0402AF

Document 422-1
Chip Inductors – 0402AF Series (1005)
•Higher inductance values than other 0402 inductors
•Ferrite construction for high current handling
•23 inductance values from 20 nH to 560 nH
Part number1
Inductance2
±5% (nH)
0402AF-200XJL_
0402AF-220XJL_
0402AF-330XJL_
0402AF-360XJL_
0402AF-390XJL_
0402AF-510XJL_
0402AF-560XJL_
0402AF-720XJL_
0402AF-780XJL_
0402AF-101XJL_
0402AF-141XJL_
0402AF-181XJL_
0402AF-201XJL_
0402AF-221XJL_
0402AF-251XJL_
0402AF-271XJL_
0402AF-301XJL_
0402AF-331XJL_
0402AF-361XJL_
0402AF-391XJL_
0402AF-421XJL_
0402AF-471XJL_
0402AF-561XJL_
20
22
33
36
39
51
56
72
78
100
140
180
200
220
250
270
300
330
360
390
420
470
560
Impedance typ (Ohms)
900 MHz 1.7 GHz
83118
96146
142207
157249
173263
218330
239360
311453
344522
513850
629949
8321270
11101890
10501560
12301940
13201960
15502230
18502880
19202640
23502970
22702800
26803010
36203110
1. When ordering, please specify termination and packaging codes:
0402AF-561XJLW
Termination:L=RoHS compliant gold over nickel over silver-palladium-glass frit.
Special order: T = RoHS tin-silver-copper (95.5/4/0.5)
or S = non-RoHS tin-lead (63/37).
Packaging:W
=7″ machine-ready reel. EIA-481 punched paper
tape (2000 parts per full reel).
Q
=7″ machine-ready reel. EIA-481 punched paper
tape (5000 parts per full reel).
U=Less than full reel. In tape, but not machine ready.
To have a leader and trailer added ($25 charge),
use code letter W instead.
2. Inductance measured at 7.9 MHz, 0.1 Vrms, using an Agilent/HP
4286A LCR meter or equivalent with a Coilcraft SMD-F test fixture and
Coilcraft-provided correlation pieces.
3. SRF measured using Agilent/HP 8753D network analyzer and Coilcraft
SMD­‑D test fixture.
4. DCR measured on Cambridge Technology micro-ohmmeter and a
Coilcraft CCF858 test fixture.
5. Current that causes a 15°C temperature rise from 25°C ambient.
Because of their open construction, these parts will not saturate. This
information is for reference only and does not represent absolute
maximum ratings. Click for temperature derating information.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
SRF
typ3
(MHz)
2600
2500
2300
2300
2200
1930
1900
1650
1600
1400
1220
1150
1000
1150
900
860
860
820
810
760
700
650
600
DCR
max4
(Ohms)
0.050
0.065
0.060
0.075
0.115
0.070
0.095
0.100
0.130
0.160
0.260
0.280
0.440
0.530
0.360
0.550
0.410
0.560
0.575
0.750
0.700
0.730
0.920
Irms5
(mA)
1600
1300
1400
1300
830
1100
1000
1000
970
900
630
560
400
380
520
360
420
350
360
300
340
310
200
Designer’s Kit C397 contains 20 each of all values
Core material Ferrite
Terminations RoHS compliant gold over nickel over silver-palladiumglass frit. Other terminations available at additional cost.
Weight 0.9 – 1.1 mg
Ambient temperature –40°C to +85°C with Irms current
Maximum part temperature +100°C (ambient + temp rise) Derating.
Storage temperature Component: –40°C to +100°C.
Tape and reel packaging: –40°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +150 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
One per billion hours / one billion hours, calculated per Telcordia SR-332
Packaging 2000 or 5000 per 7″ reel. Paper tape: 8 mm wide,
0.68 mm thick, 2 mm pocket spacing
PCB washing Tested to MIL-STD-202 Method 215 plus an additional
aqueous wash. See Doc787_PCB_Washing.pdf.
Document 422-1 Revised 10/12/15
Document 422-2
Chip Inductors – 0402AF Series
Typical Q vs Frequency
Typical L vs Frequency
1000
16
560 nH
14
270 nH
560 nH
100 nH
56 nH
Q Factor
Inductance (nH)
12
100 nH
100
20 nH
10
56 nH
10
20 nH
8
270 nH
6
4
2
1
0.001
0.01
0.1
Frequency (GHz)
1
0
10
1
Typical Impedance vs Frequency
10
B
overall
20 nH
100
F
G
E
D
terminal
F
Terminal wraparound:
approx 0.007/0,18 both ends
A max B max C max
D
E
F
Recommended
Land Pattern
G
H
0.044 0.026 0.026 0.020 0.009 0.017 0.018 0.026 inches
10
1,12
0,66
0,66 0,51 0,23
0,43 0,46 0,66 mm
Note: Height dimension (C) is before optional solder application. For maximum
height dimension including solder, add 0.006 in / 0,152 mm.
1
0.1
H
Pick and
place
material
A
270 nH
100 nH
56 nH
1000
Impedance (Ohms)
C
E
10000
560 nH
100
Frequency (MHz)
0.001
0.01
0.1
Frequency (GHz)
1
10
Document 422-2 Revised 10/12/15
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