0403HQ

Document 300-1
Chip Inductors - 0403HQ (1008)
• Very high Q factors and excellent current handling
• Intermediate L values not found in other series
Inductance2Percent Q
900 MHz
1.7 GHz
min3
Part number1
(nH)tolerance
L typ Q typ L typ Q typ
SRFDCR
typ4
max5 Irms6
(GHz)
(Ohms)
(A)
0403HQ-1N9XJL_1.9
0403HQ-2N1XJL_2.1
0403HQ-3N4XJL_3.4
0403HQ-3N7XJL_3.7
0403HQ-5N5XJL_5.5
5
5
5
5
5
40
35
40
40
40
0403HQ-6N6XJL_6.6
0403HQ-8N2XJL_8.2
0403HQ-9N0XJL_9.0
0403HQ-12NXJL_12
0403HQ-15NXJL_15
5
5
5
5
5
40 6.660 6.9
40 8.263 8.5
40 9.166 9.5
40 12.160 12.7
35 15.260 16.0
0403HQ-18NXJL_18
5
35 18.262 19.6 93
1. When ordering, please specify termination and packaging codes:
0403HQ-18NXJLW
Termination:L =RoHS compliant silver-palladium-platinum-glass frit.
E =Halogen free component. RoHS compliant silverpalladium-platinum-glass frit terminations.
Special order: T = RoHS tin-silver-copper (95.5/4/0.5)
or S = non-RoHS tin-lead (63/37).
Packaging:W
=7″ machine-ready reel. EIA-481 punched paper
tape (2000 parts per full reel).
U=Less than full reel. In tape, but not machine ready.
To have a leader and trailer added ($25 charge),
use code letter W instead.
2. Inductance measured at 500 MHz using a Coilcraft SMD-F fixture in an
Agilent/HP 4286 impedance analyzer with Coilcraft-provided correlation pieces.
3. Q measured at 500 MHz using an Agilent/HP 4291A with an Agilent/
HP 16193 test fixture.
4. SRF measured using an Agilent/HP 8722ES network analyzer and a
test fixture with a 0.017″ air gap.
5. DCR measured on a micro-ohmmeter and a Coilcraft CCF858 test
fixture.
6. Current that causes a 30°C temperature rise from 25°C ambient. This
information is for reference only and does not represent absolute maximum ratings.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
1.962
2.156
3.466
3.764
5.562
1.9
2.1
3.5
3.8
5.7
94 11.84 0.012 2.2
88 12.40 0.019 1.8
96 8.97 0.016 1.9
95 8.65 0.018 1.8
93 8.60 0.022 1.5
92
92
90
90
90
7.30
6.73
6.85
5.82
5.82
0.046
0.040
0.055
0.065
0.188
1.1
1.2
1.0
0.80
0.50
5.15 0.185 0.50
Designer’s Kit C371 contains 20 of each value
Core material Ceramic
Terminations RoHS compliant silver-palladium-platinum-glass frit.
Other terminations available at additional cost.
Environmental RoHS compliant, halogen free optional
Weight 1.29 – 1.60 mg
Ambient temperature –40°C to +125°C with Irms current
Maximum part temperature +155°C (ambient + temp rise).
Storage temperature Component: –40°C to +155°C.
Tape and reel packaging: –40°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +125 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
One per billion hours / one billion hours, calculated per Telcordia SR-332
Packaging 2000 per 7″ reel; 7500 per 13″ reel;
Paper tape: 8 mm wide, 1.0 mm thick, 2 mm pocket spacing,
PCB washing Tested to MIL-STD-202 Method 215 plus an additional
aqueous wash. See Doc787_PCB_Washing.pdf.
Document 300-1 Revised 10/12/15
Document 300-2
0403HQ Series (1008)
Typical L vs Frequency
Typical Q vs Frequency
100
25
1.9 nH
18.0 nH
8.2 nH
12.0 nH
90
18.0 nH
80
70
15
12.0 nH
10
8.2 nH
Q Factor
Inductance (nH)
20
60
50
40
30
5
20
1.9 nH
0
1
10
100
1000
10000
Frequency (MHz)
B
overall
C
E
A
D
terminal
Pick and
place
material
0
1
10
100
1000
10000
Frequency (MHz)
G
H
F
I
E
H
Terminal wraparound:
approx 0.007/0,18 both ends
10
Recommended
Land Pattern
A
B
C
max
max
max
D E FGH I
0.0470.0340.0280.0300.0090.0220.0400.0140.018 inches
1,190,860,710,760,230,561,020,360,46mm
Note: Height dimension (C) is before optional solder application. For maximum
height dimension including solder, add 0.006 in / 0,152 mm.
Document 300-2 Revised 10/12/15
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