Component Construction

Component Construction
Vishay Semiconductors
Component Construction
Photodetector and infrared emitter components are available
in plastic or metal packages.
Plastic devices mostly include a lens to improve radiant
sensitivity or radiant intensity. Detector chips are mounted on
flat leadframe surfaces while leadframes for emitters have a
silver plated reflector performing higher radiant intensity.
Devices in metal packages are hermetically sealed, are
released for extended operating temperature range and
have small optical and mechanical tolerances.
IRED chip
PIN diode chip
Collimating lens
AU-bond wire
Black plastic package
daylight blocking filter
Reflector
Plastic package
Lead frame
Anode
Cathode
94 8165
Cathode
Anode
PIN diode chip
94 8314
Chip
Glass window
Bond wire
Reflector cone
filled with epoxy
Metal can package
White
plastic case
Anode
Leadframe
Cathode
Polarity identification
96 11621-1
94 8315
www.vishay.com
1
For technical questions concerning emitters, contact: [email protected]
For technical questions concerning detectors, contact: [email protected]
Document Number: 80081
Rev. 1.3, 06-Jun-08
Similar pages