Assembly Instructions

Assembly Instructions
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Vishay Semiconductors
Assembly Instructions
GENERAL
SOLDERING INSTRUCTIONS
Vishay leaded IR receiver modules can be mounted in any
position. The wire leads may be bent provided the bend is
not less than 1.5 mm from the bottom of the plastic
package. During bending, no forces should be transmitted
from the leads to the package (e.g. by spreading the leads).
If the device is to be mounted near heat generating
components, the resultant increase in ambient temperature
should not exceed the specified ratings.
Protection against overheating is essential when a device is
being soldered. It is recommended, where possible, that the
length of the leads between the solder joint and the package
be left as long as possible. The maximum permissible
soldering temperature for plastic encapsulated devices is
governed by the maximum permissible heat that may be
applied to the encapsulant rather than by the maximum
permissible junction temperature of the die.
The maximum temperatures and soldering times for iron and
wave soldering are given in table 1.
TABLE 1 - MAXIMUM SOLDERING TEMPERATURES
IRON SOLDERING
DISTANCE OF
THE SOLDERING
IRON
POSITION FROM
TEMPERATURE
THE LOWER EDGE
OF THE CASE
WAVE SOLDERING
SOLDERING
DISTANCE OF
MAXIMUM
TEMPERATURE THE SOLDERING
ALLOWABLE
SEE
POSITION FROM
SOLDERING
TEMPERATURE THE LOWER EDGE
TIME PER PIN
TIME PROFILES
OF THE CASE
MAXIMUM
ALLOWABLE
SOLDERING
TIME
IR receiver for through
hole assembly without
holder
 350 °C
 2 mm
3s
260 °C
 1 mm
10 s
IR receiver for through
hole assembly with
plastic holder
 350 °C
n.a.
3s
260 °C
n.a.
5s
IR receiver for through
hole assembly with
metal holder
 350 °C
n.a.
3s
260 °C
n.a.
10 s
IR receiver for SMD
assembly
 350 °C
n.a.
3s
SOLDERING METHODS
- Layout density
- Optical spectrum of the radiation source
- Ratio of radiated to convected energy
A temperature-time profile of the reflow process, suitable
only for SMD devices, is given in figure 2. Reflow soldering
is not approved for leaded IR receivers.
There are several commonly used methods to solder
devices on-to the substrate. Some of them are listed in the
following:
(a) Reflow Soldering
Reflow soldering uses contact-free heating and derives the
energy for soldering the assembly either from convection
heating or from direct infrared radiation.
The heating rate in an IR furnace depends on the absorption
coefficients of the material surfaces and on the ratio of the
components’ masses to their irradiated surfaces.
The temperature of parts in an IR furnace cannot be
determined in advance. Temperature measurements may
be performed by measuring the temperature of a certain
component while it is being transported through the furnace.
The temperatures of small components tend to change
more than that of the larger ones with which they are
soldered together and may rise up to 280 °C.
The parameters which influence the internal temperature of
the component are the following:
- Time in the oven and power of the oven
- Mass of the component
- Size of the component
- Size of the printed circuit board
- Absorption coefficient of the surfaces
Rev. 1.6, 03-Jul-12
Soldering Instructions
• Reflow soldering must be done according MSL4 within
72 h after opening the dry pack envelope while stored
under a maximum temperature of 30 °C and a relative
humidity of 60 %.
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured.
• Handling after reflow should be done only after the work
surface has been cooled off.


1
Document Number: 80068
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Assembly Instructions
www.vishay.com
Vishay Semiconductors
(b) Wave soldering
In wave soldering, one or more continuously replenished
waves are generated in a bath of molten solder. The
substrates to be soldered are moved in the opposite
direction to that of the wave and across the wave’s crest.
A temperature-time profile of the entire process is given in
figure 3. Wave soldering is applicable for leaded IR receiver
but not for the SMD packages.
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
Note for parts mounted in plastic holders: the temperatures
used for soldering exceed the melting temperature of
plastic. A wave-soldering process not exceeding 5 s will
therefore often deform the hooks used to attach the holder
to the PCB, but will not affect the functionality of the holder.
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
(c) Soldering iron
Note: Level and body temperature defined by EIA JEDEC Standard JSTD-020
The process of hand soldering with an iron cannot be carried
out in a repeatable and controlled way.
This process should not be considered for use in
applications where reliability is important. There is no SMD
classification for this process.
22522
Fig. 1 - Example of JSTD-020 Level 4 Label
Temperature-Time Profiles
300
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 350 °C.
250
• Finish soldering within 3 s.
200
T (°C)
Manual Soldering for SMD
• Handle products only after the temperature has cooled
off.
max. 260 °C
245 °C
255 °C
240 °C
217 °C
max. 20 s
150
max. 100 s
max. 120 s
100
WARNING
max. Ramp Up 3 °C/s
19800
• Storage temperature 10 °C to 30 °C
300
0
0
50
100
150
200
t (s)
250
300
max. 2 cycles allowed
Fig. 2 - Infrared Reflow Soldering of Opto Devices
(SMD package only)
5s
• Storage humidity at 60 % RH maximum
250
Temperature (°C)
If the devices are stored for more than 72 h under these
conditions, the moisture content will then be too high for
reliable reflow soldering. The devices can be reconditioned
to recover to an acceptable moisture content by drying
under the following conditions:
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) 
or 
24 h at 125 °C + 5 ° not suitable for reel or tubes
or
96 h at 60 °C ± 5 °C and < 5 % RH for all device containers.
An EIA JEDEC Standard JSTD-020 level 4 label is included
on all dry packs.
Rev. 1.6, 03-Jul-12
max. Ramp Down 6 °C/s
50
Opto devices are sensitive to damage due to moisture
release if they are subjected to infrared reflow or a similar
soldering process (e.g. wave soldering) without being
properly dried.
Dry box storage is recommended as soon as the aluminum
shipping bag has been opened to prevent moisture
absorption by the device. The following conditions should
be observed if dry boxes are not available:
Lead Temperature
235 °C to 260 °C
fullline: typical
dotted line: process limits
second
wave
first wave
200
ca. 2 K/s
ca. 200 K/s
150
forced
100 100 °C to 130 °C cooling
2 K/s
50
0
0
18188
ca. 5 K/s
0
5
100
150
200
250
Time (s)
Fig. 3 - Wave Soldering of Opto Devices
(leaded IR receiver package only)
2
Document Number: 80068
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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