VSMY14940 Datasheet

VSMY14940
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diodes, 940 nm,
Surface Emitter Technology
FEATURES
• Package type: surface mount
• Package form: side view
• Dimensions (L x W x H in mm): 3.2 x 2.51 x 1.2
• Peak wavelength: p = 940 nm
• High reliability
• High radiant power
• Very high radiant intensity
• Angle of half intensity:  = ± 9°
• Suitable for high pulse current operation
DESCRIPTION
• Floor life: 168 h, MSL 3, according to J-STD-020
As part of the SurfLightTM portfolio, the VSMY14940 is an
infrared, 940 nm, side looking emitting diode based on
GaAlAs surface emitter chip technology with extreme high
radiant intensities, high optical power and high speed,
molded in clear, untinted PCB based package (with lens) for
surface mounting (SMD).
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
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APPLICATIONS
• Emitter for remote control
• IR touch panels
• Photointerrupters
• Optical switch
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
 (deg)
p (nm)
tr (ns)
82
±9
940
10
VSMY14940
Note
• Test condition see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMY14940
Tape and reel
MOQ: 1500 pcs, 1500 pcs/reel
Side view
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
VALUE
Reverse voltage
VR
5
V
Forward current
IF
70
mA
Surge forward current
TEST CONDITION
tp = 100 μs
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
UNIT
IFSM
1
A
PV
119
mW
Tj
100
°C
Tamb
-40 to +85
°C
°C
Tstg
-40 to +100
Soldering temperature
According fig. 10, J-STD-020
Tsd
260
°C
Thermal resistance junction / ambient
J-STD-051, soldered on PCB
RthJA
390
K/W
Rev. 1.4, 19-Nov-15
Document Number: 84209
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY14940
Vishay Semiconductors
140
80
120
70
IF - Forward Current (mA)
PV - Power Dissipation (mW)
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100
80
60
RthJA = 390 K/W
40
20
60
50
40
30
RthJA = 390 K/W
20
10
0
0
0
10
20
30
40
50
60
70
80
0
90 100
10
Tamb - Ambient Temperature (°C)
20
30
40
50
60
70
80
90 100
Tamb - Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
IF = 20 mA, tp = 20 ms
IF = 70 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
IF = 20 mA
VR = 0 V, f = 1 MHz, E = 0 mW/cm2
IF = 20 mA, tp = 20 ms
IF = 70 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
IF = 70 mA, tp = 20 ms
SYMBOL
VF
VF
VF
TKVF
IR
CJ
Ie
Ie
Ie
e
IF = 20 mA
TKe
-
-0.21
-
%/K
IF = 20 mA
IF = 20 mA
IF = 20 mA
IF = 100 mA, 20 % to 80 %
IF = 100 mA, 20 % to 80 %

p

TKp
tr
tf
920
-
±9
940
35
0.25
10
10
960
-
deg
nm
nm
nm/K
ns
ns
Forward voltage
Temperature coefficient of VF
Reverse current
Junction capacitance
Radiant intensity
Radiant power
Temperature coefficient of radiant
power
Angle of half intensity
Peak wavelength
Spectral bandwidth
Temperature coefficient of p
Rise time
Fall time
MIN.
TYP.
MAX.
1.1
1.32
1.6
1.48
1.7
2.5
-1.7
not designed for reverse operation
5
15
24
35
50
82
120
660
40
-
UNIT
V
V
V
mV/K
μA
pF
mW/sr
mW/sr
mW/sr
mW
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
1.50
IF = 20 mA
VF - Forward Voltage (V)
IF - Forward Current (mA)
tp = 100 µs
100
10
1
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
VF - Forward Voltage (V)
Fig. 3 - Forward Current vs. Forward Voltage
Rev. 1.4, 19-Nov-15
1.45
1.40
1.35
1.30
1.25
1.20
-60
-40
-20
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 4 - Forward Voltage vs. Ambient Temperature
Document Number: 84209
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY14940
Vishay Semiconductors
115
100
Ie, rel - Relative Radiant Intensity (%)
IF = 20 mA
110
105
100
95
90
-60
-40
-20
0
20
60
40
80
IF = 20 mA
90
80
70
60
50
40
30
20
10
0
800
100
850
900
950
Fig. 5 - Relative Forward Voltage vs. Ambient Temperature
1050
Fig. 8 - Relative Radiant Intensity vs. Wavelength
0°
1000
tp = 100 µs
Ie, rel - Relative Radiant Intensity
Ie - Radiant Intensity (mW/sr)
1000
λ - Wavelength (nm)
Tamb - Ambient Temperature (°C)
100
10
1
10°
20°
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
VF, rel - Relative Forward Voltage (%)
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80°
1
1
10
100
1000
0.6
0.4
0.2
0
IF - Forward Current (mA)
Fig. 6 - Radiant Intensity vs. Forward Current
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
Ie, rel - Relative Radiant Intensity (%)
110
IF = 20 mA
105
100
95
90
85
80
-60
-40
-20
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 7 - Relative Radiant Intensity vs. Ambient Temperature
Rev. 1.4, 19-Nov-15
Document Number: 84209
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY14940
www.vishay.com
Vishay Semiconductors
SOLDER PROFILE
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Temperature
10 s max.
217 °C
200 °C
FLOOR LIFE
255 °C to 260 °C
3 °C/s max.
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
6 °C/s max.
Floor life: 168 h
150 °C
Conditions: Tamb < 30 °C, RH < 60 %
3 °C/s max.
Moisture sensitivity level 3, according to J-STD-020.
60 s to 120 s
60 s max.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Time
Fig. 10 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
PACKAGE DIMENSIONS in millimeters: VSMY14940
1.20
Molding
body (lens)
0.60
PC board
-
1.60
Soldering
terminal
3.20
LED dice
Anode mask
0.60
+
Polarity
1.90 ± 0.15
2.51 ± 0.15
1.10
Not indicated tolerances ± 0.1 mm
Recommended Solder Pad
1.5
(0.059)
5.0
(0.197)
Rev. 1.4, 19-Nov-15
1.5
(0.059)
Document Number: 84209
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY14940
www.vishay.com
Vishay Semiconductors
TAPING AND REEL DIMENSIONS in millimeters: VSMY14940
Rev. 1.4, 19-Nov-15
Document Number: 84209
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000