INTERSIL HFA3683AIN

HFA3683A
TM
Data Sheet
June 2000
2.4GHz RF/IF Converter and Synthesizer
Features
The HFA3683A is a monolithic SiGe
half-duplex RF/IF transceiver designed
to operate in the 2.4GHz ISM band.
The receive chain features a low noise,
gain selectable amplifier (LNA) followed
by a down-converter mixer. An up-converter mixer and a
high performance preamplifier compose the transmit chain.
The remaining circuitry comprises a high frequency Phase
Locked Loop (PLL) synthesizer with a three wire
programmable interface for local oscillator applications.
• Highly Integrated
A reduced filter count is realized by multiplexing the receive
and transmit IF paths and by sharing a common differential
matching network. Furthermore, both transmit and receive
RF amplifiers can be directly connected to mixers. The
inherent image rejection of both the transmit and receive
functions allow this economic advantage.
File Number
4634.5
• Multiplexed RX/TX IF Path Utilizes Single IF Filter
• Programmable Synthesizer
• Gain Selectable LNA
• Power Management/Standby Mode
• Single Supply 2.7V to 3.3V Operation
Cascaded LNA/Mixer (High Gain)
• Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25dB
• SSB Noise Figure. . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7dB
• Input IP3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -13dBm
• IF Frequency . . . . . . . . . . . . . . . . . . . 280MHz to 600MHz
Cascaded LNA/Mixer (Low Gain)
The HFA3683A is housed in a 64 lead TQFP package well
suited for PCMCIA board applications.
• Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -5dB
Ordering Information
• IF Frequency . . . . . . . . . . . . . . . . . . . 280MHz to 600MHz
PART
NUMBER
Cascaded Mixer/Preamplifier
TEMP. RANGE
(oC)
PACKAGE
HFA3683AIN
-40 to 85
64 Ld TQFP
HFA3683AIN96
-40 to 85
Tape and Reel
PKG. NO.
• Transmit Cascaded Mixer/Preamplifier Gain . . . . . . .25dB
Q64.10x10
• SSB Noise Figure. . . . . . . . . . . . . . . . . . . . . . . . . . . .10dB
• Output P1dB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4dBm
• IF Frequency . . . . . . . . . . . . . . . . . . . 280MHz to 600MHz
Simplified Block Diagram
Applications
RX_MX_IN
RF_OUT
H/L
• Input P1dB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +2.5dBm
• IEEE802.11 1MBPS and 2MBPS Standard
• Systems Targeting IEEE802.11, 11MBPS Standard
• Wireless Local Area Networks
RX_IN
RX_MX_OUT
• PCMCIA Wireless Transceivers
• ISM Systems
CP_DO
• TDMA Packet Protocol Radios
PLL
INTERFACE
REF_IN
MODULE
TXA_OUT
LO_IN
TX_MX_OUT
TXA_IN
TX_MX_IN
2-1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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HFA3683A
Pinout
GND
RX_MX_IN
GND
TX_MX_IN+
RX_MX_OUT+
GND
COL_OUT
GND
RF_OUT
GND
ITAT_RES2
BIAS2_VCC1
PTAT_RES
ITAT_RES1
GND
PRE_VCC1
HFA3683A
(TQFP)
TOP VIEW
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
GND
LNA_VCC1
GND
RX_IN
GND
BIAS1_VCC1
GND
H/L
PE2
PE1
TX_VCC1
GND
TXA_OUT
GND
GND
GND
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
RX_MX_OUTTX_MX_INGND
RX_LO_DRIVER_VCC1
GND
LO_VCC1
GND
LO_INLO_IN+
GND
TX_LO_DRIVER_VCC1
TX_MX_VCC1
TX_MX_VCC1
TX_MX_VCC1
TX_MX_OUT
TX_MX_VCC1
GND
SYN_VCC2
GND
CP_VCC2
CP_D0
GND
LD
CLK
REF_BY
REF_IN
TX_VCC1
GND
TXA_IN
GND
LE
DATA
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Pin Description
PIN
NAME
DESCRIPTION
2
LNA_VCC1
4
RX_IN
6
BIAS1_VCC1
8
H/L
High or Low Gain Select, controls the LNA high and low gain modes.
9
PE2
This pin along with pin PE1 and bit M(0) of PLL_PE determine which of various operational modes will be active. Please
refer to the Power Enable Truth Table.
10
PE1
This pin along with pin PE2 and bit M(0) of PLL_PE determine which of various operational modes will be active. Please
refer to the Power Enable Truth Table.
11
TX_VCC1
Transmit Amplifier Positive Power Supply, requires a high quality decoupling capacitor and a short return path.
13
TXA_OUT
Transmit Amplifier Output, internally matched to 50Ω, requires an external DC blocking capacitor.
17
TX_VCC1
Transmit Amplifier Positive Power Supply.
19
TXA_IN
21
LE
22
DATA
23
CLK
24
REF_BY
Synthesizer Reference Frequency Input Bypass, internally DC coupled and requires an external bypass to ground
when REF_IN is used as a Single Ended input, alternatively, requires an external AC coupling capacitor when used as
a differential input.
25
REF_IN
Synthesizer Reference Frequency Input, internally DC coupled and requires an external AC coupling capacitor.
Low Noise Amplifier Positive Power Supply.
Low Noise Amplifier RF Input, internally DC coupled and requires an external blocking capacitor. A shunt capacitor to
ground matches the input for return loss and optimum NF.
Bias Positive Power Supply for the LNA and Preamplifier.
Transmit Amplifier Input, internally AC coupled.
Synthesizer Latch Enable, the serial interface is active when LE is low and the serial data is latched into defined
registers on the rising edge of LE.
Synthesizer Serial Data Input, clocked in on the rising edge of the serial clock, MSB first.
Synthesizer Clock, DATA is clocked in on the rising edge of the serial clock, MSB first.
2-2
HFA3683A
Pin Description
(Continued)
PIN
NAME
27
SYN_VCC2
29
CP_VCC2
30
CP_DO
32
LD
33
TX_MX_VCC1
Transmit Mixer Positive Power Supply.
34
TX_MX_OUT
Transmit Mixer RF output, internal AC coupled and internally matched to 50Ω.
35
TX_MX_VCC1
Transmit Mixer Positive Power Supply.
36
TX_MX_VCC1
Transmit Mixer Positive Power Supply.
37
TX_MX_VCC1
Transmit Mixer Positive Power Supply.
38
TX_LO_Driver_
VCC1
Transmit LO Driver Positive Power Supply.
40
LO_IN+
Local Oscillator Positive Input, internally AC coupled, internally matched to 50Ω when the LO is driven single ended
and the LO_IN- is grounded.
41
LO_IN-
Local Oscillator Negative Input, internally AC coupled, differential or single ended capability, ground externally for single
ended operation.
43
LO_VCC1
45
DESCRIPTION
Synthesizer Positive Power Supply.
Synthesizer Charge Pump Positive Power Supply.
Synthesizer Charge Pump Output, feeds the PLL loop filter.
Synthesizer Lock Detect Output.
LO Buffer Positive Power Supply.
RX_LO_DRIVER Receiver LO Driver Positive Power Supply.
_VCC1
47
TX_MX_IN-
Transmit Mixer Negative Input, internally DC coupled, high impedance input. Designed to share a common IF matching
network/IF SAW filter with the receive mixer. Care should be exercised regarding the PC board layout to avoid
interference and noise pickup. Layout symmetry and management of PC board parasitics is also critical for maximizing
the bandwidth of the IF matching network.
48
RX_MX_OUT-
Receive Mixer Negative Output, open collector, high impedance output. Designed to share a common IF matching
network/IF SAW filter with the transmit mixer. Care should be exercised regarding the PC board layout to avoid
interference and noise pickup. Layout symmetry and management of PC board parasitics is also critical for maximizing
the bandwidth of the IF matching network.
49
RX_MX_OUT+
Receive Mixer Positive Output, open collector, high impedance output. Designed to share a common IF matching
network/IF SAW filter with the transmit mixer. Care should be exercised regarding the PC board layout to avoid
interference and noise pickup. Layout symmetry and management of PC board parasitics is also critical for maximizing
the bandwidth of the IF matching network.
50
TX_MX_IN+
Transmit Mixer Positive Input, internally DC coupled, high impedance input. Designed to share a common IF matching
network/IF SAW filter with the receive mixer. Care should be exercised regarding the PC board layout to avoid
interference and noise pickup. Layout symmetry and management of PC board parasitics is also critical for maximizing
the bandwidth of the IF matching network.
52
RX_MX_IN
Receive Mixer RF Input, internally DC coupled and requires external AC coupling as well as RF matching. The
recommend network consists of a 3.3pF series capacitor followed by a small series inductance of 1.4nH and then a
1.2nH shunt inductor. The series inductance is best implemented on the PC board using a narrow transmission line
inductor.
54
PRE_VCC1
PLL Prescaler Positive Power Supply.
56
ITAT_RES1
Connection to external resistor sets the receive and transmit mixers tail currents, independent of Absolute Temperature.
57
PTAT_RES
Connection to external resistor sets the receive and transmit mixers tail currents, proportional to Absolute Temperature.
58
BIAS2_VCC1
59
ITAT_RES2
61
RF_OUT
63
COL_OUT
All
Others
GND
Bias Positive Power Supply for the receive and transmit mixers.
Connection to external resistor sets the LNA and Preamplifier bias currents, independent of Absolute Temperature.
Low Noise Amplifier RF Output, internally AC coupled and internally matched to 50Ω.
LNA Collector Output, requires a bypass capacitance which is resonant with the PC board parasitics. A small resistance
(20Ω) in series with the main PC board VCC buss is recommended to provide isolation from other VCC bypass
capacitors. This ensures the image rejection performance of the LNA is maintained.
Circuit Ground Pins (Quantity 23 each).
2-3
HFA3683A
Absolute Maximum Ratings
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6V
Voltage on Any Other Pin. . . . . . . . . . . . . . . . . . . -0.3 to VCC +0.3V
VCC to VCC Decouple . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +0.3V
Any GND to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +0.3V
Pins 4, 19, 52, 56, 57 and 59 . . . . . . . . . . . . . . . . . . . . . 0.3 to +0.6V
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
TQFP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
65
Maximum Junction Temperature (Plastic Package) . . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(TQFP - Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to 85oC
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 3.3V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
General Electrical Specifications
TEMP.
(oC)
MIN
Supply Voltage
Full
Receive Total Supply Current (LNA in High Gain)
25
Receive Total Supply Current (LNA in Low Gain)
PARAMETER
TYP
MAX
UNITS
2.7
-
3.3
V
-
33
38
mA
25
-
27
32
mA
Transmit Total Supply Current
25
-
40
45
mA
Standby Total Supply Current (PLL and LO Buffers Active)
25
-
6
8
mA
TX/RX Power Down Supply Current
Full
-
10
100
µA
TX/RX/Power Down Time (Note 2)
Full
-
1
10
µs
RX/TX, TX/RX Switching Time (Note 2)
Full
-
0.2
1
µs
CMOS Low Level Input Voltage (CLK, DATA, LE) (Note 3)
Full
-
-
0.3VDD
V
CMOS High Level Input Voltage (CLK, DATA, LE) (Note 3)
Full
0.7VDD
-
3.6
V
CMOS High or Low Level Input Current (CLK, DATA, LE)
Full
-3.0
-
+3.0
µA
Control Logic Low Level Input Voltage (H/L, PE1, PE2) (Note 4)
Full
-0.3
-
0.5
V
Control Logic High Level Input Voltage (H/L, PE1, PE2) (Notes 3 and 4)
Full
VDD-0.5
-
-
V
NOTES:
2. TX/RX/TX switching time and power Down/Up time are dependent on external components.
3. VDD is the supply voltage of external Control sources.
4. These three pins H/L, PE1 and PE2 are not connected to CMOS circuitry and have different thresholds from all other control pins.
Cascaded LNA/Mixer AC Electrical Specifications
Assumes a direct connection between the LNA and Mixer, IF = 374MHz,
LO = 2075MHz at -6dBm, VCC = 2.7 Unless Otherwise Specified
TEMP.
(oC)
MIN
TYP
MAX
UNITS
RF Frequency Range
Full
2400
-
2500
MHz
IF Frequency Range
Full
280
374
600
MHz
LO Frequency Range
Full
1800
-
2220
MHz
PARAMETER
TEST CONDITIONS
LO Input Drive Level
Single End or Differential
Full
-10
-6
0
dBm
Power/Voltage Gain
High Gain Mode
Full
21.5
25
29
dB
Noise Figure SSB
Full
-
3.7
5.0
dB
Input IP3
Full
-17.5
-11
-
dBm
Input P1dB
Full
-27.5
-22
-
dBm
2-4
HFA3683A
Cascaded LNA/Mixer AC Electrical Specifications
Assumes a direct connection between the LNA and Mixer, IF = 374MHz,
LO = 2075MHz at -6dBm, VCC = 2.7 Unless Otherwise Specified (Continued)
TEMP.
(oC)
MIN
TYP
MAX
UNITS
Full
-9
-5
-1
dB
Noise Figure
25
-
25
-
dB
Output IM3 at -4dBm Input Tones
Full
-42
-40.5
-40
dBc
Input P1dB
Full
-1
+2.5
-
dBm
High Gain Mode
25
1.28
1.65:1
2.0:1
-
Low Gain Mode
25
1.1:1
1.3:1
2.0:1
-
LO 50Ω VSWR
LO = Single End
25
1.4:1
1.4:1
2.0:1
-
Differential IF Output Load
Shared with TX
25
-
200
-
Ω
IF Output Capacitance (Single Ended)
25
-
1.2
-
pF
IF Output Resistance (Single Ended)
25
-
5.5
-
kΩ
LO to Mixer RF Feedthrough (Uncascaded)
25
-
-50
-20
dBm
LO to LNA Input Feedthrough (Cascaded, no filter)
25
-69
-60
-50
dBm
PARAMETER
Power/Voltage Gain
TEST CONDITIONS
Low Gain Mode
LNA Input 50Ω VSWR
Gain Switching Speed at Full Scale - High to Low
±1dB settling
Full
-
0.03
0.1
µs
Gain Switching Speed at Full Scale - Low to High
±1dB settling
Full
-
0.25
0.3
µs
Image Rejection
With Matching Network
25
-
14
-
dB
Cascaded Transmit Mixer AC Electrical Specifications
Assumes a direct connection between the Mixer and Preamplifier,
F = 374MHz, LO = 2075MHz at -6dBm, VCC = 2.7 Unless Otherwise
Specified.
TEMP.
(oC)
MIN
TYP
MAX
UNITS
RF Frequency Range
Full
2400
-
2500
MHz
IF Frequency Range
Full
280
374
600
MHz
LO Frequency Range
Full
1800
-
2220
MHz
Full
21
25
29
dB
SSB Noise Figure
Full
-
10
15
dB
Output IP3
Full
+12
+14
+20
dBm
Output P1dB
Full
+2
+4
+9
dBm
PARAMETER
Power Conversion Gain
TEST CONDITIONS
200Ω In, 50Ω Out
LO Input Drive Level
Full
-10
-6
0
dBm
LO to Transmit Mixer RF Feedthrough (Uncascaded)
Same as RX
25
-
-37
-20
dBm
LO to Transmit Amp. Output Feedthrough
(Uncascaded)
25
-
-45
-30
dBm
LO to Transmit Amp. Output Feedthrough
(Cascaded, no filter)
25
-
-15
-5
dBm
Preamplifier Output 50Ω VSWR
25
-
2.3:1
3.0:1
-
LO 50Ω VSWR
LO = Single End
25
-
1.4:1
2.0:1
-
Differential IF Input Load
Shared with RX
25
-
200
-
Ω
IF Input Capacitance (Single Ended)
25
-
1.1
-
pF
IF Input Resistance (Single Ended)
25
-
0.7
-
kΩ
2-5
HFA3683A
Phase Lock Loop Electrical Specifications (See Notes 5 through 13)
TEMP.
(oC)
MIN
TYP
MAX
UNITS
Operating LO Frequency (32/33 Prescaler)
Full
1800
-
2220
MHz
Operating LO Frequency (64/65 Prescaler)
Full
1800
-
3500
MHz
Reference Oscillator Frequency
Full
-
-
50
MHz
Selectable Prescaler Ratios (P)
Full
32/33
-
64/65
-
Swallow Counter Divide Ratio (A Counter)
Full
0
-
127
-
Programmable Counter Divide Ratio (B Counter)
Full
3
-
2047
-
PARAMETER
TEST CONDITIONS
Reference Counter Divide Ratio (R Counter)
Full
3
-
32767
-
Reference Oscillator Sensitivity, Single or Differential
Sine Inputs
Full
0.5
-
VCC
VPP
Reference Oscillator Sensitivity, CMOS Inputs,
Single Ended or Complimentary
Full
-
CMOS
-
Note 7
Reference Oscillator Duty Cycle
CMOS Inputs
25
40
-
60
%
Charge Pump Sink/Source Current/Tolerance
250µA Selection ±25%
25
0.18
0.25
0.32
mA
Charge Pump Sink/Source Current/Tolerance
500µA Selection ±25%
25
0.375
0.50
0.625
mA
Charge Pump Sink/Source Current/Tolerance
750µA Selection ±25%
25
0.56
0.75
0.94
mA
Charge Pump Sink/Source Current/Tolerance
1mA Selection ±25%
25
0.75
1.0
1.25
mA
Full
-
-
15
%
Charge Pump Sink/Source Mismatch
Charge Pump Output Compliance
Full
0.5
-
VCC2 -0.5
V
Charge Pump Supply Voltage
Full
2.7
-
3.6
V
High Level tCWH
Full
20
-
-
ns
Low Level tCWL
Serial Interface Clock Width
Full
20
-
-
ns
Serial Interface Data/Clk Set-Up Time tCS
Full
20
-
-
ns
Serial Interface Data/Clk Hold Time tCH
Full
10
-
-
ns
Serial Interface Clk/LE Set-Up Time tES
Full
20
-
-
ns
Serial Interface LE Pulse Width tEW
Full
20
-
-
ns
NOTES:
5. The Serial data is clocked on the Rising Edge of the serial clock, MSB first. The serial Interface is active when LE is LOW. The serial Data is
latched into defined registers on the rising edge of LE.
6. As long as power is applied, all register settings will remain stored, including the power down state. The system may then come in and out of the
power down state without requiring the registers to be rewritten.
7. CMOS Reference Oscillator input levels are given in the General Electrical Specification section.
POWER ENABLE TRUTH TABLE
PE1
PE2
PLL_PE
(SERIAL BUS)
0
0
1
Power Down State, Registers in Save Mode, Inactive PLL, Active
Serial Interface
1
1
1
Receive State, Active PLL
1
0
1
Transmit State, Active PLL
0
1
1
Inactive Transmit and Receive States, Active PLL, Active Serial
Interface
X
X
0
Inactive PLL, Disabled PLL Registers, Active Serial Interface
STATUS
NOTE:
8. PLL_PE is controlled via the serial interface, and can be used to disable the synthesizer. The actual synthesizer control is a logic AND function
of PLL_PE and the result of the logic OR function of PE1 and PE2. PE1 and PE2 directly control the power enable functionality of the LO buffers.
2-6
HFA3683A
PLL Synthesizer Table
REGISTER
DEFINITION
SERIAL BITS LSB 1
2
3
4
R Counter
0
0
R(0) R(1) R(2) R(3) R(4) R(5) R(6) R(7) R(8) R(9) R(10) R(11) R(12) R(13) R(14)
A/B Counter
0
1
A(0) A(1) A(2) A(3) A(4) A(5) A(6) B(0) B(1) B(2) B(3)
Operational
Mode
1
0
M(0)
0
5
6
7
8
9
10
11
M(2) M(3) M(4) M(5) M(6) M(7) M(8)
12
0
13
0
14
15
B(4)
B(5)
0
0
16
17
B(6)
B(7)
18
19
MSB
X (Don’t Care)
B(8)
M(13) M(14) M(15)
B(9) B(10)
X
X
Reference Frequency Counter/Divider
BIT
DESCRIPTION
R(0-14)
Least significant bit R(0) to most significant bit R(14) of the divide by R counter. The Reference signal frequency is divided down
by this counter and is compared with a divided LO by a phase detector.
LO Frequency Counters/Dividers
BIT
DESCRIPTION
A(0-6)
Least significant bit A(0) to most significant bit A(6) of a 7-bit Swallow counter and LSB B(0) to MSB B(10) of the 11-bit divider.
The LO frequency is divided down by [P*B+A], where P is the Prescaler divider set by bit M(2). This divided signal frequency is
compared by a phase detector with the divided Reference signal.
B(0-11)
Operational Modes
BIT
DESCRIPTION
M(0)
(PLL_PE), Phase Lock Loop Power Enable. 1 = Enable, 0 = Power Down. Serial port always on.
M(2)
Prescaler Select. 0 = 32/33, 1 = 64/65
M(3)
M(4)
Charge Pump Current Setting
M(5)
M(6)
M(7)
M(8)
M(13)
M(14)
M(15)
Charge Pump Sign
LD Pin Multiplex Operation
Charge Pump Operation/Test
2-7
M(4)
M(3)
0
0
0.25mA
OUTPUT SINK/SOURCE
0
1
0.50mA
1
0
0.75mA
1
1
1.00mA
M(6)
M(5)
0
0
Source Current if LO/ [P*B+A] < Ref/R
0
1
Source Current if LO/ [P*B+A] > Ref/R
M(13)
M(8)
M(7)
0
0
X
Lock Detect Operation
0
1
X
Short to GND
1
0
X
Serial Register Read Back
1
1
0
Ref. Divided by R Waveform
1
1
1
LO Divided by [P*B+A]
Waveform
M(15)
M(14)
0
0
Normal Operation
0
1
Charge Pump Constant Current Source
1
0
Charge Pump Constant Current Sink
1
1
High Impedance State
OUTPUT AT PIN LD
OPERATION/TEST
N COUNTER
RESET
TO LO DIVIDE BY 2 DRIVERS
HFA3683A
DUAL MODULUS
CONTROL
A
P/P+1
R COUNTER
REF_IN
B
R
PRESCALER
RESET
TO
DC OFFSET
CAL
LO_IN+
V
ISOURCE
ISINK
CP_D0
VCONTROL
VCO
FIGURE 1. PLL SIMPLIFIED BLOCK DIAGRAM
DATA
BIT 19
BIT 20: MSB
BIT 10
BIT 9
BIT 1
BIT 1: LSB
CLOCK
tCWL
LE
tCS
tCH
OR
tEW
tCWH
tES
LE
NOTES:
9. Parenthesis data indicates programmable reference divider data.
10. Data shifted into register on clock rising edge.
11. Data is shifted in MSB first.
FIGURE 2. SERIAL DATA INPUT TIMING
2-8
HFA3683A
fR
fP
LD
DO
H
I
I
I
fR < fP
fR < fP
Z
L
fR > fP
fR = fP
fR < fP
NOTES:
12. Phase difference detection range: -2π to +2π .
13. The minimum width pump up and pump down current pulses occur at the DO pin when the loop is locked.
FIGURE 3. PHASE COMPARATOR AND INTERNAL CHARGE PUMP CHARACTERISTICS
2-9
HFA3683A
Typical Evaluation Board Application
RX_MIX_IN
L23
C17
1.2nH
VCC1
3.3pF
C12
R12
C7
0.01µF
C25
1.5K
220pF
R13
0.01µF
R11
R2
20
9.53K
C16
11.5K
C3
L10
0.01µF
3.9pF
39nH
R15
LNA_OUT
1.1K
7.0pF
GND
TX_MX_IN+
RX_MX_OUT+
0.01µF
GND
RX_MX_IN
C2
GND
ITAT_RES2
BIAS2_VCC1
PTAT_RES
ITAT_RES1
GND
PRE_VCC1
C14
GND
COL_OUT
GND
RF_OUT
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
L9
R14
39nH
1.1K
1 GND
VCC1
RX_MX_OUT- 48
2 LNA_VCC1
3 GND
4 RX_IN
LNA_IN
C4
7.0pF
C1
R1
0.01µF
0.5pF
0
8
9
10
11
12
13
7pF
C8
R3
100K
GP1
C10
.01µF
R6
100K
100K
GP2
PE2
47
46
45
44
LO_VCC1
GND
LO_INLO_IN+
43
42
41
40
U1
HFA3683AIN
VCC1
GND 39
TX_LO_DRIVER_VCC1 38
TX_MX_VCC1 37
TX_MX_VCC1 36
TX_MX_VCC1 35
TX_MX_OUT 34
14 GND
15 GND
16 GND
LNA_H/L
R4
H/L
PE2
PE1
TX_VCC1
GND
TXA_OUT
TX_MX_VCC1 33
C29
C40 0.01µF
VCC1
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
C9
7pF
0.01µF
R30
C23
LD
(NO FIT)
C36
PRE_OUT
0.01µF
GND
LD
100K
C38
C39
CP_D0
R5
GND
SYN_VCC2
GND
CP_VCC2
TX_VCC1
GND
TXA_IN
GP3
PE1
DATA
CLK
REF_BY
REF_IN
100pF
GND
LE
C5
5 GND
6 BIAS1_VCC1
7 GND
TX_MX_INGND
RX_LO_DRIVER_VCC1
GND
20K
47pF
0.01µF
VCC2
PRE_IN
C26
1.2pF
1000pF
U6
4
1
C54
2
0.1µF
C33
C53
R16
4.7µF
7pF
VDD
ENB OUT
GND
F4106
3 R10
1.5K
22pF
20K
20K
C21
R8
C6
L1
0.56µH
47pF
C32
1000pF
R26
R25
C20 100pF C22
0
XTAL__VCC
GP4
(NO FIT) (NO FIT)
C19
(NO FIT)
0.1µF
R27
10K
R28
10K
R29
10K
N/C
REF_IN
DATA
LE
(NO FIT)
CLK
GND
UP2
UP1
N/C
2-10
0
HFA3683A
Typical Evaluation Board Application (Continued)
C27
R36
IF_IN/OUT
3.3pF
0
T1
U4
IN
C49
MAX8867
4.7µF
4.7µF
(NO FIT)
C31 3.3pF R9 0
C34
1
GND
BP
D1
0.1µF
SHDN
5
C48
C50
C52
2
0.01µF
VCC_IN
3
+
C51
+
C63
OUT
+
4
0.01µF
4.7µF
0.1µF
C37 220pF
U3 UPC2745TB
C55
2 3 5
1
4
10pF
C56 10pF
6
C58
R33
1000pF
82
R34
U2
TX_MIX_OUT
VCC2
2
C46
3
C47
0.1µF
10pF
VCC
RF
C44
C43
FILTER VALUES
BW
1KHz
C43
0.068µF
C44
0.68µF
R20
1.5K
R21
649
C45
0.01µF
C45
R17
560
300pF
R21
1.74K
EXT_VCO
U5
VCC2
4
C62
R19
4.7µF
56
C61
0.1µF
2-11
(10KHz
DEFAULT)
10kHz
2700pF
0.027µF
3.48K
1.74K
330pF
3
OUT
IN
MAX8867
1
SHDN
5
BP
GND
2
C60
0.1µF
C57
0.01µF
C59
+
2700pF
82
4 5A 5B 5C 5D
3.48K
0.027µF
R35
1
VCONT
GROUND
R20
VCC2
91
ENFVZ5F81
4.7µF
GP5
HFA3683A
Typical Performance Curves
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
SCALE
1dB/DIV
2
3
1
1
2
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
Marker 1 = 2.0GHz, Real = 17.6Ω, Imaginary = 35.2Ω
Marker 2 = 2.45GHz, Real = 18.2Ω, Imaginary = 60.1Ω
Marker 3 = 3.0GHz, Real = 24.6Ω, Imaginary = 82.5Ω
3
Marker 1 = 2.0GHz, 14.9dB
Marker 2 = 2.45GHz, 13.4dB
Marker 3 = 3.0GHz, 9.1dB
FIGURE 4. S11 LNA in HIGH GAIN
FIGURE 5. S21 LNA in HIGH GAIN
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
SCALE
5dB/DIV
3
1
2
3
1
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
Marker 1 = 2.0GHz, -50.3dB
Marker 2 = 2.45GHz, 36.9dB
Marker 3 = 3.0GHz, -32.8dB
2
Marker 1 = 2.0GHz, Real = 25.6Ω, Imaginary = 8.1Ω
Marker 2 = 2.45GHz, Real = 79.5Ω, Imaginary = -30.6Ω
Marker 3 = 3.0GHz, Real = 17.4Ω, Imaginary = -3.2Ω
FIGURE 6. S12 LNA in HIGH GAIN
2-12
FIGURE 7. S22 LNA in HIGH GAIN
HFA3683A
Typical Performance Curves
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
(Continued)
SCALE
2dB/DIV
3
2
1
3
1
2
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
Marker 1 = 2.0GHz, Real = 21.5Ω, Imaginary = 42.5Ω
Marker 2 = 2.45GHz, Real = 20.4Ω, Imaginary = 64.0Ω
Marker 3 = 3.0GHz, Real = 22.6Ω, Imaginary = 87.0Ω
Marker 1 = 2.0GHz, -16.4dB
Marker 2 = 2.45GHz, -16.4dB
Marker 3 = 3.0GHz, -17.2dB
FIGURE 8. S11 LOW GAIN LNA
FIGURE 9. S21 LOW GAIN LNA
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
SCALE
5dB/DIV
3
3
1
2
2
1
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
Marker 1 = 2.0GHz, -16.4dB
Marker 2 = 2.45GHz, 16.5dB
Marker 3 = 3.0GHz, -17.6dB
Marker 1 = 2.0GHz, Real = 29.4Ω, Imaginary = 16.5Ω
Marker 2 = 2.45GHz, Real = 77.7Ω, Imaginary = 22.9Ω
Marker 3 = 3.0, Real = 43.0Ω, Imaginary = 21.7Ω
FIGURE 10. S12 LOW GAIN LNA
2-13
FIGURE 11. S22 LOW GAIN LNA
HFA3683A
Typical Performance Curves
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30dBm
(Continued)
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
3
2
3
2
1
1
Marker 1 = 2.0GHz, Real = 17.4Ω, Imaginary = -14.8Ω
Marker 2 = 4.5GHz, Real = 14.1Ω, Imaginary = 9.8Ω
Marker 3 = 3GHz, Real = 13.1Ω, Imaginary = 33.8Ω
Marker 1 = 2.0GHz, Real = 23.4Ω, Imaginary = 5.9Ω
Marker 2 = 2.45GHz, Real = 59.9Ω, Imaginary = 55.7Ω
Marker 3 = 3.0GHz, Real = 72.4Ω, Imaginary = 12.5Ω
FIGURE 12. S11 RX MIXER
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30dBm
FIGURE 13. S22 TX MIXER
SCALE
1dB/DIV
2
2
3
1
3
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
1
Marker 1 = 2.0GHz, Real = 13.2Ω, Imaginary = 1.2Ω
Marker 2 = 2.45GHz, Real = 11.2Ω, Imaginary = 31.6Ω
Marker 3 = 3.0GHz, Real = 46.6Ω, Imaginary = 21.7Ω
FIGURE 14. S11 PREAMP
2-14
Marker 1 = 2.0GHz, 10.7dB
Marker 2 = 2.45GHz, 15.5dB
Marker 3 - 3.0GHz, 12.5dB
FIGURE 15. S21 PREAMP
HFA3683A
Typical Performance Curves
(Continued)
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
SCALE
5dB/DIV
3
1
3
2
2
1
VCC = 3.30V
RF = 2.0GHz TO 3.0GHz
ROOM TEMP
Pin = -30.dBm
Marker 1 = 2.0GHz, -35.2dB
Marker 2 = 2.45GHz, 30.1dB
Marker 3 = 3.0GHz, -33.3dB
Marker 1 = 2.0GHz, Real = 21.9Ω, Imaginary = 48.0Ω
Marker 2 = 2.45GHz, Real = 53.4Ω, Imaginary = 46.5Ω
Marker 3 = 3.0GHz, Real = 21.4Ω, Imaginary = 54.6Ω
FIGURE 16. S12 PREAMP
FIGURE 17. S22 PREAMP
GAIN 16.5dB AT 2.7V, 15.7dB AT 3.3V
NOISE FIGURE 2.2dB AT 2.7V, 2.7dB AT 3.3V
GAIN 14.3dB AT 2.7V, 13.8dB AT 3.3V
NOISE FIGURE 3.5dB AT 2.7V, 3.9dB AT 3.3V
2.7V
2.7V
3.3V
3.3V
TEMP = -40oC
TEMP = 125oC
GAIN 6dB/DIV
NF 3dB/DIV
GAIN 6dB/DIV
NF 3dB/DIV
3.3V
3.3V
2.7V
2.7V
2.4GHz
2.5GHz
FIGURE 18. LNA HIGH GAIN AND NOISE FIGURE vs SUPPLY
VOLTAGE
2-15
2.4GHz
2.5GHz
FIGURE 19. LNA HIGH GAIN AND NOISE FIGURE vs SUPPLY
VOLTAGE
HFA3683A
Typical Performance Curves
(Continued)
TEMP = 125oC
GAIN -16.7dB AT 2.7V, -15.0dB AT 3.3V
GAIN -13.3dB AT 2.7V, -12.7dB AT 3.3V
3.3V
TEMP = -40oC
3.3V
2.7V
2.7V
GAIN 6dB/DIV
GAIN 6dB/DIV
2.4GHz
2.5GHz
FIGURE 20. LNA LOW GAIN vs SUPPLY VOLTAGE
2.4GHz
2.5GHz
FIGURE 21. LNA LOW GAIN vs SUPPLY VOLTAGE
GAIN AT CURSOR 9.5dB AT 2.7V, 9.6dB AT 3.3V
NOISE FIGURE AT CURSOR 7.0dB AT 2.7V, 6.9dB AT 3.3V
GAIN AT CURSOR 7.5dB AT 2.7V, 7.6dB AT 3.3V
NOISE FIGURE AT CURSOR 8.7dB AT 2.7V, 8.4dB AT 3.3V
3.3V
3.3V
2.7V
2.7V
TEMP = -40oC
GAIN 6dB/DIV
TEMP = 125oC
NF 3dB/DIV
2.7V
2.7V
3.3V
GAIN 6dB/DIV
3.3V
RF 2.4GHz
IF 300MHz
NF 3dB/DIV
RF 2.5GHz
IF 400MHz
FIGURE 22. RX MIXER GAIN AND SSB NOISE FIGURE vs
SUPPLY VOLTAGE
2-16
RF 2.4GHz
IF 300MHz
FIGURE 23. RX MIXER GAIN AND SSB NOISE FIGURE vs
SUPPLY VOLTAGE
RF 2.5GHz
IF 400MHz
HFA3683A
Thin Plastic Quad Flatpack Packages (TQFP)
Q64.10x10 (JEDEC MS-026ACD ISSUE B)
D
64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
D1
-D-
INCHES
-B-
-AE E1
e
PIN 1
SEATING
A PLANE
-H-
0.08
0.003
-C-
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.005
0.05
0.15
-
A2
0.038
0.041
0.95
1.05
-
b
0.007
0.010
0.17
0.27
6
b1
0.007
0.009
0.17
0.23
-
D
0.468
0.476
11.90
12.10
3
D1
0.390
0.397
9.9
10.10
4, 5
E
0.468
0.476
11.9
12.10
3
E1
0.390
0.397
9.9
10.10
4, 5
L
0.018
0.029
0.45
0.75
N
64
64
e
0.020 BSC
0.50 BSC
7
Rev. 0 7/98
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
0.08
M C A-B S
0.003
D S
b
11o-13o
0.020
0.008 MIN
b1
0o MIN
A2 A1
GAGE
PLANE
L
0o-7o
11o-13o
0.25
0.010
0.09/0.16
0.004/0.006
BASE METAL
WITH PLATING
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
7. “N” is the number of terminal positions.
0.09/0.20
0.004/0.008
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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2-17
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