152CMQ030 N1180 REV.-

SANGDEST
MICROELECTRONICS
152CMQ030
Technical Data
Data Sheet N1180, Rev. -
Green Products
152CMQ030 SCHOTTKY RECTIFIER
Applications:
• Switching power supply • Converters • Free-Wheeling diodes • Reverse battery protection
Features:
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•
•
•
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•
•
•
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150 °C TJ operation
Isolated heatsink
Multiple leads per terminal for high frequency, high current PC board mounting
Low profile, high current package
Center tap module
Low forward voltage drop
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and
moisture resistance
High frequency operation
Guard ring for enhanced ruggedness and long term reliability
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
Mechanical Dimensions: In Inches/mm
TO-249(9 pin)
MARKING, MOLDING RESIN
st
nd
rd
Marking for 152CMQ030, 1 row SS YYWWL, 2 row 152CMQ030, 3 row 1 2 3 (Pin)
Where YY is the manufacture year
WW is the manufacture week code
L is the wafer’s Lot Number
Molding resin
Epoxy resin UL: 94V-0
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
SANGDEST
MICROELECTRONICS
152CMQ030
Technical Data
Data Sheet N1180, Rev. -
Green Products
Maximum Ratings:
Characteristics
Peak Inverse Voltage
Max. Average Forward*
Max. Peak One Cycle NonRepetitive Surge Current
(peg leg)
Non-Repetitive Avalanche
Energy(peg leg)
Repetitive Avalanche
Current(peg leg)
Symbol
VRWM
Max.
30
Units
V
IF(AV)
Condition
50% duty cycle @TC = 85°C,
rectangular wave form
150
A
IFSM
8.3 ms, half Sine pulse
1200
A
EAS
TJ=25℃,IAS=15A,L=0.6mH
68
mJ
IAR
Current decaying linearly to zero
in 1 μsec Frequency limited by
TJ max.VA=1.5×VR typical
15
A
Max.
0.55
0.69
0.47
0.66
Units
5
mA
280
mA
3700
pF
9.2
nH
10,000
V/μs
Specification
-55 to +150
-55 to +150
Units
°C
°C
Electrical Characteristics:
Characteristics
Max. Forward Voltage Drop
(per leg) *
Symbol
VF1
VF2
Max. Reverse Current (per
leg) *
IR1
IR2
Max. Junction Capacitance
(per leg)
Typical Series Inductance
(per leg)
Max. Voltage Rate of Change
*
CT
LS
dv/dt
Condition
@ 75A, Pulse, TJ = 25 °C
@ 150A, Pulse, TJ = 25 °C
@ 75A, Pulse, TJ = 75 °C
@ 150A, Pulse, TJ = 75 °C
@VR = rated VR
TJ = 25 °C
@VR = rated VR
TJ = 125 °C
@VR = 5V, TC = 25 °C
fSIG = 1MHz
Measured lead to lead 5 mm
from package body
-
V
V
Pulse Width < 300µs, Duty Cycle <2%
Thermal-Mechanical Specifications:
Characteristics
Max. Junction Temperature
Max. Storage Temperature
Maximum Thermal
Resistance Junction to Case
(per leg)
Maximum Thermal
Resistance Junction to Case
(per package)
Typical Thermal Resistance,
case to Heat Sink
Symbol
TJ
Tstg
Condition
-
RθJC
DC operation
1.0
°C/W
RθJC
DC operation
0.5
°C/W
Rθcs
Mounting surface, smooth and
greased
0.10
°C/W
Mounting Torque
TM
-
Approximate Weight
Case Style
wt
-
40(min)
58(max)
56
Kg-cm
g
TO-249(9 pin)
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N1180, Rev. -
152CMQ030
Green Products
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N1180, Rev. -
152CMQ030
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
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