0402PA

Document 347 -1
Chip Inductors – 0402PA (1005)
With current ratings as high as 1.8 A, Coilcraft’s 0402PA
wirewound chip inductors are ideal for power amplifiers
in TDMA, CDMA, GSM and other wireless applications.
Compared to our standard 0402CS Series, they can
handle up to 65% more current and have half the DC
resistance. These inductors are perfect for use as an RF
choke for the power supply, the LC tank between ampli Inductance2Percent
tolerance3
Part number1(nH)
0402PA-0N8XJL_0.78 5
0402PA-1N9X_L_1.9 5,2
0402PA-3N4X_L_3.4 5,2
0402PA-3N5X_L_3.5 5,2
0402PA-5N8X_L_5.8 5,2
0402PA-6N2X_L_6.2 5,2
0402PA-8N2X_L_8.2 5,2
fier and antenna and in the amplifier bias circuit. Like our
other ceramic chip inductors, they feature outstanding selfresonant frequencies and excellent Q values. Most values
are available in 2% inductance tolerance.
Coilcraft Designer’s Kit C373 contains samples of all 5%
inductance tolerance parts. To order, contact Coilcraft or
visit http://order.coilcraft.com.
900 MHz
L typ Q typ4
0.7935
1.8350
3.3651
3.5158
5.7656
6.1757
8.1558
1. When ordering, specify tolerance, termination and packaging codes:
0402PA-8N2XJLW
Tolerance: G=2% J = 5%
Termination:L =RoHS compliant silver-palladium-platinum-glass frit
E =Halogen free component. RoHS compliant silverpalladium-platinum-glass frit terminations.
Special order: T = RoHS tin-silver-copper (95.5/4/0.5)
or S = non-RoHS tin-lead (63/37)
Packaging:W
=7″ machine-ready reel. EIA-481 punched paper
tape (2000 parts per full reel).
U=Less than full reel. In tape, but not machine ready.
To have a leader and trailer added ($25 charge),
use code letter W instead.
2. Inductance measured at 250 MHz using a Coilcraft SMD-F test fixture
and Coilcraft-provided correlation pieces with an Agilent/HP 4286 impedance analyzer.
3. Tolerances in bold are stocked for immediate shipment.
4. Q measured using an Agilent/HP 4291A with an Agilent/HP 16193 test
fixture.
5. For SRF >6 GHz, measured using an Agilent/HP 8722ES network
analyzer and a Coilcraft SMD‑D test fixture. For SRF £6 GHz, measured
using anAgilent/HP 8753D network analyzer and a Coilcraft SMD‑D test
fixture.
6. DCR measured on a micro-ohmmeter.
7. Current that causes a 15°C temperature rise from 25°C ambient. This
information is for reference only and does not represent absolute maximum ratings.
8. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
SRF typ5
DCR typ6
Irms7
1.7 GHz
L typ Q typ4(MHz) (Ohms) (mA)
0.7655 15200 0.018 1860
1.8173 12500 0.022 1700
3.3393 7200 0.030 1500
3.5582 8750 0.040 1400
5.7083 5450 0.045 1300
6.2881 4950 0.055 1150
8.1982 4650 0.060 1100
Core material Ceramic
Environmental RoHS compliant, halogen free optional
Terminations RoHS compliant silver-palladium-platinum-glass frit.
Other terminations available at additional cost.
Weight 0.9 – 1.1 mg
Ambient temperature –40°C to +125°C with Irms current
Maximum part temperature +140°C (ambient + temp rise).
Storage temperature Component: –40°C to +140°C.
Tape and reel packaging: –40°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +125 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
One per billion hours / one billion hours, calculated per Telcordia SR-332
Packaging 2000 per 7″ reel. Paper tape: 8 mm wide, 0.68 mm thick,
2 mm pocket spacing
PCB washing Tested to MIL-STD-202 Method 215 plus an additional
aqueous wash. See Doc787_PCB_Washing.pdf..
Document 347-1 Revised 10/03/08
Document 347-2
0402PA Series (1005)
Typical Q vs Frequency
Typical L vs Frequency
100
90
9
1.9 nH
5.8 nH
80
8.2 nH
8
8.2 nH
3.5 nH
60
50
0.8 nH
40
30
Inductance (nH)
6.2 nH
70
Q Factor
10
3.4 nH
7
6.2 nH
5.8 nH
6
5
4
3.5 nH
3.4 nH
3
20
2
1.9 nH
10
1
0.8 nH
0
0
1
10
100
1000
10000
Frequency (MHz)
D
F
E
terminal
10
100
1000
10000
Frequency (MHz)
C
B
overall
A
1
Pick and
place
material
H
I
G
J
F
I
Terminal wraparound:
approx 0.007/0,18 both ends
ABCD
maxmaxmax ref E
F
G
Recommended
Land Pattern
H
IJ
0.0470.0250.0260.0100.0200.0090.0220.0260.0140.018inches
1,190,640,660,250,510,230,560,660,360,46
mm
Note: Height dimension (C) is before optional solder application. For maximum
height dimension including solder, add 0.006 in / 0,152 mm.
Document 347-2 Revised 10/03/08