGURE 1. TONE WAVEFORM
100
100
80
80
EFFICIENCY (%)
EFFICIENCY (%)
Typical Performance Curves
60
40
40
20
20
00
60
0.1
0.2
0.3
0.4
ILOAD (A)
0.5
0.6
FIGURE 2. BOOST EFFICIENCY FOR 12VIN TO
14.3VOUT
7
0.7
0
0
0.1
0.2
0.3
0.4
0.5
0.6
ILOAD (A)
FIGURE 3. SYSTEM EFFICIENCY (BOOST + LDO) FOR
12VIN TO 13.3VOUT
FN6531.0
October 13, 2009
ISL9491, ISL9491A
Typical Performance Curves (Continued)
FIGURE 4. VLNB RISE TIME WITH TCAP = 0.22µF is
13ms
FIGURE 5. VLNB RISE TIME WITH TCAP = 0.44µF is
32ms
FIGURE 6. BOOST SWITCH NODE AT 0A
(DISCONTINUOUS)
FIGURE 7. BOOST SWITCH NODE AT 100mA
(PARTIAL CONTINUOUS)
FIGURE 8. BOOST SWITCH NODE AT 300mA
(CONTINUOUS MODE)
FIGURE 9. VLBNB TRANSITIONS FROM 13.3V TO
18.3V
8
FN6531.0
October 13, 2009
ISL9491, ISL9491A
Typical Performance Curves (Continued)
FIGURE 10. VLNB TRANSITIONS FROM 18.3V TO
13.3V
FIGURE 11. 22kHz TONE ON 13.3VOUT WITH 50mA
LOAD
FIGURE 12. 22kHz TONE ON 13.3VOUT WITH 500mA
LOAD
FIGURE 13. AC NOISE ON 13.3VOUT AT 500mA OF
LOAD
LOAD CURRENT
VLNB
OUTPUT CURRENT
OUTPUT VOLTAGE
FIGURE 14. VLNB CONNECTED TO 350mA LOAD
WITH RILIM = 148k
9
FIGURE 15. VLNB SHORTED TO GND, 200mA2
FN6531.0
October 13, 2009
ISL9491, ISL9491A
Typical Performance Curves (Continued)
OUTPUT CURRENT
OUTPUT VOLTAGE
FIGURE 16. OUTPUT CURRENT AND VOLTAGE WITH
OUTPUT SHORTED TO GND, RILIM = 0
FIGURE 17. THE ISL9491 ENTERING THERMAL
SHUTDOWN WITH RILIM = 0
FIGURE 18. THE ISL9491 IN THERMAL EQUILIBRIUM WITH RILIM = 0
\
10
FN6531.0
October 13, 2009
ISL9491, ISL9491A
The ISL9491 or ISL9491A single output voltage regulator
makes an ideal choice for advanced satellite set-top box
and personal video recorder applications. The device
utilizes built-in DC/DC step-up converters, which operate
from a single supply source ranging from 8V to 14V and
generate the voltage needed to enable the linear
post-regulator to work with minimum dissipated power.
An undervoltage lockout circuit disables the device when
VCC drops below a fixed threshold (4.5V typical).
DiSEqC Encoding
The EXTM accepts an externally modulated tone
command and in turn modulates the VLNB symmetrically
to meet the DiSEqC 1.0 and DiSEqC 2.0 transmit
protocol. Burst coding of the tone can be accomplished
due to the fast response of the EXTM pin.
Linear Regulator
The output linear regulator is designed to source 500mA
continuous current and 750mA peak. The sink feature is
limited and thus requires a bleeder resistor of 3.3kΩ to
be connected at the VLNB to enable proper tone
modulation capability into capacitive loads as high as
0.22µF. In order to minimize the power dissipation, the
output voltage of the internal step-up converter is
adjusted to allow the linear regulator to work at a
minimum dropout of 1.2V typical (Load current =
500mA) between the VSW and VOUT pin. The VOUT pin
drives the anode of the back diode and the VSENSE pin
drives the cathode of the back diode. The VSENSE pin is
capable of withstanding a back voltage of 24V.
When the device is put in the shutdown mode
(EN = LOW), the PWM power block is disabled. When the
regulator blocks are active (EN = HIGH), the output can
be controlled by the VSET0 and VSET1 pins to be 13.3V,
14.3V, 18.3V or 20V (typical ISL9491) or 11V, 12V, 15V,
or 16V (typical ISL9491A) for remote controlling of nonDiSEqC LNBs.
A separate open-drain FAULT pin serves as an interrupt
and is driven low by undervoltage, overvoltage and linear
overcurrent and over-temperature faults.
Output Voltage Rise and Fall TimeTiming
The output voltage rise and fall times or soft-start time
can be set by an the external capacitor on the TCAP pin.
The output rise and fall times are given by Equation 1:
(EQ. 1)
220t ri se
C = --------------------ΔV
Where C is the TCAP value in nF, trise the required
transition time in ms and ΔV is the differential transition
voltage from low output voltage range to the high output
range in Volts.
Too large a value of TCAP prevents the output from rising
to the nominal value, within a reasonable time. Too small
a value of the TCAP can cause high peak currents in the
boost circuit. Figures 4 and 5 show the output voltage
rise time for TCAP value of 0.22µF and 0.44µF as 13.6ms
and 32ms which according to Equation 1 should be
11
13.3ms and 26.6ms. The difference between measured
and calculated values is due to capacitor tolerance of ±
20%. Since the output voltage uses TCAP voltage as a
reference, it is recommended to use a 10kΩ resistor in
series to filter out some of the switching noise from
injecting on this pin.
Dynamic and Static Current Limiting
When the LDO current exceeds the preset overcurrent
threshold set by means of a resistor from the ILIMIT pin
to GND for a period of 50ms, the device enters a
tON = 50ms/tOFF = 900ms routine. This type of current
limiting is also called “Dynamic Current Limiting”, which
is used extensively on other Intersil LNB controllers. A
linear overcurrent will drive the FAULT pin low during the
tOFF = 900ms period. This operation continues until the
fault is removed. Upon removal of the fault, the device
returns to normal operation after a successful soft-start
cycle. Figure 14 shows the output current and voltage
waveforms with an ILIMIT resistor of 148kΩ and a load
current of 350mA. It can be seen that under this loading
condition, the chip stays powered up and sources load
current for 50ms and turns-off for approximately 900ms.
The output voltage ramps up to programmed output
voltage during the on time.This cycle repeats itself until
load current is reduced below the current limit value of
350mA. Equation 2 shows the relationship between
ILIMIT resistor and load current:
α
ILIMIT = 52, 000 × --------------------R ILIMIT
(EQ. 2)
ILIMIT is the programmed load current in mA before the
chip goes into current limit where RILIMIT is in kΩ .
Alpha (α) is a gain term which is shown in Figure 19 and
has a value of one at 350mA. It is a good design practice
to use a 1% tolerance resistor and allow for at least 20%
higher margin on the maximum load current when
calculating the RILIMIT resistor value.
1.05
1.00
0.95
ALPHA (α)
Functional Description
0.90
0.85
0.80
0.75
0.70
100 150 200 250 300 350 400 450 500 550
ILIMIT (mA)
FIGURE 19. ALPHA CONSTANT
Figure 15 shows the output current and voltage for
RILIMIT =148kΩ when the output voltage is shorted to
GND. Under this condition, the chip still exhibits the
50ms on and 900ms off pulse to minimize power
dissipation, however, current gets internally clamped to
approximately 750mA. The output voltage stays at 0V
FN6531.0
October 13, 2009
ISL9491, ISL9491A, ISL9491A
due to hard short on the output. The current limiting
described so far is called “Dynamic Current” limiting
which limits current to approximately 750mA for 50ms
and turns off the output for 900ms. RILIM is used to
program the current level at which the ISL9491 enters
into this protection mode. On the other hand, the
ISL9491 can also be programmed in “Static Current
Limit” mode which defeats the 50ms/900ms(on/off)
pulse by delivering constant 750mA load current to the
system by using a 0Ω RILIMIT resistor. In this mode the
chip will deliver this current to the load for as long as the
die junction temperature is less than 130oC. Figure 16
shows the static current limit by shorting the output to
GND. It also shows that initially the chip delivers 750mA
but the junction starts heating up since approximately
10W (13.3V*0.75A) is being dissipated internally. The
thermal shutdown circuitry takes over and shuts the
output LDO stage-off after approximately 50ms and the
load current drops to zero as seen in Figure 17. The chip
restarts as soon as the junction temperature drops below
the thermal shutdown level but quickly shuts off in 15ms
as seen in Figure 18.
The CS pin provides peak current protection for the Boost
FET on a pulse-by-pulse basis. Once the voltage on the
FET source sense resistor crosses 0.45V typical, the
Boost FET drive is set to low. The sense resistor can be
sized to limit the peak current through the FET. It is
highly recommended to have a boost current limit of
200% when sizing the sense resistor to accommodate
high current transients in the boost circuit.
Thermal Protection
This IC is protected against overheating. When the
junction temperature exceeds +130°C (typical), the
step-up converter and the linear regulator are shut-off.
When the junction is cooled down to +110°C (typical),
normal operation is resumed.
External Output Voltage Selection
The pin VSET0 and VSET1 are provided for switching
between typical output voltages, as indicated in Table 1.
TABLE 1.
EN
VSET1
VSET0
VLNB
ISL9491
VLNB
ISL9491A
0
X
X
Disabled
Disabled
1
0
0
13.3V
11.0V
1
0
1
18.3V
15.0V
1
1
0
14.3V
12.0V
1
1
1
20.0V
16.0V
Output Over/Undervoltage Fault and EXTM
The recommended start-up sequence is Vcc going high
followed by ENABLE while EXTM is pulled low. This will
start the output voltage to ramp up with a dv/dt which is
based on the TCAP value. Once ENABLE is pulled high,
allow a 50ms delay before applying 22kHz/44kHz, 50%
square pulse on EXTM pin to generate the DISEQ tone on
the output. At this point, FAULT should also be high,
indicating that output voltage is in regulation. FAULT is
designed to stay high when the output voltage is
commanded to transition between the values listed in
Table 1, and also when passing the DiSEQ tone on the
output. FAULT will immediately pull low if there is a short
on the output or if the voltage falls outside the ± 10%
window indicating that the voltage is out of regulation.
FAULT signal is armed after the first initial power-up
when output voltage is in steady-state. If tone is applied
to the EXTM pin before the chip is ENABLED, it causes the
FAULT to remain low even after the output voltage
reaches steady state. This issue can be resolved by
pulling the EXTM low for 2 cycles which is 90ms of
ISL9491 and 45ms for ISL9491A.
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
12
FN6531.0
October 13, 2009
ISL9491, ISL9491A, ISL9491A
Package Outline Drawing
L16.4x4
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 6, 02/08
4X 1.95
4.00
12X 0.65
A
B
13
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
16
1
4.00
12
2 . 10 ± 0 . 15
9
4
0.15
(4X)
5
8
TOP VIEW
0.10 M C A B
+0.15
16X 0 . 60
-0.10
4 0.28 +0.07 / -0.05
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
1.00 MAX
( 3 . 6 TYP )
(
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
2 . 10 )
( 12X 0 . 65 )
( 16X 0 . 28 )
C
0 . 2 REF
5
( 16 X 0 . 8 )
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
13
FN6531.0
October 13, 2009